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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6563209 Lead frame for semiconductor device May. 13, 2003
6558980 Plastic molded type semiconductor device and fabrication process thereof May. 6, 2003
6558982 Semiconductor device manufacturing method and mold die May. 6, 2003
6560122 Chip package with molded underfill May. 6, 2003
6554598 Mold assembly for encapsulating semiconductor device Apr. 29, 2003
6555924 Semiconductor package with flash preventing mechanism and fabrication method thereof Apr. 29, 2003
6551858 Method of producing a semiconductor device having two semiconductor chips sealed by a resin Apr. 22, 2003
6551862 Semiconductor device and method of manufacturing the same Apr. 22, 2003
6552263 Method of injection molded flip chip encapsulation Apr. 22, 2003
6552428 Semiconductor package having an exposed heat spreader Apr. 22, 2003
6548764 Semiconductor packages and methods for making the same Apr. 15, 2003
6548911 Multimedia chip package Apr. 15, 2003
6544466 Surface modification method for molds used during semiconductor device fabrication Apr. 8, 2003
6544814 Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured thereby Apr. 8, 2003
6544816 Method of encapsulating thin semiconductor chip-scale packages Apr. 8, 2003
6545349 Semiconductor device Apr. 8, 2003
6545368 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device Apr. 8, 2003
6541307 Multimedia chip package Apr. 1, 2003
6541310 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Apr. 1, 2003
6541874 Encapsulation of microelectronic assemblies Apr. 1, 2003
6537051 Encapsulation mold with a castellated inner surface Mar. 25, 2003
6537853 Overmolding encapsulation process Mar. 25, 2003
6537858 Method for manufacturing semiconductor device Mar. 25, 2003
6538311 Two-stage transfer molding method to encapsulate MMC module Mar. 25, 2003
6538317 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same Mar. 25, 2003
6538321 Heat sink with collapse structure and semiconductor package with heat sink Mar. 25, 2003
6534337 Lead frame type plastic ball grid array package with pre-assembled ball type contacts Mar. 18, 2003
6534338 Method for molding semiconductor package having a ceramic substrate Mar. 18, 2003
6530764 Mold for resin-sealing of semiconductor devices Mar. 11, 2003
6531083 Sproutless pre-packaged molding for component encapsulation Mar. 11, 2003
6531770 Electronic part unit attached to a circuit board and including a cover member covering the electronic part Mar. 11, 2003
6528000 Molding apparatus for use in manufacture of resin shielding semiconductor device Mar. 4, 2003
6528354 Method of manufacturing a semiconductor device Mar. 4, 2003
6528722 Ball grid array semiconductor package with exposed base layer Mar. 4, 2003
6523254 Method for gate blocking x-outs during a molding process Feb. 25, 2003
6523803 Mold apparatus used during semiconductor device fabrication Feb. 25, 2003
6524960 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device Feb. 25, 2003
6525421 Molded integrated circuit package Feb. 25, 2003
6521980 Controlling packaging encapsulant leakage Feb. 18, 2003
6518186 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device Feb. 11, 2003
6518654 Packages for semiconductor die Feb. 11, 2003
6518678 Apparatus and method for reducing interposer compression during molding process Feb. 11, 2003
6515356 Semiconductor package and method for fabricating the same Feb. 4, 2003
6512287 Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus Jan. 28, 2003
6511864 Method of fabricating semiconductor device Jan. 28, 2003
6508970 Liquid transfer molding system for encapsulating semiconductor integrated circuits Jan. 21, 2003
6503433 Liquid transfer molding system for encapsulating semiconductor integrated circuits Jan. 7, 2003
6503781 Molded ball grid array Jan. 7, 2003
6501184 Semiconductor package and method for manufacturing the same Dec. 31, 2002
6497837 Method using a saw tooth mold Dec. 24, 2002

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