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Class Information
Number: 257/E21.505
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Insulative mounting semiconductor device on support (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/58.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8692265 Lighting device Apr. 8, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8637984 Multi-chip package with pillar connection Jan. 28, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8623704 Adhesive/spacer island structure for multiple die package Jan. 7, 2014
8609469 Method of manufacturing semiconductor device Dec. 17, 2013
8592963 Self-aligning structures and method for integrated chips Nov. 26, 2013
8592950 Semiconductor device and method of forming through vias with reflowed conductive material Nov. 26, 2013
8592258 Semiconductor package and method of attaching semiconductor dies to substrates Nov. 26, 2013
8575744 Semiconductor device and lead frame thereof Nov. 5, 2013
8563420 Multilayer printed wiring board Oct. 22, 2013
8557638 Integrated circuit packaging system with pad connection and method of manufacture thereof Oct. 15, 2013
8535977 Semiconductor device manufacturing method Sep. 17, 2013
8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Sep. 3, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8507324 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages Aug. 13, 2013
8501536 Integrating and aligning laser chips on sliders for HAMR applications Aug. 6, 2013
8492242 Dry flux bonding device and method Jul. 23, 2013
8476117 Methods and apparatus for a stacked-die interposer Jul. 2, 2013
8476135 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Jul. 2, 2013
8450825 Semiconductor package May. 28, 2013
8440546 Methods and devices for fabricating and assembling printable semiconductor elements May. 14, 2013
8435823 Solid-state imaging device and method of manufacturing the same May. 7, 2013
8420446 Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member Apr. 16, 2013
8419888 Method and apparatus for mounting electric component Apr. 16, 2013
8409928 Method for making contactless portable objects Apr. 2, 2013
8404519 Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns Mar. 26, 2013
8404525 Semiconductor device, manufacturing method of semiconductor device, and RFID tag Mar. 26, 2013
8399985 Mold design and semiconductor package Mar. 19, 2013
8399970 Semiconductor device attached to island having protrusion Mar. 19, 2013
8377748 Method of manufacturing cooling fin and package substrate with cooling fin Feb. 19, 2013
8350388 Component built-in wiring board and manufacturing method of component built-in wiring board Jan. 8, 2013
8343808 Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry Jan. 1, 2013
8338922 Molded leadframe substrate semiconductor package Dec. 25, 2012
8313984 Die substrate with reinforcement structure Nov. 20, 2012
8298874 Packaged electronic devices having die attach regions with selective thin dielectric layer Oct. 30, 2012
8299608 Enhanced thermal management of 3-D stacked die packaging Oct. 30, 2012
8283208 Method and apparatus for fabricating integrated circuit device using self-organizing function Oct. 9, 2012
8278145 Method for packaging semiconductor device Oct. 2, 2012
8273644 Soldering method and method of manufacturing semiconductor device including soldering method Sep. 25, 2012
8264046 Synergy effect of alloying materials in interconnect structures Sep. 11, 2012
8252628 Semiconductor device and method of manufacturing the same Aug. 28, 2012
8252633 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Aug. 28, 2012
8247269 Wafer level embedded and stacked die power system-in-package packages Aug. 21, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8225499 Method for manufacturing a circuit board structure, and a circuit board structure Jul. 24, 2012
8216883 Method for manufacturing semiconductor package system with die support pad Jul. 10, 2012
8193092 Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices Jun. 5, 2012

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