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Class Information
Number: 257/E21.507
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.508 Forming solder bumps (epo) 1,929

Patents under this class:

Patent Number Title Of Patent Date Issued
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8664765 Semiconductor device Mar. 4, 2014
8658460 Organic light-emitting display device and method of manufacturing the same Feb. 25, 2014
8614462 Array substrate for organic electroluminescent device and method of fabricating the same Dec. 24, 2013
8592916 Selectively raised source/drain transistor Nov. 26, 2013
8551877 Sidewall and chamfer protection during hard mask removal for interconnect patterning Oct. 8, 2013
8541259 Semiconductor device and manufacturing method thereof Sep. 24, 2013
8535977 Semiconductor device manufacturing method Sep. 17, 2013
8525335 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof Sep. 3, 2013
8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Sep. 3, 2013
8507378 Method and structure for self aligned contact for integrated circuits Aug. 13, 2013
8507375 Alignment tolerant semiconductor contact and method Aug. 13, 2013
8487397 Method for forming self-aligned contact Jul. 16, 2013
8445381 Oxide-nitride stack gate dielectric May. 21, 2013
8445376 Post-etching treatment process for copper interconnecting wires May. 21, 2013
8440557 Method for fabricating a semiconductor device by considering the extinction coefficient during etching of an interlayer insulating film May. 14, 2013
8435876 Method of manufacturing semiconductor device May. 7, 2013
8421175 Wafer level packaged integrated circuit Apr. 16, 2013
8399302 Method of manufacturing semiconductor device Mar. 19, 2013
8368128 Compact field effect transistor with counter-electrode and fabrication method Feb. 5, 2013
8367507 Manufacturing method of semiconductor device Feb. 5, 2013
8350388 Component built-in wiring board and manufacturing method of component built-in wiring board Jan. 8, 2013
8338289 Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole Dec. 25, 2012
8314454 Local interconnect having increased misalignment tolerance Nov. 20, 2012
8309452 Method of forming an inductor on a semiconductor wafer Nov. 13, 2012
8298939 Method for forming conductive contact Oct. 30, 2012
8294283 Semiconductor device and manufacturing method thereof Oct. 23, 2012
8293579 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Oct. 23, 2012
8283249 Local interconnect having increased misalignment tolerance Oct. 9, 2012
8273621 MOS-FET having a channel connection, and method for the production of a MOS-FET having a channel connection Sep. 25, 2012
8263480 Methods for site-selective growth of horizontal nanowires, nanowires grown by the methods and nanodevices comprising the nanowires Sep. 11, 2012
8241963 Recessed pillar structure Aug. 14, 2012
8236691 Method of high aspect ratio plug fill Aug. 7, 2012
8222090 Modular die and mask for semiconductor processing Jul. 17, 2012
8216928 Methods for fabricating semiconductor devices having local contacts Jul. 10, 2012
8212356 Semiconductor device having multi-layered wiring layer and fabrication process thereof Jul. 3, 2012
8164195 Pad structure of semiconductor integrated circuit apparatus Apr. 24, 2012
8163601 Chip-exposed semiconductor device and its packaging method Apr. 24, 2012
8119454 Manufacturing fan-out wafer level packaging Feb. 21, 2012
8115306 Apparatus and method for packaging circuits Feb. 14, 2012
8114741 Oxygen-rich layers underlying BPSG Feb. 14, 2012
8101515 Methods of manufacturing semiconductor devices having contact plugs in insulation layers Jan. 24, 2012
8093705 Dual face package having resin insulating layer Jan. 10, 2012
8088684 Apparatus and method for semiconductor wafer bumping via injection molded solder Jan. 3, 2012
8058733 Self-aligned contact set Nov. 15, 2011
8058730 Semiconductor device having a multilayered interconnection structure Nov. 15, 2011
8021986 Method for producing a transistor with metallic source and drain Sep. 20, 2011
8008179 Methods using silver compositions for micro-deposition direct writing silver conductor lines on photovoltaic wafers Aug. 30, 2011
7998851 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same Aug. 16, 2011

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