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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
5379187 Design for encapsulation of thermally enhanced integrated circuits Jan. 3, 1995
5377077 Ultra high density integrated circuit packages method and apparatus Dec. 27, 1994
5370517 Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device Dec. 6, 1994
5371044 Method of uniformly encapsulating a semiconductor device in resin Dec. 6, 1994
5367766 Ultra high density integrated circuit packages method Nov. 29, 1994
5368805 Method for producing resin sealed type semiconductor device Nov. 29, 1994
5366364 Plastic molding apparatus Nov. 22, 1994
5365404 Jack-type semiconductor integrated circuit packages Nov. 15, 1994
5349136 Mold tool assembly Sep. 20, 1994
5344600 Method for encapsulating semiconductor devices with package bodies Sep. 6, 1994
5344795 Method for encapsulating an integrated circuit using a removable heatsink support block Sep. 6, 1994
5334872 Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad Aug. 2, 1994
5331511 Electrically and thermally enhanced integrated-circuit package Jul. 19, 1994
5331205 Molded plastic package with wire protection Jul. 19, 1994
5328870 Method for forming plastic molded package with heat sink for integrated circuit devices Jul. 12, 1994
5316463 Encapsulating molding equipment May. 31, 1994
5309027 Encapsulated semiconductor package having protectant circular insulators May. 3, 1994
5302101 Mold for resin-packaging electronic components Apr. 12, 1994
5302850 Semiconductor sealing mold Apr. 12, 1994
5296740 Method and apparatus for a semiconductor device having a radiation part Mar. 22, 1994
5296743 Plastic encapsulated integrated circuit package and method of manufacturing the same Mar. 22, 1994
5293065 Lead frame having an outlet with a larger cross sectional area than the inlet Mar. 8, 1994
5293072 Semiconductor device having spherical terminals attached to the lead frame embedded within the package body Mar. 8, 1994
5291059 Resin-molded semiconductor device and lead frame employed for fabricating the same Mar. 1, 1994
5289033 Packaging of semiconductor chips with resin Feb. 22, 1994
5289039 Resin encapsulated semiconductor device Feb. 22, 1994
5286426 Assembling a lead frame between a pair of molding cavity plates Feb. 15, 1994
5281851 Integrated circuit packaging with reinforced leads Jan. 25, 1994
5279029 Ultra high density integrated circuit packages method Jan. 18, 1994
5280193 Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate Jan. 18, 1994
5275546 Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor Jan. 4, 1994
5268532 Semiconductor device Dec. 7, 1993
5258649 Semiconductor device and electronic apparatus using semiconductor device Nov. 2, 1993
5254501 Same-side gated process for encapsulating semiconductor devices Oct. 19, 1993
5252052 Mold for manufacturing plastic integrated circuits incorporating a heat sink Oct. 12, 1993
5252783 Semiconductor package Oct. 12, 1993
5244838 Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device Sep. 14, 1993
5233222 Semiconductor device having window-frame flag with tapered edge in opening Aug. 3, 1993
5233225 Resin encapsulated pin grid array and method of manufacturing the same Aug. 3, 1993
5223739 Plastic molded semiconductor device having waterproof cap Jun. 29, 1993
5218759 Method of making a transfer molded semiconductor device Jun. 15, 1993
5219608 Method of spraying release agent Jun. 15, 1993
5214846 Packaging of semiconductor chips Jun. 1, 1993
5200366 Semiconductor device, its fabrication method and molding apparatus used therefor Apr. 6, 1993
5200367 Method for assembling packages of semi-conductor elements Apr. 6, 1993
5197183 Modified lead frame for reducing wire wash in transfer molding of IC packages Mar. 30, 1993
5194935 Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure Mar. 16, 1993
5182071 Method of molding a carrier ring to leads Jan. 26, 1993
5179039 Method of making a resin encapsulated pin grid array with integral heatsink Jan. 12, 1993
5175007 Mold assembly with separate encapsulating cavities Dec. 29, 1992

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