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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6908311 Connection terminal and a semiconductor device including at least one connection terminal Jun. 21, 2005
6908784 Method for fabricating encapsulated semiconductor components Jun. 21, 2005
6908841 Support structures for wirebond regions of contact pads over low modulus materials Jun. 21, 2005
6908842 Bumping process Jun. 21, 2005
6905588 Packaging deposition methods Jun. 14, 2005
6905915 Semiconductor device and method of manufacturing the same, and electronic instrument Jun. 14, 2005
6905953 Selective passivation of exposed silicon Jun. 14, 2005
6905954 Method for producing a semiconductor device and corresponding semiconductor device Jun. 14, 2005
6906422 Microelectronic elements with deformable leads Jun. 14, 2005
6906427 CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE, AND ELECTRONIC CIRCUIT COMPONENTS AND METHOD OF MANU Jun. 14, 2005
6902956 Method and structure for manufacturing improved yield semiconductor packaged devices Jun. 7, 2005
6903451 Chip scale packages manufactured at wafer level Jun. 7, 2005
6900079 Method for fabricating a chip scale package using wafer level processing May. 31, 2005
6900110 Chip scale package with compliant leads May. 31, 2005
6900117 Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin May. 31, 2005
6900142 Inhibition of tin oxide formation in lead free interconnect formation May. 31, 2005
6900632 Spin exciting method and magnetic resonance imaging system May. 31, 2005
6900654 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects May. 31, 2005
6897141 Solder terminal and fabricating method thereof May. 24, 2005
6897142 Formation of solder balls having resin member as reinforcement May. 24, 2005
6893943 Method of dividing a semiconductor wafer May. 17, 2005
6894387 Semiconductor element having protruded bump electrodes May. 17, 2005
6894389 Semiconductor device and manufacturing method therefor May. 17, 2005
6894394 Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device May. 17, 2005
6889886 Transfer apparatus for arraying small conductive bumps on substrate and/ or chip May. 10, 2005
6890617 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof May. 10, 2005
6890852 Semiconductor device and manufacturing method of the same May. 10, 2005
6891274 Under-bump-metallurgy layer for improving adhesion May. 10, 2005
6888246 Semiconductor power device with shear stress compensation May. 3, 2005
6888716 On-die de-coupling capacitor using bumps or bars May. 3, 2005
6885104 Semiconductor copper bond pad surface protection Apr. 26, 2005
6885522 Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation Apr. 26, 2005
6881612 Method of bonding a semiconductor element to a substrate Apr. 19, 2005
6881654 Solder bump structure and laser repair process for memory device Apr. 19, 2005
6878396 Micro C-4 semiconductor die and method for depositing connection sites thereon Apr. 12, 2005
6878465 Under bump metallurgy for Lead-Tin bump over copper pad Apr. 12, 2005
6878633 Flip-chip structure and method for high quality inductors and transformers Apr. 12, 2005
6875681 Wafer passivation structure and method of fabrication Apr. 5, 2005
6875683 Method of forming bump Apr. 5, 2005
6876077 Semiconductor device and its manufacturing method Apr. 5, 2005
6871777 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Mar. 29, 2005
6872592 Methods for providing an integrated circuit package with an alignment mechanism Mar. 29, 2005
6872650 Ball electrode forming method Mar. 29, 2005
6872651 Manufacturing a bump electrode with roughened face Mar. 29, 2005
6873046 Chip-scale package and carrier for use therewith Mar. 29, 2005
6873047 Semiconductor device and manufacturing method thereof Mar. 29, 2005
6873056 Electrode-to-electrode bond structure Mar. 29, 2005
6869008 Method of forming bumps Mar. 22, 2005
6869831 Adhesion by plasma conditioning of semiconductor chip surfaces Mar. 22, 2005
6869875 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process Mar. 22, 2005

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