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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
7944034 Array molded package-on-package having redistribution lines May. 17, 2011
7943432 Mold cleaning sheet and manufacturing method of a semiconductor device using the same May. 17, 2011
7943430 Semiconductor device with heat sink and method for manufacturing the same May. 17, 2011
7927923 Method and apparatus for directing molding compound flow and resulting semiconductor device packages Apr. 19, 2011
7919845 Formation of a hybrid integrated circuit device Apr. 5, 2011
7919361 Semiconductor package with position member Apr. 5, 2011
7901988 Method for forming a package-on-package structure Mar. 8, 2011
7897436 Process for packaging micro-components using a matrix Mar. 1, 2011
7871863 Integrated circuit package system with multiple molding Jan. 18, 2011
7863761 Integrated circuit package system with molding vents Jan. 4, 2011
7863726 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof Jan. 4, 2011
7859092 Package structures Dec. 28, 2010
7858408 LED with phosphor tile and overmolded phosphor in lens Dec. 28, 2010
7824937 Solid element device and method for manufacturing the same Nov. 2, 2010
7821117 Semiconductor package with mechanical stress isolation of semiconductor die subassembly Oct. 26, 2010
7816155 Mounted semiconductor device and a method for making the same Oct. 19, 2010
7807510 Method of manufacturing chip integrated substrate Oct. 5, 2010
7790512 Molded leadframe substrate semiconductor package Sep. 7, 2010
7781266 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Aug. 24, 2010
7781262 Method for producing semiconductor device and semiconductor device Aug. 24, 2010
7781261 Integrated circuit package system with offset stacking and anti-flash structure Aug. 24, 2010
7763498 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package Jul. 27, 2010
7745237 Pattern forming method and pattern forming system Jun. 29, 2010
7737544 Sensor system having a substrate and a housing, and method for manufacturing a sensor system Jun. 15, 2010
7732911 Semiconductor packaging substrate improving capability of electrostatic dissipation Jun. 8, 2010
7727793 Physical quantity sensor and manufacturing method therefor Jun. 1, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7691682 Build-up-package for integrated circuit devices, and methods of making same Apr. 6, 2010
7687288 Sealed lighting units Mar. 30, 2010
7682873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages Mar. 23, 2010
7678592 LED housing and fabrication method thereof Mar. 16, 2010
7675144 Method of making wireless semiconductor device, and leadframe used therefor Mar. 9, 2010
7633144 Semiconductor package Dec. 15, 2009
7632720 Method of manufacturing a semiconductor device Dec. 15, 2009
7629199 Method for fabricating semiconductor package with build-up layers formed on chip Dec. 8, 2009
7608486 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier Oct. 27, 2009
7592204 Package design of small diameter sensor Sep. 22, 2009
7537967 Mold cleaning sheet and manufacturing method of a semiconductor device using the same May. 26, 2009
7521799 Semiconductor device and method of manufacturing the same Apr. 21, 2009
7514300 Mold compound cap in a flip chip multi-matrix array package and process of making same Apr. 7, 2009
7507637 Method of manufacturing wafer level stack package Mar. 24, 2009
7504736 Semiconductor packaging mold and method of manufacturing semiconductor package using the same Mar. 17, 2009
7498193 Package with barrier wall and method for manufacturing the same Mar. 3, 2009
7489027 Accessible electronic storage apparatus Feb. 10, 2009
7488622 Method for producing a surface-mountable semiconductor component Feb. 10, 2009
7488620 Method of fabricating leadframe based flash memory cards including singulation by straight line cuts Feb. 10, 2009
7459770 Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure Dec. 2, 2008
7411219 Uniform contact Aug. 12, 2008
7407832 Method for manufacturing semiconductor package Aug. 5, 2008
7335995 Microelectronic assembly having array including passive elements and interconnects Feb. 26, 2008

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