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Class Information
Number: 257/E21.506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/60.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.507 Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) 1,494
257/E21.518 Involving application of mechanical vibration, e.g., ultrasonic vibration (epo) 404
257/E21.519 Involving application of pressure, e.g., thermo-compression bonding (epo) 325
257/E21.516 Involving automation techniques using film carriers (epo) 236
257/E21.509 Involving soldering or alloying process, e.g., soldering wires (epo) 353
257/E21.514 Involving use of conductive adhesive (epo) 489
257/E21.517 Involving use of electron or laser beam (epo) 95
257/E21.515 Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo) 38

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8692377 Integrated circuit packaging system with plated leads and method of manufacture thereof Apr. 8, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8673687 Etched hybrid die package Mar. 18, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8653670 Electrical interconnect for an integrated circuit package and method of making same Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8643192 Integrated circuit package with discrete components surface mounted on exposed side Feb. 4, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8629053 Plasma treatment for semiconductor devices Jan. 14, 2014
8629002 Manufacturing method of semiconductor device Jan. 14, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8618657 Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same Dec. 31, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8597988 System for flash-free overmolding of led array substrates Dec. 3, 2013
8598697 Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module Dec. 3, 2013
8592970 Multichip electronic packages and methods of manufacture Nov. 26, 2013
8586419 Semiconductor packages including die and L-shaped lead and method of manufacture Nov. 19, 2013
8586421 Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance Nov. 19, 2013
8575756 Power package module with low and high power chips and method for fabricating the same Nov. 5, 2013
8569110 Pre-bonded substrate for integrated circuit package and method of making the same Oct. 29, 2013
8569161 Semiconductor device with copper wirebond sites and methods of making same Oct. 29, 2013
8564141 Chip unit and stack package having the same Oct. 22, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8552541 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same Oct. 8, 2013
8546191 Disposing underfill in an integrated circuit structure Oct. 1, 2013
8546950 Semiconductor package and manufacturing method thereof Oct. 1, 2013
8541259 Semiconductor device and manufacturing method thereof Sep. 24, 2013
8541261 Method for manufacturing a package-on-package type semiconductor device Sep. 24, 2013
8541262 Die edge contacts for semiconductor devices Sep. 24, 2013
8535986 Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame Sep. 17, 2013
8535982 Providing an automatic optical inspection feature for solder joints on semiconductor packages Sep. 17, 2013
8530920 Packaging structure for plural bare chips Sep. 10, 2013
8531019 Heat dissipation methods and structures for semiconductor device Sep. 10, 2013
8526186 Electronic assembly including die on substrate with heat spreader having an open window on the die Sep. 3, 2013
8525321 Conductive chip disposed on lead semiconductor package Sep. 3, 2013
8525309 Flip-chip QFN structure using etched lead frame Sep. 3, 2013
8525306 Semiconductor device and method of manufacturing the same Sep. 3, 2013
8518815 Methods, devices, and materials for metallization Aug. 27, 2013
8519534 Microsprings partially embedded in a laminate structure and methods for producing same Aug. 27, 2013
8513814 Buffer pad in solder bump connections and methods of manufacture Aug. 20, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8513108 Apparatus, system, and method for wireless connection in integrated circuit packages Aug. 20, 2013
8507325 Co-axial restraint for connectors within flip-chip packages Aug. 13, 2013
8508032 Chip packaging Aug. 13, 2013
8501545 Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime Aug. 6, 2013
8501547 Implantable microelectronic device and method of manufacture Aug. 6, 2013
8502363 Semiconductor device packages with solder joint enhancement element and related methods Aug. 6, 2013
8497160 Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance Jul. 30, 2013

1 2 3 4 5 6 7

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