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Class Information
Number: 257/E21.507
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60B.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611954 |
Bipolar transistor self-alignment with raised extrinsic base extension and methods of forming same |
Nov. 3, 2009 |
| 7601624 |
Device comprising an ohmic via contact, and method of fabricating thereof |
Oct. 13, 2009 |
| 7598536 |
Semiconductor device having load resistor and method of fabricating the same |
Oct. 6, 2009 |
| 7582554 |
Method for manufacturing semiconductor device |
Sep. 1, 2009 |
| 7575993 |
Method of manufacturing semiconductor device and display device |
Aug. 18, 2009 |
| 7563701 |
Self-aligned contacts for transistors |
Jul. 21, 2009 |
| 7560304 |
Method of making a semiconductor device having multiple die redistribution layer |
Jul. 14, 2009 |
| 7557038 |
Method for fabricating self-aligned contact hole |
Jul. 7, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7557026 |
Contact structure and method of forming the same |
Jul. 7, 2009 |
| 7553762 |
Method for forming metal silicide layer |
Jun. 30, 2009 |
| 7545046 |
Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same |
Jun. 9, 2009 |
| 7541677 |
Semiconductor device comprising through-electrode interconnect |
Jun. 2, 2009 |
| 7538022 |
Method of manufacturing electronic circuit device |
May. 26, 2009 |
| 7537987 |
Semiconductor device manufacturing method |
May. 26, 2009 |
| 7534711 |
System and method for direct etching |
May. 19, 2009 |
| 7534685 |
Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor |
May. 19, 2009 |
| 7524751 |
Method for forming contact hole in semiconductor device |
Apr. 28, 2009 |
| 7518245 |
Contact structure of a semiconductor device |
Apr. 14, 2009 |
| 7514756 |
Semiconductor device with MISFET |
Apr. 7, 2009 |
| 7514314 |
Method of manufacturing semiconductor device and semiconductor memory device |
Apr. 7, 2009 |
| 7482262 |
Method of manufacturing semiconductor device |
Jan. 27, 2009 |
| 7482259 |
Chip structure and process for forming the same |
Jan. 27, 2009 |
| 7479688 |
STI stress modification by nitrogen plasma treatment for improving performance in small width devices |
Jan. 20, 2009 |
| 7476625 |
Method for fabricating semiconductor device |
Jan. 13, 2009 |
| 7476613 |
Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process |
Jan. 13, 2009 |
| 7476610 |
Removable spacer |
Jan. 13, 2009 |
| 7473631 |
Method of forming contact holes in a semiconductor device having first and second metal layers |
Jan. 6, 2009 |
| 7470614 |
Methods for fabricating semiconductor devices and contacts to semiconductor devices |
Dec. 30, 2008 |
| 7470586 |
Memory cell having bar-shaped storage node contact plugs and methods of fabricating same |
Dec. 30, 2008 |
| 7446012 |
Lateral PNP transistor and the method of manufacturing the same |
Nov. 4, 2008 |
| 7442635 |
Method for producing a semiconductor device and resulting device |
Oct. 28, 2008 |
| 7435621 |
Method of fabricating wafer level package |
Oct. 14, 2008 |
| 7427544 |
Semiconductor device and method of manufacturing the same |
Sep. 23, 2008 |
| 7422942 |
Method for fabricating a semiconductor device having an insulation film with reduced water content |
Sep. 9, 2008 |
| 7419878 |
Planarized and silicided trench contact |
Sep. 2, 2008 |
| 7413972 |
Method of forming a metal interconnection line in a semiconductor device using an FSG layer |
Aug. 19, 2008 |
| 7411240 |
Integrated circuits including spacers that extend beneath a conductive line |
Aug. 12, 2008 |
| 7410892 |
Methods of fabricating integrated circuit devices having self-aligned contact structures |
Aug. 12, 2008 |
| 7397130 |
Semiconductor devices with contact holes self-aligned in two directions |
Jul. 8, 2008 |
| 7397073 |
Barrier dielectric stack for seam protection |
Jul. 8, 2008 |
| 7396751 |
Method for manufacturing semiconductor device |
Jul. 8, 2008 |
| 7390737 |
Method for filling a contact hole and integrated circuit arrangement with contact hole |
Jun. 24, 2008 |
| 7381612 |
Method for manufacturing semiconductor device with recess channels and asymmetrical junctions |
Jun. 3, 2008 |
| 7374967 |
Multi-stack chip size packaging method |
May. 20, 2008 |
| 7364957 |
Method and apparatus for semiconductor device with improved source/drain junctions |
Apr. 29, 2008 |
| 7358188 |
Method of forming conductive metal silicides by reaction of metal with silicon |
Apr. 15, 2008 |
| 7341920 |
Method for forming a bipolar transistor device with self-aligned raised extrinsic base |
Mar. 11, 2008 |
| 7338867 |
Semiconductor device having contact pads and method for manufacturing the same |
Mar. 4, 2008 |
| 7335536 |
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices |
Feb. 26, 2008 |
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