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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:

Patent Number Title Of Patent Date Issued
6540127 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Apr. 1, 2003
6541366 Method for improving a solder bump adhesion bond to a UBM contact layer Apr. 1, 2003
6536105 Method for mounting conductive balls on a substrate Mar. 25, 2003
6536653 One-step bumping/bonding method for forming semiconductor packages Mar. 25, 2003
6537850 Method for fabricating semiconductor components with terminal contacts having alternate electrical paths Mar. 25, 2003
6537851 Method of connecting a bumped compliant conductive trace to a semiconductor chip Mar. 25, 2003
6537854 Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed Mar. 25, 2003
6538214 Method for manufacturing raised electrical contact pattern of controlled geometry Mar. 25, 2003
6538323 Semiconductor device having an electrode structure comprising a conductive fine particle film Mar. 25, 2003
6538329 Semiconductor integrated circuit device and method for making the same Mar. 25, 2003
6534863 Common ball-limiting metallurgy for I/O sites Mar. 18, 2003
6534877 Semiconductor copper bond pad surface protection Mar. 18, 2003
6533160 Device for providing balls or preforms for making flip-chip connections Mar. 18, 2003
6534327 Method for reworking metal layers on integrated circuit bond pads Mar. 18, 2003
6534396 Patterned conductor layer pasivation method with dimensionally stabilized planarization Mar. 18, 2003
6534419 Method and apparatus for reducing IC die mass and thickness while improving strength characteristics Mar. 18, 2003
6531759 Alpha particle shield for integrated circuit Mar. 11, 2003
6531768 Semiconductor integrated circuit device with optical wave guides Mar. 11, 2003
6526655 Angled flying lead wire bonding process Mar. 4, 2003
6527158 Method and apparatus for forming solder bumps Mar. 4, 2003
6527163 Methods of making bondable contacts and a tool for making such contacts Mar. 4, 2003
6528343 Semiconductor device its manufacturing method and electronic device Mar. 4, 2003
6528346 Bump-forming method using two plates and electronic device Mar. 4, 2003
6528349 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability Mar. 4, 2003
6528407 Process for producing electrical-connections on a semiconductor package, and semiconductor package Mar. 4, 2003
6528873 Ball grid assembly with solder columns Mar. 4, 2003
6528881 Semiconductor device utilizing a side wall to prevent deterioration between electrode pad and barrier layer Mar. 4, 2003
6525408 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricatin Feb. 25, 2003
6525424 Semiconductor device and its manufacturing method Feb. 25, 2003
6519842 Method for mounting semiconductor device Feb. 18, 2003
6521478 Method for manufacturing a low-profile semiconductor device Feb. 18, 2003
6521521 Bonding pad structure and method for fabricating the same Feb. 18, 2003
6521970 Chip scale package with compliant leads Feb. 18, 2003
6521995 Wafer-level package Feb. 18, 2003
6521996 Ball limiting metallurgy for input/outputs and methods of fabrication Feb. 18, 2003
6522009 Apparatus to electroless plate a metal layer while eliminating the photo electric effect Feb. 18, 2003
6522016 Interconnection structure with film to increase adhesion of the bump Feb. 18, 2003
6518092 Semiconductor device and method for manufacturing Feb. 11, 2003
6518096 Interconnect assembly and Z-connection method for fine pitch substrates Feb. 11, 2003
6518097 Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive Feb. 11, 2003
6518161 Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die Feb. 11, 2003
6518162 Method for manufacturing a semiconductor device Feb. 11, 2003
6518163 Method for forming bumps, semiconductor device, and solder paste Feb. 11, 2003
6518651 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Feb. 11, 2003
6518664 Semiconductor integrated circuit device and manufacturing method of that Feb. 11, 2003
6518669 Semiconductor device including a pad and a method of manufacturing the same Feb. 11, 2003
6518674 Temporary attach article and method for temporary attach of devices to a substrate Feb. 11, 2003
6514846 Method of fabricating soldering balls for semiconductor encapsulation Feb. 4, 2003
6515358 Integrated passivation process, probe geometry and probing process Feb. 4, 2003
6515373 Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys Feb. 4, 2003

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