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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
5766972 Method of making resin encapsulated semiconductor device with bump electrodes Jun. 16, 1998
5766985 Process for encapsulating a semiconductor device having a heat sink Jun. 16, 1998
5766986 Method of transfer molding electronic packages and packages produced thereby Jun. 16, 1998
5766987 Microelectronic encapsulation methods and equipment Jun. 16, 1998
5767527 Semiconductor device suitable for testing Jun. 16, 1998
5767528 Semiconductor device including pad portion for testing Jun. 16, 1998
5767566 Plastic mold type semiconductor device Jun. 16, 1998
5766535 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits Jun. 16, 1998
5766650 Moulding apparatus with compensation element Jun. 16, 1998
5763829 Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe Jun. 9, 1998
5757066 Resin-molded type semiconductor device and method of manufacturing the same May. 26, 1998
5757067 Resin-sealed type semiconductor device May. 26, 1998
5753532 Method of manufacturing semiconductor chip package May. 19, 1998
5753973 Resin seal semiconductor package May. 19, 1998
5753977 Semiconductor device and lead frame therefor May. 19, 1998
5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device May. 12, 1998
5750422 Method for making integrated circuit packaging with reinforced leads May. 12, 1998
5750423 Method for encapsulation of semiconductor devices with resin and leadframe therefor May. 12, 1998
5744084 Method of improving molding of an overmolded package body on a substrate Apr. 28, 1998
5736428 Process for manufacturing a semiconductor device having a stepped encapsulated package Apr. 7, 1998
5732465 Method of manufacturing one side resin sealing type semiconductor devices Mar. 31, 1998
5733799 Manufacturing method of semiconductor device comprising molded resin encapsulating a semiconductor chip Mar. 31, 1998
5733802 Semiconductor device and method of manufacturing the same Mar. 31, 1998
5731231 Semiconductor apparatus, fabrication method therefor and board frame Mar. 24, 1998
5731962 Semiconductor device free from short-circuit due to resin pressure in mold Mar. 24, 1998
5728600 Circuit encapsulation process Mar. 17, 1998
5724726 Method of making leadframe for lead-on-chip (LOC) semiconductor device Mar. 10, 1998
5717163 Plastic material pouring device for forming electronic components Feb. 10, 1998
5712197 Method of manufacturing a semiconductor device suitable for surface mounting Jan. 27, 1998
5710062 Plastic molded semiconductor package and method of manufacturing the same Jan. 20, 1998
5708294 Lead frame having oblique slits on a die pad Jan. 13, 1998
5705431 Production method for insulated semiconductor device Jan. 6, 1998
5703398 Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device Dec. 30, 1997
5703399 Semiconductor power module Dec. 30, 1997
5700723 Method of packaging an integrated circuit Dec. 23, 1997
5701034 Packaged semiconductor die including heat sink with locking feature Dec. 23, 1997
5698899 Semiconductor device with first and second sealing resins Dec. 16, 1997
5692296 Method for encapsulating an integrated circuit package Dec. 2, 1997
5693984 Semiconductor device having a heat radiator Dec. 2, 1997
5686361 Method for manufacturing a semiconductor device having a heat radiator Nov. 11, 1997
5682673 Method for forming encapsulated IC packages Nov. 4, 1997
5684327 Lead frame for use in a resin-sealed type semiconductor device Nov. 4, 1997
5684332 Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom Nov. 4, 1997
5679978 Semiconductor device having resin gate hole through substrate for resin encapsulation Oct. 21, 1997
5672549 Method of producing epoxy resin-encapsulated semiconductor device Sep. 30, 1997
5672550 Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame Sep. 30, 1997
5668404 Semiconductor device and production method thereof Sep. 16, 1997
5665296 Molding technique for molding plastic packages Sep. 9, 1997
5665651 Process for encapsulating a semiconductor device and lead frame Sep. 9, 1997
5666003 Packaged semiconductor device incorporating heat sink plate Sep. 9, 1997

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