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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6821877 Method of fabricating metal interconnection of semiconductor device Nov. 23, 2004
6818475 Wafer level package and the process of the same Nov. 16, 2004
6818539 Semiconductor devices and methods of fabricating the same Nov. 16, 2004
6818545 Low fabrication cost, fine pitch and high reliability solder bump Nov. 16, 2004
6818840 Method for manufacturing raised electrical contact pattern of controlled geometry Nov. 16, 2004
6818992 Self-aligned copper silicide formation for improved adhesion/electromigration Nov. 16, 2004
6818996 Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps Nov. 16, 2004
6819002 Under-ball-metallurgy layer Nov. 16, 2004
6815253 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Nov. 9, 2004
6815324 Reliable metal bumps on top of I/O pads after removal of test probe marks Nov. 9, 2004
6815327 Mask repattern process Nov. 9, 2004
6815613 Electronic component with external connection elements Nov. 9, 2004
6815789 Semiconductor electronic device and method of manufacturing thereof Nov. 9, 2004
6812123 Semiconductor devices and methods for manufacturing the same Nov. 2, 2004
6812581 Chip size package with stress relieving internal terminal Nov. 2, 2004
6809020 Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device Oct. 26, 2004
6809414 Semiconductor chip assembly with bumped conductive trace Oct. 26, 2004
6805279 Fluxless bumping process using ions Oct. 19, 2004
6806176 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument Oct. 19, 2004
6806556 SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER HAVING BUMPS, SEMICONDUCTOR CHIP HAVING BUMPS AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND EL Oct. 19, 2004
6806570 Thermal compliant semiconductor chip wiring structure for chip scale packaging Oct. 19, 2004
6806578 Copper pad structure Oct. 19, 2004
6802945 Method of metal sputtering for integrated circuit metal routing Oct. 12, 2004
6803302 Method for forming a semiconductor device having a mechanically robust pad interface Oct. 12, 2004
6803304 Methods for producing electrode and semiconductor device Oct. 12, 2004
6803312 Semiconductor device and method for fabricating the same Oct. 12, 2004
6803327 Cost effective polymide process to solve passivation extrusion or damage and SOG delminates Oct. 12, 2004
6803657 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Oct. 12, 2004
6799711 Minute copper balls and a method for their manufacture Oct. 5, 2004
6800505 Semiconductor device including edge bond pads and related methods Oct. 5, 2004
6800506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly Oct. 5, 2004
6800555 Wire bonding process for copper-metallized integrated circuits Oct. 5, 2004
6798044 Flip chip in leaded molded package with two dies Sep. 28, 2004
6798050 Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same Sep. 28, 2004
6793792 Electroplating methods including maintaining a determined electroplating voltage and related systems Sep. 21, 2004
6794752 Bonding pad structure Sep. 21, 2004
6790759 Semiconductor device with strain relieving bump design Sep. 14, 2004
6791168 Semiconductor package with circuit side polymer layer and wafer level fabrication method Sep. 14, 2004
6787442 Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal Sep. 7, 2004
6787797 Semiconductor wafer and device for semiconductor device manufacturing process Sep. 7, 2004
6787903 Semiconductor device with under bump metallurgy and method for fabricating the same Sep. 7, 2004
6787908 Pad metallization over active circuitry Sep. 7, 2004
6782897 Method of protecting a passivation layer during solder bump formation Aug. 31, 2004
6783801 Methods for making a paste of materials to form bumps for screen print processes Aug. 31, 2004
6784002 Method to make wafer laser marks visable after bumping process Aug. 31, 2004
6784087 Method of fabricating cylindrical bonding structure Aug. 31, 2004
6784088 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped Aug. 31, 2004
6784089 Flat-top bumping structure and preparation method Aug. 31, 2004
6779711 Self-aligned corrosion stop for copper C4 and wirebond Aug. 24, 2004
6780669 Method of forming overmolded chip scale package and resulting product Aug. 24, 2004

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