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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6579734 Wire bonding method Jun. 17, 2003
6580168 Method for manufacturing a low-profile semiconductor device Jun. 17, 2003
6580169 Method for forming bumps, semiconductor device, and solder paste Jun. 17, 2003
6576381 Semiconductor device Jun. 10, 2003
6576493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps Jun. 10, 2003
6576539 Semiconductor chip assembly with interlocked conductive trace Jun. 10, 2003
6576970 Bonding pad structure of semiconductor device and method for fabricating the same Jun. 10, 2003
6577001 Semiconductor device and the method for manufacturing the same Jun. 10, 2003
6573170 Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device Jun. 3, 2003
6573591 Spherical semiconductor device and method of mounting the same on a substrate Jun. 3, 2003
6573598 Semiconductor device and method of fabricating the same Jun. 3, 2003
6569708 Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same May. 27, 2003
6569752 Semiconductor element and fabricating method thereof May. 27, 2003
6569753 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricatin May. 27, 2003
6569755 Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same May. 27, 2003
6570251 Under bump metalization pad and solder bump connections May. 27, 2003
6571007 Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method May. 27, 2003
6566239 Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating May. 20, 2003
6566261 Semiconductor device and method of manufacturing the same May. 20, 2003
6566752 Bonding pad and method for manufacturing it May. 20, 2003
6566762 Front side coating for bump devices May. 20, 2003
6562217 Method and device for manufacturing conductive particles May. 13, 2003
6562709 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint May. 13, 2003
6563216 Semiconductor device having a bump electrode May. 13, 2003
6558979 Use of palladium in IC manufacturing with conductive polymer bump May. 6, 2003
6559527 Process for forming cone shaped solder for chip interconnection May. 6, 2003
6559545 Semiconductor devices and methods for manufacturing semiconductor devices May. 6, 2003
6555296 Fine pitch wafer bumping process Apr. 29, 2003
6555459 Method of manufacturing a semiconductor device Apr. 29, 2003
6555460 Methods for mask repattern process Apr. 29, 2003
6555469 Chip scale packages Apr. 29, 2003
6555759 Interconnect structure Apr. 29, 2003
6551650 Dip formation of flip-chip solder bumps Apr. 22, 2003
6551854 Semiconductor device having bump electrodes and method of manufacturing the same Apr. 22, 2003
6551856 Method for forming copper pad redistribution and device formed Apr. 22, 2003
6551861 Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive Apr. 22, 2003
6551917 Method of locating conductive spheres utilizing screen and hopper of solder balls Apr. 22, 2003
6551918 Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment Apr. 22, 2003
6551931 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped Apr. 22, 2003
6547124 Method for forming a micro column grid array (CGA) Apr. 15, 2003
6548327 Low cost electroless plating process for single chips and wafer parts and products obtained thereof Apr. 15, 2003
6548386 Method for forming and patterning film Apr. 15, 2003
6548393 Semiconductor chip assembly with hardened connection joint Apr. 15, 2003
6543131 Microelectronic joining processes with temporary securement Apr. 8, 2003
6543267 Apparatus and methods for substantial planarization of solder bumps Apr. 8, 2003
6544813 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment Apr. 8, 2003
6544878 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties Apr. 8, 2003
6544880 Method of improving copper interconnects of semiconductor devices for bonding Apr. 8, 2003
6545355 Semiconductor device and method of fabricating the same Apr. 8, 2003
6539624 Method for forming wafer level package Apr. 1, 2003

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