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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6794273 Semiconductor device and manufacturing method thereof Sep. 21, 2004
6790708 Encapsulation process using a partial slot cover and a package formed by the process Sep. 14, 2004
6790711 Method of making semiconductor device Sep. 14, 2004
6791173 Semiconductor device and its manufacturing method Sep. 14, 2004
6791198 Method and apparatus for gate blocking X-outs during a molding process Sep. 14, 2004
6787093 Semiconductor resin molding method Sep. 7, 2004
6784541 Semiconductor module and mounting method for same Aug. 31, 2004
6779258 Semiconductor packages and methods for making the same Aug. 24, 2004
6780353 Method for making micromolds Aug. 24, 2004
6780669 Method of forming overmolded chip scale package and resulting product Aug. 24, 2004
6780681 Process of manufacturing a semiconductor device Aug. 24, 2004
6780747 Methods for providing void-free layers for semiconductor assemblies Aug. 24, 2004
6781066 Packaged microelectronic component assemblies Aug. 24, 2004
6776598 Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same Aug. 17, 2004
6776599 Method and apparatus for gate blocking X-outs during a molding process Aug. 17, 2004
6777819 Semiconductor package with flash-proof device Aug. 17, 2004
6774466 Semiconductor device Aug. 10, 2004
6772512 Method of fabricating a flip-chip ball-grid-array package without causing mold flash Aug. 10, 2004
6773247 Die used for resin-sealing and molding an electronic component Aug. 10, 2004
6769893 Apparatus for vacuum encapsulation of semiconductor chip packages Aug. 3, 2004
6770163 Mold and method for encapsulation of electronic device Aug. 3, 2004
6770961 Carrier frame and semiconductor package including carrier frame Aug. 3, 2004
6770970 High-frequency module, method of manufacturing thereof and method of molding resin Aug. 3, 2004
6767767 Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate Jul. 27, 2004
6764877 Method of dissipating static electric charge from a chip assembly during a manufacturing operation Jul. 20, 2004
6764878 Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Jul. 20, 2004
6764882 Two-stage transfer molding method to encapsulate MMC module Jul. 20, 2004
6762078 Semiconductor package having semiconductor chip within central aperture of substrate Jul. 13, 2004
6759279 Method of manufacturing semiconductor device having resin sealing body Jul. 6, 2004
6750533 Substrate with dam bar structure for smooth flow of encapsulating resin Jun. 15, 2004
6746895 Method for encapsulating a multi-chip substrate array Jun. 8, 2004
6747345 Exposed die molding apparatus Jun. 8, 2004
6743663 Method for producing a hybrid frame or hybrid housing and corresponding hybrid frame or hybrid housing Jun. 1, 2004
6743706 Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body Jun. 1, 2004
6737735 Semiconductor device wiring lead frame having resin flow control plates May. 18, 2004
6733703 Method for controlling the dimensions of bodies made from sinterable materials May. 11, 2004
6734039 Semiconductor chip grid array package design and method of manufacture May. 11, 2004
6734372 Gate area relief strip for a molded I/C package May. 11, 2004
6734571 Semiconductor assembly encapsulation mold May. 11, 2004
6730546 Molded component and method of producing the same May. 4, 2004
6730995 Two-stage transfer molding device to encapsulate MMC module May. 4, 2004
6723583 Method of manufacturing a semiconductor device using a mold Apr. 20, 2004
6724072 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same Apr. 20, 2004
6717247 Tool and method for welding to IC frames Apr. 6, 2004
6717248 Semiconductor package and method for fabricating the same Apr. 6, 2004
6713882 Resin sealing apparatus and resin sealing method Mar. 30, 2004
6709892 Electronic device fabrication method comprising twofold cutting of conductor member Mar. 23, 2004
6710257 Circuit encapsulation Mar. 23, 2004
6710429 Semiconductor device and process for production thereof Mar. 23, 2004
6706565 Methods of forming an integrated circuit device Mar. 16, 2004

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