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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6747351 Semiconductor device and method of manufacturing of the same Jun. 8, 2004
6747355 Semiconductor device and method for manufacturing the same Jun. 8, 2004
6747472 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same Jun. 8, 2004
6742701 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus Jun. 1, 2004
6743660 Method of making a wafer level chip scale package Jun. 1, 2004
6743707 Bump fabrication process Jun. 1, 2004
6744122 Semiconductor device, method of manufacture thereof, circuit board, and electronic device Jun. 1, 2004
6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same May. 25, 2004
6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly May. 25, 2004
6740577 Method of forming a small pitch torch bump for mounting high-performance flip-flop devices May. 25, 2004
6740811 Electric terminal for an electronic device May. 25, 2004
6741085 Contact carriers (tiles) for populating larger substrates with spring contacts May. 25, 2004
6737353 Semiconductor device having bump electrodes May. 18, 2004
6732908 High density raised stud microjoining system and methods of fabricating the same May. 11, 2004
6732912 Solder ball attaching process May. 11, 2004
6734554 Semiconductor wafer with bumps of uniform height May. 11, 2004
6734568 Semiconductor device and method of manufacturing the same May. 11, 2004
6731003 Wafer-level coated copper stud bumps May. 4, 2004
6731004 Electronic device and method of producing same May. 4, 2004
6727576 Transfer wafer level packaging Apr. 27, 2004
6727593 Semiconductor device with improved bonding Apr. 27, 2004
6723629 Method and apparatus for attaching solder members to a substrate Apr. 20, 2004
6723630 Solder ball fabrication process Apr. 20, 2004
6724084 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Apr. 20, 2004
6724095 Apparatus for aligning an integrated circuit package with an interface Apr. 20, 2004
6720212 Method of eliminating back-end rerouting in ball grid array packaging Apr. 13, 2004
6720243 Bump fabrication method Apr. 13, 2004
6720244 Bump fabrication method Apr. 13, 2004
6720257 Bump with basic metallization and method for manufacturing the basic metallization Apr. 13, 2004
6720661 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument Apr. 13, 2004
6716665 Method of mounting chip onto printed circuit board in shortened working time Apr. 6, 2004
6716669 High-density interconnection of temperature sensitive electronic devices Apr. 6, 2004
6716736 Method for manufacturing an under-bump metallurgy layer Apr. 6, 2004
6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating Apr. 6, 2004
6716739 Bump manufacturing method Apr. 6, 2004
6716754 Methods of forming patterns and molds for semiconductor constructions Apr. 6, 2004
6717243 Semiconductor device and the manufacturing method thereof Apr. 6, 2004
6717245 Chip scale packages performed by wafer level processing Apr. 6, 2004
6712260 Bump reflow method by inert gas plasma Mar. 30, 2004
6713320 Bumping process Mar. 30, 2004
6713377 Method of electroless plating copper on nitride barrier Mar. 30, 2004
6709469 Spacer plate solder ball placement fixture and methods therefor Mar. 23, 2004
6709899 Methods of making microelectronic assemblies having conductive elastomeric posts Mar. 23, 2004
6709963 Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps Mar. 23, 2004
6709965 Aluminum-copper bond pad design and method of fabrication Mar. 23, 2004
6709966 Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device Mar. 23, 2004
6710446 Semiconductor device comprising stress relaxation layers and method for manufacturing the same Mar. 23, 2004
6707161 Optical module package of flip chip bonding Mar. 16, 2004
6706554 Conductor posts, construction for and method of fabricating semiconductor integrated circuit chips using the conductor post, and method of probing semiconductor integrated circuit chips Mar. 16, 2004

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