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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6660624 Method for reducing fluorine induced defects on a bonding pad surface Dec. 9, 2003
6660625 Method of electroless plating copper on nitride barrier Dec. 9, 2003
6661093 Semiconductor device Dec. 9, 2003
6655023 Method and apparatus for burning-in semiconductor devices in wafer form Dec. 2, 2003
6656750 Method for testing chips on flat solder bumps Dec. 2, 2003
6656828 Method of forming bump electrodes Dec. 2, 2003
6656829 Semiconductor integrated circuit device and manufacturing method of that Dec. 2, 2003
6657312 Semiconductor device in which bump used for fixing potential of silicon substrate can be easily formed Dec. 2, 2003
6651321 Microelectronic joining processes Nov. 25, 2003
6653217 Method of connecting a conductive trace to a semiconductor chip Nov. 25, 2003
6653218 Method of fabricating resin-encapsulated semiconductor device Nov. 25, 2003
6653219 Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device Nov. 25, 2003
6653235 Fabricating process for forming multi-layered metal bumps by electroless plating Nov. 25, 2003
6653731 Semiconductor device and method for fabricating same Nov. 25, 2003
6653742 Semiconductor chip assembly with interlocked conductive trace Nov. 25, 2003
6649498 Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant Nov. 18, 2003
6649507 Dual layer photoresist method for fabricating a mushroom bumping plating structure Nov. 18, 2003
6649533 Method and apparatus for forming an under bump metallurgy layer Nov. 18, 2003
6649941 Method for manufacturing semiconductor device using group III nitride compound Nov. 18, 2003
6649961 Supporting gate contacts over source region on MOSFET devices Nov. 18, 2003
6649999 Semiconductor chip configuration with a layer sequence with functional elements contacted by contact pads Nov. 18, 2003
6646347 Semiconductor power device and method of formation Nov. 11, 2003
6646357 Semiconductor device and method of production of same Nov. 11, 2003
6642079 Process of fabricating flip chip interconnection structure Nov. 4, 2003
6642136 Method of making a low fabrication cost, high performance, high reliability chip scale package Nov. 4, 2003
6642615 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument Nov. 4, 2003
6637638 System for fabricating solder bumps on semiconductor components Oct. 28, 2003
6638688 Selective electroplating method employing annular edge ring cathode electrode contact Oct. 28, 2003
6638785 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making Oct. 28, 2003
6638796 Method of forming a novel top-metal fuse structure Oct. 28, 2003
6638847 Method of forming lead-free bump interconnections Oct. 28, 2003
6638867 Method for forming a top interconnection level and bonding pads on an integrated circuit chip Oct. 28, 2003
6635514 Compliant package with conductive elastomeric posts Oct. 21, 2003
6632732 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Oct. 14, 2003
6630400 Method for electroless plating a contact pad Oct. 7, 2003
6630735 Insulator/metal bonding island for active-area silver epoxy bonding Oct. 7, 2003
6630742 Method for forming bumps, semiconductor device, and solder paste Oct. 7, 2003
6625883 Method for making a bump structure Sep. 30, 2003
6627548 Process for treating semiconductor substrates Sep. 30, 2003
6627988 Semiconductor device and method for manufacturing the same Sep. 30, 2003
6627993 Semiconductor device having an electrical contact and a dielectric lining in a contact region Sep. 30, 2003
6624060 Method and apparatus for pretreating a substrate prior to electroplating Sep. 23, 2003
6624648 Probe card assembly Sep. 23, 2003
6620720 Interconnections to copper IC's Sep. 16, 2003
6620722 Bumping process Sep. 16, 2003
6621164 Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same Sep. 16, 2003
6616967 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process Sep. 9, 2003
6617237 Lead-free bump fabrication process Sep. 9, 2003
6617699 120 degree bump placement layout for an integrated circuit power grid Sep. 9, 2003
6615485 Probe card assembly and kit, and methods of making same Sep. 9, 2003

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