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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
5153704 Semiconductor device using annealed bonding wire Oct. 6, 1992
4856699 Driving mechanism for a high-speed wire contacting device Aug. 15, 1989
4744850 Method for bonding an LSI chip on a wiring base May. 17, 1988
4702792 Method of forming fine conductive lines, patterns and connectors Oct. 27, 1987
4692789 Semiconductor apparatus Sep. 8, 1987
4651341 Pattern recognition apparatus and a pattern recognition method Mar. 17, 1987
4636832 Semiconductor device with an improved bonding section Jan. 13, 1987
4580713 Method for bonding an aluminum wire Apr. 8, 1986
4581096 Tape applying device Apr. 8, 1986
4571688 Wire bonding apparatus Feb. 18, 1986
4564734 Wire bonder Jan. 14, 1986
RE31967 Gang bonding interconnect tape for semiconductive devices and method of making same Aug. 13, 1985
4527730 Wire bonding apparatus Jul. 9, 1985
4485957 Wire bonder Dec. 4, 1984
4472730 Semiconductor device having an improved moisture resistance Sep. 18, 1984
4441248 On-line inspection method and system for bonds made to electronic components Apr. 10, 1984
4347964 Wire bonding apparatus Sep. 7, 1982
4086694 Method of making direct metal contact to buried layer May. 2, 1978
4080721 Fabrication of semiconductor device Mar. 28, 1978
4076575 Integrated fabrication method of forming connectors through insulative layers Feb. 28, 1978
4063993 Method of making gang bonding interconnect tape for semiconductive devices Dec. 20, 1977
4017266 Process for making a brazed lead electrode, and product thereof Apr. 12, 1977
3993515 Method of forming raised electrical contacts on a semiconductor device Nov. 23, 1976
3979241 Method of etching films of silicon nitride and silicon dioxide Sep. 7, 1976
3930306 Process for attaching a lead member to a semiconductor device Jan. 6, 1976

1 2 3 4 5 6 7










 
 
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