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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6660624 |
Method for reducing fluorine induced defects on a bonding pad surface |
Dec. 9, 2003 |
| 6660625 |
Method of electroless plating copper on nitride barrier |
Dec. 9, 2003 |
| 6661093 |
Semiconductor device |
Dec. 9, 2003 |
| 6655023 |
Method and apparatus for burning-in semiconductor devices in wafer form |
Dec. 2, 2003 |
| 6656750 |
Method for testing chips on flat solder bumps |
Dec. 2, 2003 |
| 6656828 |
Method of forming bump electrodes |
Dec. 2, 2003 |
| 6656829 |
Semiconductor integrated circuit device and manufacturing method of that |
Dec. 2, 2003 |
| 6657312 |
Semiconductor device in which bump used for fixing potential of silicon substrate can be easily formed |
Dec. 2, 2003 |
| 6651321 |
Microelectronic joining processes |
Nov. 25, 2003 |
| 6653217 |
Method of connecting a conductive trace to a semiconductor chip |
Nov. 25, 2003 |
| 6653218 |
Method of fabricating resin-encapsulated semiconductor device |
Nov. 25, 2003 |
| 6653219 |
Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device |
Nov. 25, 2003 |
| 6653235 |
Fabricating process for forming multi-layered metal bumps by electroless plating |
Nov. 25, 2003 |
| 6653731 |
Semiconductor device and method for fabricating same |
Nov. 25, 2003 |
| 6653742 |
Semiconductor chip assembly with interlocked conductive trace |
Nov. 25, 2003 |
| 6649498 |
Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant |
Nov. 18, 2003 |
| 6649507 |
Dual layer photoresist method for fabricating a mushroom bumping plating structure |
Nov. 18, 2003 |
| 6649533 |
Method and apparatus for forming an under bump metallurgy layer |
Nov. 18, 2003 |
| 6649941 |
Method for manufacturing semiconductor device using group III nitride compound |
Nov. 18, 2003 |
| 6649961 |
Supporting gate contacts over source region on MOSFET devices |
Nov. 18, 2003 |
| 6649999 |
Semiconductor chip configuration with a layer sequence with functional elements contacted by contact pads |
Nov. 18, 2003 |
| 6646347 |
Semiconductor power device and method of formation |
Nov. 11, 2003 |
| 6646357 |
Semiconductor device and method of production of same |
Nov. 11, 2003 |
| 6642079 |
Process of fabricating flip chip interconnection structure |
Nov. 4, 2003 |
| 6642136 |
Method of making a low fabrication cost, high performance, high reliability chip scale package |
Nov. 4, 2003 |
| 6642615 |
Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
Nov. 4, 2003 |
| 6637638 |
System for fabricating solder bumps on semiconductor components |
Oct. 28, 2003 |
| 6638688 |
Selective electroplating method employing annular edge ring cathode electrode contact |
Oct. 28, 2003 |
| 6638785 |
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making |
Oct. 28, 2003 |
| 6638796 |
Method of forming a novel top-metal fuse structure |
Oct. 28, 2003 |
| 6638847 |
Method of forming lead-free bump interconnections |
Oct. 28, 2003 |
| 6638867 |
Method for forming a top interconnection level and bonding pads on an integrated circuit chip |
Oct. 28, 2003 |
| 6635514 |
Compliant package with conductive elastomeric posts |
Oct. 21, 2003 |
| 6632732 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
Oct. 14, 2003 |
| 6630400 |
Method for electroless plating a contact pad |
Oct. 7, 2003 |
| 6630735 |
Insulator/metal bonding island for active-area silver epoxy bonding |
Oct. 7, 2003 |
| 6630742 |
Method for forming bumps, semiconductor device, and solder paste |
Oct. 7, 2003 |
| 6625883 |
Method for making a bump structure |
Sep. 30, 2003 |
| 6627548 |
Process for treating semiconductor substrates |
Sep. 30, 2003 |
| 6627988 |
Semiconductor device and method for manufacturing the same |
Sep. 30, 2003 |
| 6627993 |
Semiconductor device having an electrical contact and a dielectric lining in a contact region |
Sep. 30, 2003 |
| 6624060 |
Method and apparatus for pretreating a substrate prior to electroplating |
Sep. 23, 2003 |
| 6624648 |
Probe card assembly |
Sep. 23, 2003 |
| 6620720 |
Interconnections to copper IC's |
Sep. 16, 2003 |
| 6620722 |
Bumping process |
Sep. 16, 2003 |
| 6621164 |
Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same |
Sep. 16, 2003 |
| 6616967 |
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
Sep. 9, 2003 |
| 6617237 |
Lead-free bump fabrication process |
Sep. 9, 2003 |
| 6617699 |
120 degree bump placement layout for an integrated circuit power grid |
Sep. 9, 2003 |
| 6615485 |
Probe card assembly and kit, and methods of making same |
Sep. 9, 2003 |
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