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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619309 |
Integrated connection arrangements |
Nov. 17, 2009 |
| 7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby |
Nov. 17, 2009 |
| 7615865 |
Standoff height improvement for bumping technology using solder resist |
Nov. 10, 2009 |
| 7615476 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
Nov. 10, 2009 |
| 7615407 |
Methods and systems for packaging integrated circuits with integrated passive components |
Nov. 10, 2009 |
| 7615405 |
Method for precision assembly of integrated circuit chip packages |
Nov. 10, 2009 |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7612450 |
Semiconductor package including dummy board and method of fabricating the same |
Nov. 3, 2009 |
| 7601628 |
Wire and solder bond forming methods |
Oct. 13, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Sep. 15, 2009 |
| 7585759 |
Technique for efficiently patterning an underbump metallization layer using a dry etch process |
Sep. 8, 2009 |
| 7579213 |
Modified chip attach process |
Aug. 25, 2009 |
| 7572673 |
Wafer level package having a stress relief spacer and manufacturing method thereof |
Aug. 11, 2009 |
| 7569472 |
Method and apparatus of power ring positioning to minimize crosstalk |
Aug. 4, 2009 |
| 7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head |
Aug. 4, 2009 |
| 7569467 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7560373 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby |
Jul. 14, 2009 |
| 7553751 |
Method of forming solder bump with reduced surface defects |
Jun. 30, 2009 |
| 7553750 |
Method for fabricating electrical conductive structure of circuit board |
Jun. 30, 2009 |
| 7550376 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jun. 23, 2009 |
| 7545028 |
Solder ball assembly for a semiconductor device and method of fabricating same |
Jun. 9, 2009 |
| 7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
Jun. 9, 2009 |
| 7541273 |
Method for forming bumps |
Jun. 2, 2009 |
| 7541272 |
Damascene patterning of barrier layer metal for C4 solder bumps |
Jun. 2, 2009 |
| 7538435 |
Wafer structure and bumping process |
May. 26, 2009 |
| 7538020 |
Chip packaging process |
May. 26, 2009 |
| 7534715 |
Methods including fluxless chip attach processes |
May. 19, 2009 |
| 7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer |
May. 5, 2009 |
| 7521287 |
Wire and solder bond forming methods |
Apr. 21, 2009 |
| 7517788 |
System, apparatus, and method for advanced solder bumping |
Apr. 14, 2009 |
| 7514798 |
Arrangement for the protection of three-dimensional structures on wafers |
Apr. 7, 2009 |
| 7514788 |
Structure of mounting electronic component |
Apr. 7, 2009 |
| 7514351 |
Solder ball mounting method and solder ball mounting substrate manufacturing method |
Apr. 7, 2009 |
| 7507655 |
Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device |
Mar. 24, 2009 |
| 7507654 |
Method for mounting electronic element on a circuit board |
Mar. 24, 2009 |
| 7501338 |
Semiconductor package substrate fabrication method |
Mar. 10, 2009 |
| 7501337 |
Dual metal stud bumping for flip chip applications |
Mar. 10, 2009 |
| 7501311 |
Fabrication method of a wafer structure |
Mar. 10, 2009 |
| 7494912 |
Terminal pad structures and methods of fabricating same |
Feb. 24, 2009 |
| 7494844 |
Method for manufacturing substrate with cavity |
Feb. 24, 2009 |
| 7489037 |
Semiconductor device and fabrication method thereof |
Feb. 10, 2009 |
| 7485565 |
Nickel bonding cap over copper metalized bondpads |
Feb. 3, 2009 |
| 7485564 |
Undercut-free BLM process for Pb-free and Pb-reduced C4 |
Feb. 3, 2009 |
| 7485562 |
Method of making multichip wafer level packages and computing systems incorporating same |
Feb. 3, 2009 |
| 7476980 |
Die configurations and methods of manufacture |
Jan. 13, 2009 |
| 7473998 |
Method for forming bump protective collars on a bumped wafer |
Jan. 6, 2009 |
| 7473629 |
Substrate structure having a solder mask and a process for making the same |
Jan. 6, 2009 |
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