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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6872597 Method of manufacturing a semiconductor device and a semiconductor device Mar. 29, 2005
6873039 Methods of making microelectronic packages including electrically and/or thermally conductive element Mar. 29, 2005
6869811 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink Mar. 22, 2005
6870274 Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package Mar. 22, 2005
6867485 Semiconductor package using terminals formed on a conductive layer of a circuit board Mar. 15, 2005
6867487 Flash-preventing semiconductor package Mar. 15, 2005
6860731 Mold for encapsulating a semiconductor chip Mar. 1, 2005
6861294 Semiconductor devices and methods of making the devices Mar. 1, 2005
6858470 Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof Feb. 22, 2005
6858474 Wire bond package and packaging method Feb. 22, 2005
6858910 Method of fabricating a molded package for micromechanical devices Feb. 22, 2005
6858927 Semiconductor packages and methods for making the same Feb. 22, 2005
6858931 Heat sink with collapse structure for semiconductor package Feb. 22, 2005
6858933 Injection mold for an optical semiconductor package and corresponding optical semiconductor package Feb. 22, 2005
6856006 Encapsulation method and leadframe for leadless semiconductor packages Feb. 15, 2005
6856011 Semiconductor chip package and method of fabricating same Feb. 15, 2005
6856017 Device having resin package and method of producing the same Feb. 15, 2005
6852263 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition Feb. 8, 2005
6852574 Method of forming a leadframe for a semiconductor package Feb. 8, 2005
6853057 Lead frame for a plastic encapsulated semiconductor device Feb. 8, 2005
6853064 Semiconductor component having stacked, encapsulated dice Feb. 8, 2005
6844617 Packaging mold with electrostatic discharge protection Jan. 18, 2005
6841424 Semiconductor assembly encapsulation mold and method for forming same Jan. 11, 2005
6840751 Vertical mold die press machine Jan. 11, 2005
6838313 Molded flip chip package Jan. 4, 2005
6838315 Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulator Jan. 4, 2005
6838753 Lead-frame strip and method of manufacturing semiconductor packages using the same Jan. 4, 2005
6838760 Packaged microelectronic devices with interconnecting units Jan. 4, 2005
6838776 Circuit device with at least partial packaging and method for forming Jan. 4, 2005
6835600 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same Dec. 28, 2004
6833510 Semiconductor packages and methods for making the same Dec. 21, 2004
6830955 Semiconductor package and method for manufacturing the same Dec. 14, 2004
6830957 Method of fabricating BGA packages Dec. 14, 2004
6831354 Semiconductor package and method of fabricating same Dec. 14, 2004
6828002 Substrate strip with sides having flanges and recesses Dec. 7, 2004
6828664 Packaging substrate with electrostatic discharge protection Dec. 7, 2004
6825067 Mold cap anchoring method for molded flex BGA packages Nov. 30, 2004
6821822 Method of manufacturing semiconductor device, molding device for semiconductor device, and semiconductor device Nov. 23, 2004
6817854 Mold with compensating base Nov. 16, 2004
6818474 Method for manufacturing stacked chip package Nov. 16, 2004
6815261 Encapsulation method in a molding machine for an electronic device Nov. 9, 2004
6815262 Apparatus and method for attaching an integrated circuit sensor to a substrate Nov. 9, 2004
6815835 Single sided adhesive tape for compound diversion on BOC substrates Nov. 9, 2004
6812554 Semiconductor device and a method of manufacturing the same Nov. 2, 2004
6811738 Manufacturing method of an electronic device package Nov. 2, 2004
6809405 Semiconductor device and method of manufacturing the same Oct. 26, 2004
6809408 Semiconductor package with die pad having recessed portion Oct. 26, 2004
6800507 Semiconductor device and a method of manufacturing the same Oct. 5, 2004
6797539 Method of manufacturing a semiconductor device Sep. 28, 2004
6797542 Fabrication method of semiconductor integrated circuit device Sep. 28, 2004

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