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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
6971863 Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent Dec. 6, 2005
6972488 Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin Dec. 6, 2005
6969640 Air pocket resistant semiconductor package system Nov. 29, 2005
6969641 Method and system for integrated circuit packaging Nov. 29, 2005
6969918 System for fabricating semiconductor components using mold cavities having runners configured to minimize venting Nov. 29, 2005
6964927 Method and production of a sensor Nov. 15, 2005
6963133 Semiconductor device and method for manufacturing semiconductor device Nov. 8, 2005
6960491 Integrated circuit packaging for improving effective chip-bonding area Nov. 1, 2005
6960493 Semiconductor device package Nov. 1, 2005
6956296 Transfer molding of integrated circuit packages Oct. 18, 2005
6951776 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Oct. 4, 2005
6951981 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Oct. 4, 2005
6948239 Method for fabricating semiconductor apparatus using board frame Sep. 27, 2005
6949405 Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities Sep. 27, 2005
6949413 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Sep. 27, 2005
6949414 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Sep. 27, 2005
6949838 Integrated circuit device Sep. 27, 2005
6946730 Semiconductor device having heat conducting plate Sep. 20, 2005
6943456 Plastic molded type semiconductor device and fabrication process thereof Sep. 13, 2005
6943457 Semiconductor package having polymer members configured to provide selected package characteristics Sep. 13, 2005
6940161 Semiconductor device and process for producing the same Sep. 6, 2005
6940162 Semiconductor module and mounting method for same Sep. 6, 2005
6933170 Packaged microelectronic component assemblies Aug. 23, 2005
6933175 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Aug. 23, 2005
6933592 Substrate structure capable of reducing package singular stress Aug. 23, 2005
6933618 Tablet comprising epoxy resin composition Aug. 23, 2005
6921682 Method for manufacturing encapsulated electronic components, particularly integrated circuits Jul. 26, 2005
6918178 Method of attaching a heat sink to an IC package Jul. 19, 2005
6919232 Process for producing a semiconductor chip Jul. 19, 2005
6919629 Method and system for integrated circuit packaging Jul. 19, 2005
6916683 Methods of fabricating a molded ball grid array Jul. 12, 2005
6910874 Apparatus for encapsulating a multi-chip substrate array Jun. 28, 2005
6911719 Lead frame for resin sealed semiconductor device Jun. 28, 2005
6908293 Resin encapsulation system Jun. 21, 2005
6903270 Method and structure for securing a mold compound to a printed circuit board Jun. 7, 2005
6899534 Mold assembly for a package stack via bottom-leaded plastic (blp) packaging May. 31, 2005
6897090 Method of making a compliant integrated circuit package May. 24, 2005
6897093 Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package May. 24, 2005
6897097 Semiconductor device and a method of manufacturing the same May. 24, 2005
6897550 Fully-molded leadframe stand-off feature May. 24, 2005
6893244 Apparatus for encasing array packages May. 17, 2005
6893898 Semiconductor device and a method of manufacturing the same May. 17, 2005
6893903 Semiconductor device and method for manufacturing the same May. 17, 2005
6890800 Method of manufacturing semiconductor device with ceramic multilayer board May. 10, 2005
6891108 Semiconductor packages and methods for making the same May. 10, 2005
6891254 Semiconductor device with protrusions May. 10, 2005
6887739 Method of manufacturing semiconductor package including forming a resin sealing member May. 3, 2005
6885088 Flat leadframe for a semiconductor package Apr. 26, 2005
6881606 Method for forming a protective layer for use in packaging a semiconductor die Apr. 19, 2005
6872593 Vertical mold die press machine Mar. 29, 2005

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