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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6780744 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components Aug. 24, 2004
6780746 Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom Aug. 24, 2004
6780748 Method of fabricating a wafer level chip size package utilizing a maskless exposure Aug. 24, 2004
6780751 Method for eliminating voiding in plated solder Aug. 24, 2004
6780757 Semiconductor integrated circuit device and method for making the same Aug. 24, 2004
6780770 Method for stacking semiconductor die within an implanted medical device Aug. 24, 2004
6781065 Solder-coated articles useful for substrate attachment Aug. 24, 2004
6781234 Semiconductor device having electrodes containing at least copper nickel phosphorous and tin Aug. 24, 2004
6777314 Method of forming electrolytic contact pads including layers of copper, nickel, and gold Aug. 17, 2004
6777319 Microelectronic spring contact repair Aug. 17, 2004
6778406 Resilient contact structures for interconnecting electronic devices Aug. 17, 2004
6774480 Method and structure for manufacturing improved yield semiconductor packaged devices Aug. 10, 2004
6774495 Solder terminal and fabricating method thereof Aug. 10, 2004
6774026 Structure and method for low-stress concentration solder bumps Aug. 10, 2004
6774027 Semiconductor device and method for manufacturing the same Aug. 10, 2004
6770510 Flip chip process of flux-less no-flow underfill Aug. 3, 2004
6767815 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Jul. 27, 2004
6767817 Asymmetric plating Jul. 27, 2004
6767818 Method for forming electrically conductive bumps and devices formed Jul. 27, 2004
6767819 Apparatus with compliant electrical terminals, and methods for forming same Jul. 27, 2004
6763585 Method for producing micro bump Jul. 20, 2004
6764879 Semiconductor wafer, semiconductor device, and method for manufacturing the same Jul. 20, 2004
6764933 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Jul. 20, 2004
6764935 Stereolithographic methods for fabricating conductive elements Jul. 20, 2004
6765277 Microelectronic fabrication with corrosion inhibited bond pad Jul. 20, 2004
6765293 Electrode structure of a carrier substrate of a semiconductor device Jul. 20, 2004
6765652 Forming thermally curable materials on a support structure in an electronic device Jul. 20, 2004
6759311 Fan out of interconnect elements attached to semiconductor wafer Jul. 6, 2004
6759319 Residue-free solder bumping process Jul. 6, 2004
6759738 Systems interconnected by bumps of joining material Jul. 6, 2004
6759751 Constructions comprising solder bumps Jul. 6, 2004
6756184 Method of making tall flip chip bumps Jun. 29, 2004
6756252 Multilayer laser trim interconnect method Jun. 29, 2004
6756256 Method for preventing burnt fuse pad from further electrical connection Jun. 29, 2004
6756294 Method for improving bump reliability for flip chip devices Jun. 29, 2004
6756305 Stacked dice bonded with aluminum posts Jun. 29, 2004
6756678 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Jun. 29, 2004
6756680 Flip chip C4 extension structure and process Jun. 29, 2004
6753208 Wafer scale method of packaging integrated circuit die Jun. 22, 2004
6753253 Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams Jun. 22, 2004
6753259 Method of improving the bondability between Au wires and Cu bonding pads Jun. 22, 2004
6753605 Passivation scheme for bumped wafers Jun. 22, 2004
6753609 Circuit probing contact pad formed on a bond pad in a flip chip package Jun. 22, 2004
6749760 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead Jun. 15, 2004
6750133 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps Jun. 15, 2004
6750134 Variable cross-section plated mushroom with stud for bumping Jun. 15, 2004
6750135 Method for forming chip scale package Jun. 15, 2004
6750539 Joining semiconductor units with bonding material Jun. 15, 2004
6750547 Multi-substrate microelectronic packages and methods for manufacture Jun. 15, 2004
6750548 Mask repattern process Jun. 15, 2004

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