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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8310044 Semiconductor device and method of manufacturing the same Nov. 13, 2012
8309401 Method of manufacturing non-leaded package structure Nov. 13, 2012
8298860 Methods for forming a bonded semiconductor substrate including a cooling mechanism Oct. 30, 2012
8298862 Method of manufacturing layered chip package Oct. 30, 2012
8298869 Resin package and production method thereof Oct. 30, 2012
8294283 Semiconductor device and manufacturing method thereof Oct. 23, 2012
8293587 Multilayer pillar for reduced stress interconnect and method of making same Oct. 23, 2012
8293573 Microarray package with plated contact pedestals Oct. 23, 2012
8288863 Semiconductor package device with a heat dissipation structure and the packaging method thereof Oct. 16, 2012
8283212 Method of making a copper wire bond package Oct. 9, 2012
8278753 Semiconductor device and production method thereof Oct. 2, 2012
8278150 Stackable packages for three-dimensional packaging of semiconductor dice Oct. 2, 2012
8268671 Semiconductor system-in-package and methods for making the same Sep. 18, 2012
8268676 Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads Sep. 18, 2012
8268719 Sprocket opening alignment process and apparatus for multilayer solder decal Sep. 18, 2012
8264084 Solder-top enhanced semiconductor device for low parasitic impedance packaging Sep. 11, 2012
8258635 Implantable microelectronic device and method of manufacture Sep. 4, 2012
8258620 Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module Sep. 4, 2012
8258608 Lead frame and intermediate product of semiconductor device Sep. 4, 2012
8253247 Semiconductor device and method for manufacturing the same Aug. 28, 2012
8252635 Electronic system modules and method of fabrication Aug. 28, 2012
8252632 Semiconductor device and manufacturing method of the same Aug. 28, 2012
8252629 Method for making a stackable package Aug. 28, 2012
8247247 Method of manufacturing LED module Aug. 21, 2012
8241965 Integrated circuit packaging system with pad connection and method of manufacture thereof Aug. 14, 2012
8242007 Semiconductor device formed using single polysilicon process and method of fabricating the same Aug. 14, 2012
8237256 Integrated package Aug. 7, 2012
8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof Aug. 7, 2012
8236620 Method of manufacturing a semiconductor device Aug. 7, 2012
8236617 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Aug. 7, 2012
8232183 Process and apparatus for wafer-level flip-chip assembly Jul. 31, 2012
8222090 Modular die and mask for semiconductor processing Jul. 17, 2012
8222088 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method Jul. 17, 2012
8216880 Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer Jul. 10, 2012
8217502 Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof Jul. 10, 2012
8211746 Integrated circuit packaging system with lead frame and method of manufacture thereof Jul. 3, 2012
8212342 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Jul. 3, 2012
8207021 Low noise high thermal conductivity mixed signal package Jun. 26, 2012
8193037 Integrated circuit packaging system with pad connection and method of manufacture thereof Jun. 5, 2012
8193041 Semiconductor device and manufacturing method of the same Jun. 5, 2012
8193620 Integrated circuit package with enlarged die paddle Jun. 5, 2012
8187920 Integrated circuit micro-module May. 29, 2012
8178395 Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via May. 15, 2012
8178936 Double-side mountable MEMS package May. 15, 2012
8178971 Semiconductor device and method of manufacturing the same May. 15, 2012
8168475 Semiconductor package formed within an encapsulation May. 1, 2012
8163643 Enhanced pad design for solder attach devices Apr. 24, 2012
8163601 Chip-exposed semiconductor device and its packaging method Apr. 24, 2012
8163598 Clipless integrated heat spreader process and materials Apr. 24, 2012
8153473 Module having a stacked passive element and method of forming the same Apr. 10, 2012

1 2 3 4 5 6 7

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