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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6612027 Method for forming metal contacts on a substrate Sep. 2, 2003
6613663 Method for forming barrier layers for solder bumps Sep. 2, 2003
6613671 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Sep. 2, 2003
6614113 Semiconductor device and method for producing the same Sep. 2, 2003
6609652 Ball bumping substrates, particuarly wafers Aug. 26, 2003
6610558 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate Aug. 26, 2003
6610590 Method of manufacturing a laser impression on a low thermal conductivity layer of a semiconductor device Aug. 26, 2003
6610595 Ball limiting metallurgy for input/outputs and methods of fabrication Aug. 26, 2003
6610601 Bond pad and wire bond Aug. 26, 2003
6607938 Wafer level stack chip package and method for manufacturing same Aug. 19, 2003
6607962 Globally planarized backend compatible thin film resistor contact/interconnect process Aug. 19, 2003
6608374 Semiconductor chip assembly with bumped conductive trace Aug. 19, 2003
6608389 Semiconductor device with stress relieving layer comprising circuit board and electronic instrument Aug. 19, 2003
6604673 Filling device and method for filling balls in the apertures of a ball-receiving element Aug. 12, 2003
6605480 Wafer level packaging for making flip-chips Aug. 12, 2003
6605490 Semiconductor device and production process thereof Aug. 12, 2003
6605522 Method of manufacturing a semiconductor device having a protruding bump electrode Aug. 12, 2003
6605524 Bumping process to increase bump height and to create a more robust bump structure Aug. 12, 2003
6605525 Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed Aug. 12, 2003
6605526 Wirebond passivation pad connection using heated capillary Aug. 12, 2003
6602730 Method for gravitation-assisted control of spread of viscous material applied to a substrate Aug. 5, 2003
6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding Aug. 5, 2003
6602775 Method to improve reliability for flip-chip device for limiting pad design Aug. 5, 2003
6603191 Semiconductor device and method of manufacturing the same Aug. 5, 2003
6603207 Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device Aug. 5, 2003
6599775 Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor Jul. 29, 2003
6599777 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance Jul. 29, 2003
6600171 Semiconductor component and system for fabricating contacts on semiconductor components Jul. 29, 2003
6595404 Method of producing electronic part with bumps and method of producing electronic part Jul. 22, 2003
6595787 Low cost integrated out-of-plane micro-device structures and method of making Jul. 22, 2003
6596611 Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed Jul. 22, 2003
6596618 Increased solder-bump height for improved flip-chip bonding and reliability Jul. 22, 2003
6596621 Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate Jul. 22, 2003
6596622 Semiconductor device having a multi-layer pad and manufacturing method thereof Jul. 22, 2003
6597069 Flip chip metallization Jul. 22, 2003
6597070 Semiconductor device and method of manufacturing the same Jul. 22, 2003
6593220 Elastomer plating mask sealed wafer level package method Jul. 15, 2003
6593221 Selective passivation of exposed silicon Jul. 15, 2003
6590274 Semiconductor wafer and method for manufacturing semiconductor devices Jul. 8, 2003
6590295 Microelectronic device with a spacer redistribution layer via and method of making the same Jul. 8, 2003
6586043 Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps Jul. 1, 2003
6586273 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal Jul. 1, 2003
6586277 Method and structure for manufacturing improved yield semiconductor packaged devices Jul. 1, 2003
6586322 Method of making a bump on a substrate using multiple photoresist layers Jul. 1, 2003
6586323 Method for dual-layer polyimide processing on bumping technology Jul. 1, 2003
6581283 Method for forming pin-form wires and the like Jun. 24, 2003
6583039 Method of forming a bump on a copper pad Jun. 24, 2003
6583049 Semiconductor integrated circuit device and method for making the same Jun. 24, 2003
6583058 Solid hermetic via and bump fabrication Jun. 24, 2003
6583514 Semiconductor device with a binary alloy bonding layer Jun. 24, 2003

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