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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6639306 Semiconductor package having a die pad with downward-extended tabs Oct. 28, 2003
6632704 Molded flip chip package Oct. 14, 2003
6633077 Semiconductor device and method for manufacturing the same Oct. 14, 2003
6633080 Semiconductor device Oct. 14, 2003
6629351 Apparatus and method for separating cull in a package assembly process Oct. 7, 2003
6630374 Resin sealing method and resin sealing apparatus Oct. 7, 2003
6626656 Apparatus for encasing array packages Sep. 30, 2003
6627481 Method of manufacturing a semiconductor package with a lead frame having a support structure Sep. 30, 2003
6627976 Leadframe for semiconductor package and mold for molding the same Sep. 30, 2003
6627997 Semiconductor module and method of mounting Sep. 30, 2003
6624058 Semiconductor device and method for producing the same Sep. 23, 2003
6616880 Method for encasing array packages Sep. 9, 2003
6617200 System and method for fabricating a semiconductor device Sep. 9, 2003
6617524 Packaged integrated circuit and method therefor Sep. 9, 2003
6617525 Molded stiffener for flexible circuit molding Sep. 9, 2003
6617673 Memory card Sep. 9, 2003
6617680 Chip carrier, semiconductor package and fabricating method thereof Sep. 9, 2003
6617786 Electronic device encapsulated directly on a substrate Sep. 9, 2003
6613607 Method for manufacturing encapsulated electronic components, particularly integrated circuits Sep. 2, 2003
6613608 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof Sep. 2, 2003
6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same Aug. 26, 2003
6611047 Semiconductor package with singulation crease Aug. 26, 2003
6611048 Exposed paddle leadframe for semiconductor die packaging Aug. 26, 2003
6607173 Film on a surface of a mold used during semiconductor device fabrication Aug. 19, 2003
6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method Aug. 19, 2003
6608369 Lead frame, semiconductor device and manufacturing method thereof, circuit board and electronic equipment Aug. 19, 2003
6605331 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Aug. 12, 2003
6605865 Semiconductor package with optimized leadframe bonding strength Aug. 12, 2003
6602734 Method of manufacturing a semiconductor device Aug. 5, 2003
6603194 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same Aug. 5, 2003
6603209 Compliant integrated circuit package Aug. 5, 2003
6596561 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture Jul. 22, 2003
6597020 Process for packaging a chip with sensors and semiconductor package containing such a chip Jul. 22, 2003
6592352 Offset edges mold for plastic packaging of integrated semiconductor devices Jul. 15, 2003
6593169 Method of making hybrid integrated circuit device Jul. 15, 2003
6593665 Protective envelope for a semiconductor integrated circuit Jul. 15, 2003
6589820 Method and apparatus for packaging a microelectronic die Jul. 8, 2003
6590275 Ball grid array type semiconductor package having a flexible substrate Jul. 8, 2003
6590276 Semiconductor device and a method of manufacturing the same Jul. 8, 2003
6583504 Semiconductor die with attached heat sink and transfer mold Jun. 24, 2003
6580620 Matrix type printed circuit board for semiconductor packages Jun. 17, 2003
6576496 Method and apparatus for encapsulating a multi-chip substrate array Jun. 10, 2003
6576994 Semiconductor device Jun. 10, 2003
6577000 Premold type semiconductor package Jun. 10, 2003
6577015 Partial slot cover for encapsulation process Jun. 10, 2003
6573119 Semiconductor device and method of manufacture thereof Jun. 3, 2003
6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame Jun. 3, 2003
6566741 Grounding of package substrates May. 20, 2003
6564447 Non lead frame clamping for matrix leadless leadframe package molding May. 20, 2003
6562655 Heat spreader with spring IC package fabrication method May. 13, 2003

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