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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6867122 Redistribution process Mar. 15, 2005
6864167 Wafer scale solder bump fabrication method and structure Mar. 8, 2005
6864168 Bump and fabricating process thereof Mar. 8, 2005
6864172 Manufacturing method of semiconductor device Mar. 8, 2005
6864575 Electronic interface structures and methods Mar. 8, 2005
6861344 Method of manufacturing a semiconductor integrated circuit device Mar. 1, 2005
6861345 Method of disposing conductive bumps onto a semiconductor device Mar. 1, 2005
6861346 Solder ball fabricating process Mar. 1, 2005
6861370 Bump formation method Mar. 1, 2005
6861749 Semiconductor device with bump electrodes Mar. 1, 2005
6858941 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Feb. 22, 2005
6854633 System with polymer masking flux for fabricating external contacts on semiconductor components Feb. 15, 2005
6855577 Semiconductor devices having different package sizes made by using common parts Feb. 15, 2005
6855623 Recessed tape and method for forming a BGA assembly Feb. 15, 2005
6852564 Semiconductor device and method of fabricating the same Feb. 8, 2005
6852572 Method of manufacturing semiconductor device Feb. 8, 2005
6852617 Semiconductor device fabrication method Feb. 8, 2005
6853076 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Feb. 8, 2005
6853078 Semiconductor device and method for fabricating the same Feb. 8, 2005
6848175 Method of forming an out-of-plane structure Feb. 1, 2005
6849477 Method of fabricating and mounting flip chips Feb. 1, 2005
6849533 Method for fabricating microelectronic product with attenuated bond pad corrosion Feb. 1, 2005
6849534 Process of forming bonding columns Feb. 1, 2005
6845901 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Jan. 25, 2005
6846719 Process for fabricating wafer bumps Jan. 25, 2005
6847117 Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer Jan. 25, 2005
6847118 Low temperature solder chip attach structure Jan. 25, 2005
6844253 Selective deposition of solder ball contacts Jan. 18, 2005
6844626 Bond pad scheme for Cu process Jan. 18, 2005
6841853 Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns Jan. 11, 2005
6841872 Semiconductor package and fabrication method thereof Jan. 11, 2005
6841877 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit Jan. 11, 2005
6838769 Dual damascene bond pad structure for lowering stress and allowing circuitry under pads Jan. 4, 2005
6838893 Probe card assembly Jan. 4, 2005
6835643 Method of improving copper interconnects of semiconductor devices for bonding Dec. 28, 2004
6835898 ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF M Dec. 28, 2004
6833316 Semiconductor device including a pad and a method of manufacturing the same Dec. 21, 2004
6831000 Semiconductor device manufacturing method Dec. 14, 2004
6831349 Method of forming a novel top-metal fuse structure Dec. 14, 2004
6828173 Semiconductor device including edge bond pads and methods Dec. 7, 2004
6828643 Bonding pads over input circuits Dec. 7, 2004
6828669 Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof Dec. 7, 2004
6828677 Precision electroplated solder bumps and method for manufacturing thereof Dec. 7, 2004
6828684 Semiconductor device and method of manufacturing the same Dec. 7, 2004
6825065 Method for optical module packaging of flip chip bonding Nov. 30, 2004
6825547 Semiconductor device including edge bond pads Nov. 30, 2004
6825564 Nickel bonding cap over copper metalized bondpads Nov. 30, 2004
6821791 Method for reworking metal layers on integrated circuit bond pads Nov. 23, 2004
6821813 Process for bonding solder bumps to a substrate Nov. 23, 2004
6821876 Fabrication method of strengthening flip-chip solder bumps Nov. 23, 2004

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