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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:
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Patent Number Title Of Patent Date Issued
5498902 Semiconductor device and its manufacturing method Mar. 12, 1996
5499160 High density integrated circuit module with snap-on rail assemblies Mar. 12, 1996
5493151 Semiconductor device, lead frame and method for manufacturing semiconductor devices Feb. 20, 1996
5489805 Slotted thermal dissipater for a semiconductor package Feb. 6, 1996
5484274 Encapsulation molding equipment Jan. 16, 1996
5485037 Semiconductor device having a thermal dissipator and electromagnetic shielding Jan. 16, 1996
5482898 Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding Jan. 9, 1996
5478517 Method for molding IC chips Dec. 26, 1995
5479051 Semiconductor device having a plurality of semiconductor chips Dec. 26, 1995
5475920 Method of assembling ultra high density integrated circuit packages Dec. 19, 1995
5474958 Method for making semiconductor device having no die supporting surface Dec. 12, 1995
5475259 Semiconductor device and carrier for carrying semiconductor device Dec. 12, 1995
5472646 Method for fabricating a transfer model optical semiconductor apparatus Dec. 5, 1995
RE35109 Semiconductor device and method for fabricating the same Dec. 5, 1995
5457341 Integrated circuit device and manufacturing method using photoresist lead covering Oct. 10, 1995
5455462 Plastic molded package with heat sink for integrated circuit devices Oct. 3, 1995
5448825 Method of making electrically and thermally enhanced integrated-circuit package Sep. 12, 1995
5450283 Thermally enhanced semiconductor device having exposed backside and method for making the same Sep. 12, 1995
5447888 Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins Sep. 5, 1995
5446620 Ultra high density integrated circuit packages Aug. 29, 1995
5444909 Method of making a drop-in heat sink Aug. 29, 1995
5445995 Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink Aug. 29, 1995
5444025 Process for encapsulating a semiconductor package having a heat sink using a jig Aug. 22, 1995
5441684 Method of forming molded plastic packages with integrated heat sinks Aug. 15, 1995
5437095 Method of making plastic encapsulated integrated circuit package Aug. 1, 1995
5429488 Encapsulating molding equipment and method Jul. 4, 1995
5430331 Plastic encapsulated integrated circuit package having an embedded thermal dissipator Jul. 4, 1995
5427938 Method of manufacturing a resin-sealed semiconductor device Jun. 27, 1995
5424251 Method of producing semiconductor device having radiation part made of resin containing insulator powders Jun. 13, 1995
5424577 Lead frame for semiconductor device Jun. 13, 1995
5424578 Lead frame for use in a semiconductor device and a semiconductor device using the same Jun. 13, 1995
5422163 Flexible substrate with projections to block resin flow Jun. 6, 1995
5422313 Integrated circuit device and manufacturing method using photoresist lead covering Jun. 6, 1995
5420751 Ultra high density modular integrated circuit package May. 30, 1995
5420752 GPT system for encapsulating an integrated circuit package May. 30, 1995
5409362 Encapsulation molding equipment Apr. 25, 1995
5409866 Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe Apr. 25, 1995
5405255 Encapsulaton molding equipment Apr. 11, 1995
5403776 Process of using a jig to align and mount terminal conductors to a semiconductor plastic package Apr. 4, 1995
5401155 Metal mold for forming a transparent-resin-sealed semiconductor element Mar. 28, 1995
5399804 Semiconductor device and method of producing the same Mar. 21, 1995
5396795 Semiconductor sensor device for measuring intake flow rate Mar. 14, 1995
5395226 Molding machine and method Mar. 7, 1995
5393705 Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof Feb. 28, 1995
5391923 Tape carrier including leads on both sides and resin-encapsulated semiconductor device incorporating the tape carrier Feb. 21, 1995
5385869 Semiconductor chip bonded to a substrate and method of making Jan. 31, 1995
5384286 Process for encapsulating a semiconductor chip, leadframe and heatsink Jan. 24, 1995
5381599 Liquid crystal polymer encapsulated electronic devices and methods of making the same Jan. 17, 1995
5382546 Semiconductor device and method of fabricating same, as well as lead frame used therein and method of fabricating same Jan. 17, 1995
5381042 Packaged integrated circuit including heat slug having an exposed surface Jan. 10, 1995

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