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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E21.507 |
Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) |
1,494 |
| 257/E21.518 |
Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) |
404 |
| 257/E21.519 |
Involving application of pressure, e.g., thermo-compression bonding (epo) |
325 |
| 257/E21.516 |
Involving automation techniques using film carriers (epo) |
236 |
| 257/E21.509 |
Involving soldering or alloying process, e.g., soldering wires (epo) |
353 |
| 257/E21.514 |
Involving use of conductive adhesive (epo) |
489 |
| 257/E21.517 |
Involving use of electron or laser beam (epo) |
95 |
| 257/E21.515 |
Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) |
38 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7566650 |
Integrated circuit solder bumping system |
Jul. 28, 2009 |
| 7528013 |
Method for fabricating high performance leadframe in electronic package |
May. 5, 2009 |
| 7504285 |
Carrierless chip package for integrated circuit devices, and methods of making same |
Mar. 17, 2009 |
| 7473996 |
Signal transfer film, display apparatus having the same and method of manufacturing the same |
Jan. 6, 2009 |
| 7465655 |
Integrated circuit with substantially perpendicular wire bonds |
Dec. 16, 2008 |
| 7466007 |
Post passivation interconnection schemes on top of IC chip |
Dec. 16, 2008 |
| 7459349 |
Method of forming a stack of semiconductor packages |
Dec. 2, 2008 |
| 7452750 |
Capacitor attachment method |
Nov. 18, 2008 |
| 7435621 |
Method of fabricating wafer level package |
Oct. 14, 2008 |
| 7402459 |
Quad flat no-lead (QFN) chip package assembly apparatus and method |
Jul. 22, 2008 |
| 7393760 |
Method for dicing glass substrate |
Jul. 1, 2008 |
| 7394152 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
Jul. 1, 2008 |
| 7374967 |
Multi-stack chip size packaging method |
May. 20, 2008 |
| 7361988 |
Apparatuses and methods to route line to line |
Apr. 22, 2008 |
| 7361027 |
Contact structure, display device and electronic device |
Apr. 22, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7306974 |
Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies |
Dec. 11, 2007 |
| 7294914 |
Interconnect structure |
Nov. 13, 2007 |
| 7285444 |
Method of manufacturing semiconductor device |
Oct. 23, 2007 |
| 7235429 |
Conductive block mounting process for electrical connection |
Jun. 26, 2007 |
| 7195953 |
Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
Mar. 27, 2007 |
| 7192808 |
Semiconductor device having a lead frame smaller than a semiconductor chip and manufacturing method therefor |
Mar. 20, 2007 |
| 7176058 |
Chip scale package and method of fabricating the same |
Feb. 13, 2007 |
| 7109065 |
Bumped chip carrier package using lead frame and method for manufacturing the same |
Sep. 19, 2006 |
| 7056406 |
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
Jun. 6, 2006 |
| 6994803 |
Ball grid array module |
Feb. 7, 2006 |
| 6954001 |
Semiconductor device including a diffusion layer |
Oct. 11, 2005 |
| 6946725 |
Electronic device having microscopically small contact areas and methods for producing the electronic device |
Sep. 20, 2005 |
| 6935556 |
Method for mounting electronic components on substrates |
Aug. 30, 2005 |
| 6911737 |
Semiconductor device package and method |
Jun. 28, 2005 |
| 6890617 |
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
May. 10, 2005 |
| 6784557 |
Semiconductor device including a diffusion layer formed between electrode portions |
Aug. 31, 2004 |
| 6759271 |
Flip chip type semiconductor device and method of manufacturing the same |
Jul. 6, 2004 |
| 6627478 |
Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction |
Sep. 30, 2003 |
| 6574860 |
Ball grid array module |
Jun. 10, 2003 |
| 6503779 |
Method of manufacturing flip chip type semiconductor device |
Jan. 7, 2003 |
| 6486003 |
Expandable interposer for a microelectronic package and method therefor |
Nov. 26, 2002 |
| 6481616 |
Bump bonding device and bump bonding method |
Nov. 19, 2002 |
| 6383843 |
Using removable spacers to ensure adequate bondline thickness |
May. 7, 2002 |
| 6383841 |
Method for encapsulating with a fixing member to secure an electronic device |
May. 7, 2002 |
| 6380634 |
Conductor wires and semiconductor device using them |
Apr. 30, 2002 |
| 6333207 |
Peelable lead structure and method of manufacture |
Dec. 25, 2001 |
| 6191489 |
Micromechanical layer stack arrangement particularly for flip chip or similar connections |
Feb. 20, 2001 |
| 6144101 |
Flip chip down-bond: method and apparatus |
Nov. 7, 2000 |
| 6121070 |
Flip chip down-bond: method and apparatus |
Sep. 19, 2000 |
| 6099678 |
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor |
Aug. 8, 2000 |
| 5830803 |
Method for filling contact holes using a doctor blade |
Nov. 3, 1998 |
| 5510139 |
Process for assembly and bonding of electronic components on an insulating support |
Apr. 23, 1996 |
| 5402927 |
Adjustable wire tensioning apparatus |
Apr. 4, 1995 |
| 5190206 |
Ultrasonic wire bonding tool and method for self-threading same |
Mar. 2, 1993 |
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