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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8138079 Method of wire bonding over active area of a semiconductor circuit Mar. 20, 2012
8130526 Programming a microchip ID register Mar. 6, 2012
8124457 Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element Feb. 28, 2012
8124449 Device including a semiconductor chip and metal foils Feb. 28, 2012
8120170 Integrated package circuit with stiffener Feb. 21, 2012
8120921 Device having electronic components mounted therein and method for manufacturing such device Feb. 21, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8115287 Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof Feb. 14, 2012
8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Feb. 7, 2012
8110916 Chip package structure and manufacturing methods thereof Feb. 7, 2012
8106496 Semiconductor packaging system with stacking and method of manufacturing thereof Jan. 31, 2012
8106510 Nano-tube thermal interface structure Jan. 31, 2012
8102038 Semiconductor chip attach configuration having improved thermal characteristics Jan. 24, 2012
8097491 Chip structure having redistribution layer and fabrication method thereof Jan. 17, 2012
8097495 Die package with asymmetric leadframe connection Jan. 17, 2012
8097952 Electronic package structure having conductive strip and method Jan. 17, 2012
8080885 Integrated circuit packaging system with multi level contact and method of manufacture thereof Dec. 20, 2011
8076181 Lead plating technique for singulated IC packages Dec. 13, 2011
8072053 Leadless integrated circuit package having electrically routed contacts Dec. 6, 2011
8071470 Wafer level package using stud bump coated with solder Dec. 6, 2011
8071438 Semiconductor circuit Dec. 6, 2011
8071426 Method and apparatus for no lead semiconductor package Dec. 6, 2011
8067273 Self locking and aligning clip structure for semiconductor die package Nov. 29, 2011
8058105 Method of fabricating a packaging structure Nov. 15, 2011
8058104 Reversible leadless package and methods of making and using same Nov. 15, 2011
8058099 Method of fabricating a two-sided die in a four-sided leadframe based package Nov. 15, 2011
8043895 Method of fabricating stacked assembly including plurality of stacked microelectronic elements Oct. 25, 2011
8043898 Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer Oct. 25, 2011
8044501 Contact structure, display device and electronic device Oct. 25, 2011
8039320 Optimized circuit design layout for high performance ball grid array packages Oct. 18, 2011
8039944 Electrical connection device and assembly method thereof Oct. 18, 2011
8035204 Large die package structures and fabrication method therefor Oct. 11, 2011
8034665 Microelectronic package with thermal access Oct. 11, 2011
8021919 Method of manufacturing a semiconductor device Sep. 20, 2011
8021927 Die down ball grid array packages and method for making same Sep. 20, 2011
8017410 Power semiconductor devices having integrated inductor Sep. 13, 2011
8017445 Warpage-compensating die paddle design for high thermal-mismatched package construction Sep. 13, 2011
8008132 Etched surface mount islands in a leadframe package Aug. 30, 2011
8008124 Adhesive film for semiconductor and semiconductor device using the adhesive film Aug. 30, 2011
8003446 Flexible diode package and method of manufacturing Aug. 23, 2011
8004070 Wire-free chip module and method Aug. 23, 2011
7998853 Semiconductor device with through substrate vias Aug. 16, 2011
7999371 Heat spreader package and method Aug. 16, 2011
7999374 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Aug. 16, 2011
7989356 Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability Aug. 2, 2011
7943433 Method of manufacturing semiconductor device May. 17, 2011
7939380 Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure May. 10, 2011
7932591 Stacked semiconductor package having flexible circuit board therein Apr. 26, 2011
7919361 Semiconductor package with position member Apr. 5, 2011
7910403 Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same Mar. 22, 2011

1 2 3 4 5 6 7

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