Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7898068 Integrated circuit micro-module Mar. 1, 2011
7892962 Nail-shaped pillar for wafer-level chip-scale packaging Feb. 22, 2011
7888793 Device package and methods for the fabrication and testing thereof Feb. 15, 2011
7884485 Semiconductor device interconnect systems and methods Feb. 8, 2011
7879653 Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same Feb. 1, 2011
7880309 Arrangement of stacked integrated circuit dice having a direct electrical connection Feb. 1, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7875970 Integrated circuit package having a castellated heatspreader Jan. 25, 2011
7875546 System and method for preventing metal corrosion on bond pads Jan. 25, 2011
7863722 Stackable semiconductor assemblies and methods of manufacturing such assemblies Jan. 4, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7847316 Semiconductor device and its manufacture Dec. 7, 2010
7843056 Integrated circuit micro-module Nov. 30, 2010
7843021 Double-side mountable MEMS package Nov. 30, 2010
7838338 Fabricating process of thermal enhanced substrate Nov. 23, 2010
7833840 Integrated circuit package system with down-set die pad and method of manufacture thereof Nov. 16, 2010
7829985 BGA package having half-etched bonding pad and cut plating line and method of fabricating same Nov. 9, 2010
7824960 Method of assembling a silicon stack semiconductor package Nov. 2, 2010
7812448 Electronic device including a conductive stud over a bonding pad region Oct. 12, 2010
7799613 Integrated module for data processing system Sep. 21, 2010
7795078 Leadframe package for MEMS microphone assembly Sep. 14, 2010
7795072 Structure and method of high performance two layer ball grid array substrate Sep. 14, 2010
7790512 Molded leadframe substrate semiconductor package Sep. 7, 2010
7781266 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Aug. 24, 2010
7777330 High bandwidth cache-to-processing unit communication in a multiple processor/cache system Aug. 17, 2010
7772105 Semiconductor component with plastic housing, and process for producing the same Aug. 10, 2010
7772047 Method of fabricating a semiconductor die having a redistribution layer Aug. 10, 2010
7768105 Pre-molded clip structure Aug. 3, 2010
7767497 Microelectronic package element and method of fabricating thereof Aug. 3, 2010
7759789 Local area semiconductor cooling system Jul. 20, 2010
7749887 Methods of fluxless micro-piercing of solder balls, and resulting devices Jul. 6, 2010
7743482 Fabricating method of a semiconductor device Jun. 29, 2010
7737546 Surface mountable semiconductor package with solder bonding features Jun. 15, 2010
7736950 Flip chip interconnection Jun. 15, 2010
7736948 Method of manufacturing a plurality of semiconductor devices and carrier substrate Jun. 15, 2010
7732233 Method for making light emitting diode chip package Jun. 8, 2010
7723129 Power semiconductor devices having integrated inductor May. 25, 2010
7692310 Forming a hybrid device Apr. 6, 2010
7687921 High density memory device manufacturing using isolated step pads Mar. 30, 2010
7682877 Substrate based unmolded package Mar. 23, 2010
7674649 Radio frequency identification (RFID) tag lamination process using liner Mar. 9, 2010
7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture Feb. 16, 2010
7659148 Bonding method and apparatus Feb. 9, 2010
7656034 Semiconductor device and method for manufacturing the same Feb. 2, 2010
7622384 Method of making multi-chip electronic package with reduced line skew Nov. 24, 2009
7615405 Method for precision assembly of integrated circuit chip packages Nov. 10, 2009
7605051 Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same Oct. 20, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7582513 Electronic device and method for producing electronic devices Sep. 1, 2009
7582553 Method of bonding flying leads Sep. 1, 2009

1 2 3 4 5 6 7










 
 
  Recently Added Patents
Pluggable power cell for an inverter
Apparatus and method for multiple pagings in broadband wireless communication system
Uplink synchronization management in wireless networks
Compound semiconductor epitaxial structure and method for fabricating the same
Base station apparatus and communication control method
Method and apparatus for re-routing calls in a packet network during failures
Vertical axis wind turbines
  Randomly Featured Patents
Processes for coating sewing thread
Lipopolyamines, their preparation and their use
Blind equalization algorithm with the joint use of the constant R and the sliced symbols
Ski simulating exercise machine
Temperature controller for providing a rapid initial heating cycle using a variable reference voltage
Variable weight playball
Urine meter and drainage bag combination
Multiple interchangeable carrier attachment system
Method and apparatus for spur and helical gear manufacture
Method and apparatus for rasterizing in a hierarchical tile order