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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6143581 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Nov. 7, 2000
6144102 Semiconductor device package Nov. 7, 2000
6144108 Semiconductor device and method of fabricating the same Nov. 7, 2000
6139304 Mold for injection molding encapsulation over small device on substrate Oct. 31, 2000
6133623 Resin sealing type semiconductor device that includes a plurality of leads and method of making the same Oct. 17, 2000
6130383 Solder ball array package and a method of encapsulation Oct. 10, 2000
6122822 Method for balancing mold flow in encapsulating devices Sep. 26, 2000
6120301 Semiconductor device and method of manufacturing the same Sep. 19, 2000
6117382 Method for encasing array packages Sep. 12, 2000
6117708 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device Sep. 12, 2000
6118184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow Sep. 12, 2000
6114189 Molded array integrated circuit package Sep. 5, 2000
6114192 Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame Sep. 5, 2000
6114760 Ball grid array (BGA) semiconductor package member Sep. 5, 2000
6110755 Method for manufacturing semiconductor device Aug. 29, 2000
6111306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same Aug. 29, 2000
6111315 Semiconductor package with offset die pad Aug. 29, 2000
6105245 Method of manufacturing a resin-encapsulated semiconductor package Aug. 22, 2000
6104085 Semiconductor device and method of producing the same Aug. 15, 2000
6103550 Molded tape support for a molded circuit package prior to dicing Aug. 15, 2000
6100598 Sealed semiconductor device with positional deviation between upper and lower molds Aug. 8, 2000
6096250 Process for releasing a runner from an electronic device package on a laminate plate Aug. 1, 2000
6093972 Microelectronic package including a polymer encapsulated die Jul. 25, 2000
6091157 Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets Jul. 18, 2000
6087202 Process for manufacturing semiconductor packages comprising an integrated circuit Jul. 11, 2000
6081978 Resin-encapsulated semiconductor device producing apparatus and method Jul. 4, 2000
6081997 System and method for packaging an integrated circuit using encapsulant injection Jul. 4, 2000
6083775 Method of encapsulating a chip Jul. 4, 2000
6084292 Lead frame and semiconductor device using the lead frame Jul. 4, 2000
6084310 Semiconductor device, lead frame, and lead bonding Jul. 4, 2000
6080605 Methods of encapsulating a semiconductor chip using a settable encapsulant Jun. 27, 2000
6071758 Process for manufacturing a chip card micromodule with protection barriers Jun. 6, 2000
6072239 Device having resin package with projections Jun. 6, 2000
6069408 Semiconductor device and method of manufacturing semiconductor device May. 30, 2000
6058602 Method for encapsulating IC packages with diamond substrate May. 9, 2000
6060768 Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame May. 9, 2000
6057179 Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region May. 2, 2000
6052893 Process for manufacturing a resin-encapsulated electronic product Apr. 25, 2000
6049123 Ultra high density integrated circuit packages Apr. 11, 2000
6046071 Plastic molded semiconductor package and method of manufacturing the same Apr. 4, 2000
6046075 Oxide wire bond insulation in semiconductor assemblies Apr. 4, 2000
6040622 Semiconductor package using terminals formed on a conductive layer of a circuit board Mar. 21, 2000
6040633 Oxide wire bond insulation in semiconductor assemblies Mar. 21, 2000
6038136 Chip package with molded underfill Mar. 14, 2000
6033933 Method for attaching a removable tape to encapsulate a semiconductor package Mar. 7, 2000
6033934 Semiconductor chip fabrication method and apparatus therefor Mar. 7, 2000
6028368 Semiconductor device with potting resin structures Feb. 22, 2000
6025642 Ultra high density integrated circuit packages Feb. 15, 2000
6025650 Semiconductor device including a frame terminal Feb. 15, 2000
6022763 Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof Feb. 8, 2000

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