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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6707165 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device Mar. 16, 2004
6699731 Substrate of semiconductor package Mar. 2, 2004
6700186 Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device Mar. 2, 2004
6700190 Integrated circuit device with exposed upper and lower die surfaces Mar. 2, 2004
6700192 Leadframe and method of manufacturing a semiconductor device using the same Mar. 2, 2004
6700194 Semiconductor device Mar. 2, 2004
6700210 Electronic assemblies containing bow resistant semiconductor packages Mar. 2, 2004
6696006 Mold for flashless injection molding to encapsulate an integrated circuit chip Feb. 24, 2004
6696752 Encapsulated semiconductor device with flash-proof structure Feb. 24, 2004
6692988 Method of fabricating a substrate-based semiconductor package without mold flash Feb. 17, 2004
6692989 Plastic molded type semiconductor device and fabrication process thereof Feb. 17, 2004
6687983 Non leadframe clamping for matrix leadless leadframe package molding Feb. 10, 2004
6690086 Apparatus and method for reducing interposer compression during molding process Feb. 10, 2004
6686226 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame Feb. 3, 2004
6686227 Method and system for exposed die molding for integrated circuit packaging Feb. 3, 2004
6686268 Method of forming overmolded chip scale package and resulting product Feb. 3, 2004
6682952 Method of forming the resin sealed semiconductor device using the lead frame Jan. 27, 2004
6683388 Method and apparatus for packaging a microelectronic die Jan. 27, 2004
6680531 Multi-chip semiconductor package Jan. 20, 2004
6676885 Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding di Jan. 13, 2004
6677675 Microelectronic devices and microelectronic die packages Jan. 13, 2004
6677681 Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break Jan. 13, 2004
6674165 Mold for a semiconductor chip Jan. 6, 2004
6670220 Semiconductor device and manufacture method of that Dec. 30, 2003
6666997 Method for removing cleaning compound flash from mold vents Dec. 23, 2003
6667193 Semiconductor device and a method of manufacturing the same Dec. 23, 2003
6667439 Integrated circuit package including opening exposing portion of an IC Dec. 23, 2003
6664139 Method and apparatus for packaging a microelectronic die Dec. 16, 2003
6664616 Semiconductor device and manufacturing method thereof Dec. 16, 2003
6664646 Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break Dec. 16, 2003
6664647 Semiconductor device and a method of manufacturing the same Dec. 16, 2003
6660558 Semiconductor package with molded flash Dec. 9, 2003
6660565 Flip chip molded/exposed die process and package structure Dec. 9, 2003
6656769 Method and apparatus for distributing mold material in a mold for packaging microelectronic devices Dec. 2, 2003
6656773 Transfer molding of integrated circuit packages Dec. 2, 2003
6657132 Single sided adhesive tape for compound diversion on BOC substrates Dec. 2, 2003
6657298 Integrated circuit chip package having an internal lead Dec. 2, 2003
6652795 Production method for semiconductor devices using resin molding mold Nov. 25, 2003
6653172 Methods for providing void-free layers for semiconductor assemblies Nov. 25, 2003
6653173 Method and apparatus for packaging a microelectronic die Nov. 25, 2003
6653564 Conductor strip arrangement for a molded electronic component and process for molding Nov. 25, 2003
6654248 Top gated heat dissipation Nov. 25, 2003
6649447 Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames Nov. 18, 2003
6650012 Semiconductor device Nov. 18, 2003
6644949 Apparatus for reduced flash encapsulation of microelectronic devices Nov. 11, 2003
6645792 Lead frame and method for fabricating resin-encapsulated semiconductor device Nov. 11, 2003
6645794 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding Nov. 11, 2003
6646063 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition Nov. 11, 2003
6642609 Leadframe for a semiconductor device having leads with land electrodes Nov. 4, 2003
6638595 Method and apparatus for reduced flash encapsulation of microelectronic devices Oct. 28, 2003

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