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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7566650 Integrated circuit solder bumping system Jul. 28, 2009
7528013 Method for fabricating high performance leadframe in electronic package May. 5, 2009
7504285 Carrierless chip package for integrated circuit devices, and methods of making same Mar. 17, 2009
7473996 Signal transfer film, display apparatus having the same and method of manufacturing the same Jan. 6, 2009
7465655 Integrated circuit with substantially perpendicular wire bonds Dec. 16, 2008
7466007 Post passivation interconnection schemes on top of IC chip Dec. 16, 2008
7459349 Method of forming a stack of semiconductor packages Dec. 2, 2008
7452750 Capacitor attachment method Nov. 18, 2008
7435621 Method of fabricating wafer level package Oct. 14, 2008
7402459 Quad flat no-lead (QFN) chip package assembly apparatus and method Jul. 22, 2008
7393760 Method for dicing glass substrate Jul. 1, 2008
7394152 Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same Jul. 1, 2008
7374967 Multi-stack chip size packaging method May. 20, 2008
7361988 Apparatuses and methods to route line to line Apr. 22, 2008
7361027 Contact structure, display device and electronic device Apr. 22, 2008
7361531 Methods and apparatus for Flip-Chip-On-Lead semiconductor package Apr. 22, 2008
7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies Dec. 11, 2007
7294914 Interconnect structure Nov. 13, 2007
7285444 Method of manufacturing semiconductor device Oct. 23, 2007
7235429 Conductive block mounting process for electrical connection Jun. 26, 2007
7195953 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein Mar. 27, 2007
7192808 Semiconductor device having a lead frame smaller than a semiconductor chip and manufacturing method therefor Mar. 20, 2007
7176058 Chip scale package and method of fabricating the same Feb. 13, 2007
7109065 Bumped chip carrier package using lead frame and method for manufacturing the same Sep. 19, 2006
7056406 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof Jun. 6, 2006
6994803 Ball grid array module Feb. 7, 2006
6954001 Semiconductor device including a diffusion layer Oct. 11, 2005
6946725 Electronic device having microscopically small contact areas and methods for producing the electronic device Sep. 20, 2005
6935556 Method for mounting electronic components on substrates Aug. 30, 2005
6911737 Semiconductor device package and method Jun. 28, 2005
6890617 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof May. 10, 2005
6784557 Semiconductor device including a diffusion layer formed between electrode portions Aug. 31, 2004
6759271 Flip chip type semiconductor device and method of manufacturing the same Jul. 6, 2004
6627478 Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction Sep. 30, 2003
6574860 Ball grid array module Jun. 10, 2003
6503779 Method of manufacturing flip chip type semiconductor device Jan. 7, 2003
6486003 Expandable interposer for a microelectronic package and method therefor Nov. 26, 2002
6481616 Bump bonding device and bump bonding method Nov. 19, 2002
6383843 Using removable spacers to ensure adequate bondline thickness May. 7, 2002
6383841 Method for encapsulating with a fixing member to secure an electronic device May. 7, 2002
6380634 Conductor wires and semiconductor device using them Apr. 30, 2002
6333207 Peelable lead structure and method of manufacture Dec. 25, 2001
6191489 Micromechanical layer stack arrangement particularly for flip chip or similar connections Feb. 20, 2001
6144101 Flip chip down-bond: method and apparatus Nov. 7, 2000
6121070 Flip chip down-bond: method and apparatus Sep. 19, 2000
6099678 Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor Aug. 8, 2000
5830803 Method for filling contact holes using a doctor blade Nov. 3, 1998
5510139 Process for assembly and bonding of electronic components on an insulating support Apr. 23, 1996
5402927 Adjustable wire tensioning apparatus Apr. 4, 1995
5190206 Ultrasonic wire bonding tool and method for self-threading same Mar. 2, 1993

1 2 3 4 5 6 7

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