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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6946723 Semiconductor device and manufacturing method thereof Sep. 20, 2005
6946380 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equip Sep. 20, 2005
6941957 Method and apparatus for pretreating a substrate prior to electroplating Sep. 13, 2005
6943056 Semiconductor device manufacturing method and electronic equipment using same Sep. 13, 2005
6943059 Flip chip mounting method of forming a solder bump on a chip pad that is exposed through an opening formed in a polyimide film that includes utilizing underfill to bond the chip to a substrate Sep. 13, 2005
6943101 Manufacturing of a corrosion protected interconnect on a substrate Sep. 13, 2005
6943102 Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board Sep. 13, 2005
6943440 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow Sep. 13, 2005
6939744 Use of palladium in IC manufacturing with conductive polymer bump Sep. 6, 2005
6939790 Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder Sep. 6, 2005
6940160 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument Sep. 6, 2005
6940167 Variable cross-section plated mushroom with stud for bumping Sep. 6, 2005
6940169 Torch bump Sep. 6, 2005
6940175 Semiconductor device in which a plurality of electronic components are combined with each other Sep. 6, 2005
6940177 Semiconductor package and method of preparing same Sep. 6, 2005
6940178 Self-coplanarity bumping shape for flip chip Sep. 6, 2005
6936500 Method for the lateral contacting of a semiconductor chip Aug. 30, 2005
6936525 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof Aug. 30, 2005
6936923 Method to form very a fine pitch solder bump using methods of electroplating Aug. 30, 2005
6937037 Probe card assembly for contacting a device with raised contact elements Aug. 30, 2005
6933216 Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same Aug. 23, 2005
6933614 Integrated circuit die having a copper contact and method therefor Aug. 23, 2005
6929971 Semiconductor device and its manufacturing method Aug. 16, 2005
6929979 Method for packaging semiconductor device Aug. 16, 2005
6930031 Bumping process Aug. 16, 2005
6930388 Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure Aug. 16, 2005
6930389 Under bump metallization structure of a semiconductor wafer Aug. 16, 2005
6926188 Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip Aug. 9, 2005
6926191 Process for fabricating external contacts on semiconductor components Aug. 9, 2005
6927964 Structure for preventing burnt fuse pad from further electrical connection Aug. 9, 2005
6924171 Bilayer wafer-level underfill Aug. 2, 2005
6924553 Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same Aug. 2, 2005
6921018 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Jul. 26, 2005
6921715 Semiconductor package and method of fabricating same Jul. 26, 2005
6921716 Wafer bumping process Jul. 26, 2005
6921976 Semiconductor device including an island-like dielectric member embedded in a conductive pattern Jul. 26, 2005
6919264 Method for the solder-stop structuring of elevations on wafers Jul. 19, 2005
6919634 Solder ball assembly, a method for its manufacture, and a method of forming solder bumps Jul. 19, 2005
6916687 Bump process for flip chip package Jul. 12, 2005
6916731 Ball transferring method and apparatus Jul. 12, 2005
6916732 Method of forming bumps Jul. 12, 2005
6916734 Contact-forming method Jul. 12, 2005
6917106 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps Jul. 12, 2005
6917113 Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly Jul. 12, 2005
6917119 Low fabrication cost, high performance, high reliability chip scale package Jul. 12, 2005
6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods Jul. 5, 2005
6914332 Flip-chip without bumps and polymer for board assembly Jul. 5, 2005
6914333 Wafer level package incorporating dual compliant layers and method for fabrication Jul. 5, 2005
6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes Jun. 28, 2005
6911735 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricatin Jun. 28, 2005

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