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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
5912024 Sproutless pre-packaged molding for component encapsulation Jun. 15, 1999
5910010 Semiconductor integrated circuit device, and process and apparatus for manufacturing the same Jun. 8, 1999
5904505 Process for producing encapsulated semiconductor device having metal foil material covering and metal foil May. 18, 1999
5904506 Semiconductor device suitable for testing May. 18, 1999
5904955 Encapsulation means and method May. 18, 1999
5903048 Lead frame for semiconductor device May. 11, 1999
5897338 Method for encapsulating an integrated semi-conductor circuit Apr. 27, 1999
5898216 Micromodule with protection barriers and a method for manufacturing the same Apr. 27, 1999
5895229 Microelectronic package including a polymer encapsulated die, and method for forming same Apr. 20, 1999
5891377 Dambarless leadframe for molded component encapsulation Apr. 6, 1999
5891758 Semiconductor device and method for manufacturing semiconductor device Apr. 6, 1999
5888849 Method for fabricating an electronic package Mar. 30, 1999
5889232 Ultrahigh-frequency electronic component Mar. 30, 1999
5885852 Packaged semiconductor device having a flange at its side surface and its manufacturing method Mar. 23, 1999
5886398 Molded laminate package with integral mold gate Mar. 23, 1999
5886405 Semiconductor device package having inner leads with slots Mar. 23, 1999
5883440 Outline forming method for semiconductor device and semiconductor manufacturing device used in this method Mar. 16, 1999
5877542 Plastic molded type semiconductor device Mar. 2, 1999
5874324 Method of sealing electronic component with molded resin Feb. 23, 1999
5874784 Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor Feb. 23, 1999
5872395 Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages Feb. 16, 1999
5869883 Packaging of semiconductor circuit in pre-molded plastic package Feb. 9, 1999
5869905 Molded packaging for semiconductor device and method of manufacturing the same Feb. 9, 1999
5859477 Apparatus for encapsulating IC packages with diamond substrate thermal conductor Jan. 12, 1999
5852870 Method of making grid array assembly Dec. 29, 1998
5843360 Method and pellet for encapsulating lead frames Dec. 1, 1998
5844779 Semiconductor package, and semiconductor device using the same Dec. 1, 1998
5837567 Lead frame and semiconductor device Nov. 17, 1998
5833903 Injection molding encapsulation for an electronic device directly onto a substrate Nov. 10, 1998
5834339 Methods for providing void-free layers for semiconductor assemblies Nov. 10, 1998
5834340 Plastic molded semiconductor package and method of manufacturing the same Nov. 10, 1998
5834691 Lead frame, its use in the fabrication of resin-encapsulated semiconductor device Nov. 10, 1998
5824252 Method of resin molding and resin molding machine for the same Oct. 20, 1998
5825623 Packaging assemblies for encapsulated integrated circuit devices Oct. 20, 1998
5814878 Semiconductor device Sep. 29, 1998
5811877 Semiconductor device structure Sep. 22, 1998
5808359 Semiconductor device having a heat sink with bumpers for protecting outer leads Sep. 15, 1998
5804467 Semiconductor device and method of producing the same Sep. 8, 1998
5798570 Plastic molded semiconductor package with thermal dissipation means Aug. 25, 1998
5793118 Semiconductor device capable of accomplishing a high moisture proof Aug. 11, 1998
5793613 Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device Aug. 11, 1998
5783134 Method of resin-sealing semiconductor device Jul. 21, 1998
5783463 Semiconductor device and method of producing said semiconductor device Jul. 21, 1998
5779958 Method for packaging electronic device Jul. 14, 1998
5780772 Solution to mold wire sweep in fine pitch devices Jul. 14, 1998
5780933 Substrate for semiconductor device and semiconductor device using the same Jul. 14, 1998
5776512 Apparatus for encapsulating electronic packages Jul. 7, 1998
5776796 Method of encapsulating a semiconductor package Jul. 7, 1998
5776800 Paddleless molded plastic semiconductor chip package Jul. 7, 1998
5777380 Resin sealing type semiconductor device having thin portions formed on the leads Jul. 7, 1998

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