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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8492883 Semiconductor package having a cavity structure Jul. 23, 2013
8492887 Integrated circuit packaging system with leadframe and method of manufacture thereof Jul. 23, 2013
8486766 Method for thermally contacting opposing electrical connections of a semiconductor component arrangement Jul. 16, 2013
8487431 Semiconductor integrated circuit having a multi-chip structure Jul. 16, 2013
8482118 Integrated circuit micro-module Jul. 9, 2013
8476720 Systems and methods for vertically stacking a sensor on an integrated circuit chip Jul. 2, 2013
8471373 Resin-sealed semiconductor device and method for fabricating the same Jun. 25, 2013
8466545 Stackable semiconductor package Jun. 18, 2013
8455303 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method Jun. 4, 2013
8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same May. 28, 2013
8445375 Method for manufacturing a semiconductor component May. 21, 2013
8440506 Microelectronic package and method for a compression-based mid-level interconnect May. 14, 2013
8431436 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding Apr. 30, 2013
8426742 Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package Apr. 23, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8420430 Fabrication method of package structure having MEMS element Apr. 16, 2013
8415781 Electronic component and method for manufacturing the same Apr. 9, 2013
8415791 Semiconductor device and fabrication method therefor Apr. 9, 2013
8415802 Strip conductor structure for minimizing thermomechanical loads Apr. 9, 2013
8410598 Semiconductor package and method of manufacturing the same Apr. 2, 2013
8410590 Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer Apr. 2, 2013
8409978 Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe Apr. 2, 2013
8409931 Method of manufacturing semiconductor device Apr. 2, 2013
8409919 Method for manufacturing semiconductor device Apr. 2, 2013
8404520 Package-on-package assembly with wire bond vias Mar. 26, 2013
8405196 Chips having rear contacts connected by through vias to front contacts Mar. 26, 2013
8399302 Method of manufacturing semiconductor device Mar. 19, 2013
8395214 Floating body field-effect transistors, and methods of forming floating body field-effect transistors Mar. 12, 2013
8389337 Patch on interposer assembly and structures formed thereby Mar. 5, 2013
8390109 Chip package with plank stack of semiconductor dies Mar. 5, 2013
8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Feb. 19, 2013
8367479 Semiconductor device and manufacturing method thereof Feb. 5, 2013
8361757 Semiconductor device assembly and method thereof Jan. 29, 2013
8361839 Structure and method for power field effect transistor Jan. 29, 2013
8362601 Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof Jan. 29, 2013
8362604 Ferroelectric tunnel FET switch and memory Jan. 29, 2013
8354303 Thermally enhanced low parasitic power semiconductor package Jan. 15, 2013
8350364 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly Jan. 8, 2013
8338940 Semiconductor device Dec. 25, 2012
8338938 Chip package device and manufacturing method thereof Dec. 25, 2012
8338922 Molded leadframe substrate semiconductor package Dec. 25, 2012
8338828 Semiconductor package and method of testing same Dec. 25, 2012
8334149 Mechanical coupling in a multi-chip module using magnetic components Dec. 18, 2012
8334172 Manufacturing method of semiconductor device Dec. 18, 2012
8324026 Method for manufacturing a semiconductor component Dec. 4, 2012
8324020 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Dec. 4, 2012
8318535 Method of fabricating a memory card using SiP/SMT hybrid technology Nov. 27, 2012
8318540 Method of manufacturing a semiconductor structure Nov. 27, 2012
8318541 Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die Nov. 27, 2012

1 2 3 4 5 6 7

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