Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
5666064 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device Sep. 9, 1997
5662848 Plastic molding method for semiconductor devices Sep. 2, 1997
5663104 Method of manufacturing a semiconductor device for power supply use Sep. 2, 1997
5659200 Semiconductor device having radiator structure Aug. 19, 1997
5656549 Method of packaging a semiconductor device Aug. 12, 1997
5656550 Method of producing a semicondutor device having a lead portion with outer connecting terminal Aug. 12, 1997
5656863 Resin seal semiconductor package Aug. 12, 1997
5656864 Semiconductor device having upper and lower package bodies and manufacturing method thereof Aug. 12, 1997
5653020 Method for forming plastic packages, in particular thin packages, for semiconductor electronic devices Aug. 5, 1997
5653891 Method of producing a semiconductor device with a heat sink Aug. 5, 1997
5652461 Semiconductor device with a convex heat sink Jul. 29, 1997
5652463 Transfer modlded electronic package having a passage means Jul. 29, 1997
5644169 Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby Jul. 1, 1997
5640044 Semiconductor device and method of producing said semiconductor device Jun. 17, 1997
5637273 Method for molding of integrated circuit package Jun. 10, 1997
5637914 Lead frame and semiconductor device encapsulated by resin Jun. 10, 1997
5637915 Semiconductor device affixed to an upper and a lower leadframe Jun. 10, 1997
5637923 Semiconductor device, carrier for carrying semiconductor device Jun. 10, 1997
5635671 Mold runner removal from a substrate-based packaged electronic device Jun. 3, 1997
5625223 Surface mounting type diode Apr. 29, 1997
5622873 Process for manufacturing a resin molded image pick-up semiconductor chip having a window Apr. 22, 1997
5623162 Lead frame having cut-out wing leads Apr. 22, 1997
5623163 Leadframe for semiconductor devices Apr. 22, 1997
5619794 Complex structure molding process and apparatus Apr. 15, 1997
5619065 Semiconductor package and method for assembling the same Apr. 8, 1997
5609889 Apparatus for encapsulating electronic packages Mar. 11, 1997
5608265 Encapsulated semiconductor device package having holes for electrically conductive material Mar. 4, 1997
5604376 Paddleless molded plastic semiconductor chip package Feb. 18, 1997
5594274 Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same Jan. 14, 1997
5592019 Semiconductor device and module Jan. 7, 1997
5578871 Integrated circuit package and method of making the same Nov. 26, 1996
5569625 Process for manufacturing a plural stacked leadframe semiconductor device Oct. 29, 1996
5570272 Apparatus for encapsulating an integrated circuit package Oct. 29, 1996
5566051 Ultra high density integrated circuit packages method and apparatus Oct. 15, 1996
5563103 Method for manufacturing thermoplastic resin molded semiconductor Oct. 8, 1996
5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package Oct. 1, 1996
5559364 Leadframe Sep. 24, 1996
5554887 Plastic molded semiconductor package Sep. 10, 1996
5552632 Plate-shaped external storage device and method of producing the same Sep. 3, 1996
5550711 Ultra high density integrated circuit packages Aug. 27, 1996
5542171 Method of selectively releasing plastic molding material from a surface Aug. 6, 1996
5543664 Ultra high density integrated circuit package Aug. 6, 1996
5535509 Method of making a lead on chip (LOC) semiconductor device Jul. 16, 1996
5530295 Drop-in heat sink Jun. 25, 1996
5527743 Method for encapsulating an integrated circuit package Jun. 18, 1996
5525547 Method of fabricating a molded semiconductor device having blocking banks between leads Jun. 11, 1996
5517056 Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same May. 14, 1996
5514913 Resin-encapsulated semiconductor device having improved adhesion May. 7, 1996
5508232 Method of manufacturing a semiconductor device Apr. 16, 1996
5508557 Surface mounting type diode Apr. 16, 1996

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
Production of battery grade materials via an oxalate method
Apparatus and method of preventing signal delay in display device
Optical packet signal transmission device and WDM optical communication network
Selecting from a plural of energy saving modes
Charge domain filter and method thereof
Co-map communication operator
Anti-fake battery pack and identification system thereof
  Randomly Featured Patents
Medicate container
Writing pen
Vehicle front-end quick connect hitch and lift assembly
Automobile and/or replica thereof
Method for fabricating phase shift mask comprising the use of a second photoshield layer as a sidewall
Shrub rose plant named `BAIine`
Apparatus for rotating a set of carriers for a strand supply bobbin relative to moving strands from a set of contra-rotating carriers for a strand supply bobbin
Dental instrument cover
Balance shaft module equipped with oil pump
Method for automated handling of materials such as automotive parts and system utilizing same