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Browse by Category: Main > Physics
Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6262480 Package for electronic device having a fully insulated dissipator Jul. 17, 2001
6262490 Substrate strip for use in packaging semiconductor chips Jul. 17, 2001
6257857 Molding apparatus for flexible substrate based package Jul. 10, 2001
6258630 Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader Jul. 10, 2001
6258632 Molded packaging for semiconductor device and method of manufacturing the same Jul. 10, 2001
6254815 Molded packaging method for a sensing die having a pressure sensing diaphragm Jul. 3, 2001
6255740 Semiconductor device having a lead portion with outer connecting terminals Jul. 3, 2001
6255742 Semiconductor package incorporating heat dispersion plate inside resin molding Jul. 3, 2001
6251702 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device Jun. 26, 2001
6252306 Method of producing semiconductor device and configuration thereof, and lead frame used in said method Jun. 26, 2001
6252309 Packaged semiconductor substrate Jun. 26, 2001
6249050 Encapsulated transfer molding of a semiconductor die with attached heat sink Jun. 19, 2001
6246015 Printed circuit board for ball grid array semiconductor packages Jun. 12, 2001
6246111 Universal lead frame type of quad flat non-lead package of semiconductor Jun. 12, 2001
6246115 Semiconductor package having a heat sink with an exposed surface Jun. 12, 2001
6238949 Method and apparatus for forming a plastic chip on chip package module May. 29, 2001
6232152 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures May. 15, 2001
6232650 Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting May. 15, 2001
6222259 Stack package and method of fabricating the same Apr. 24, 2001
6218215 Methods of encapsulating a semiconductor chip using a settable encapsulant Apr. 17, 2001
6213747 Package stack via bottom leaded plastic (BLP) packaging Apr. 10, 2001
6214645 Method of molding ball grid array semiconductor packages Apr. 10, 2001
6215174 Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frame Apr. 10, 2001
6210992 Controlling packaging encapsulant leakage Apr. 3, 2001
6208020 Leadframe for use in manufacturing a resin-molded semiconductor device Mar. 27, 2001
6204095 Method of forming overmolded chip scale package and resulting product Mar. 20, 2001
6200121 Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein Mar. 13, 2001
6201295 Plate-shaped external storage device and method of producing the same Mar. 13, 2001
6201299 Substrate structure of BGA semiconductor package Mar. 13, 2001
6197616 Method of fabricating semiconductor device Mar. 6, 2001
6194251 Die positioning in integrated circuit packaging Feb. 27, 2001
6191493 Resin seal semiconductor package and manufacturing method of the same Feb. 20, 2001
6187612 Molded ball grid array package mold die Feb. 13, 2001
6187613 Process for underfill encapsulating flip chip driven by pressure Feb. 13, 2001
6187614 Electronic component, method for making the same, and lead frame and mold assembly for use therein Feb. 13, 2001
6188021 Package stack via bottom leaded plastic (BLP) packaging Feb. 13, 2001
6180435 Semiconductor device with economical compact package and process for fabricating semiconductor device Jan. 30, 2001
6177040 Method for making light transparent package for integrated circuit Jan. 23, 2001
6177718 Resin-sealed semiconductor device Jan. 23, 2001
6175150 Plastic-encapsulated semiconductor device and fabrication method thereof Jan. 16, 2001
6172424 Resin sealing type semiconductor device Jan. 9, 2001
6168970 Ultra high density integrated circuit packages Jan. 2, 2001
6164946 Ball grid array (BGA) encapsulation mold Dec. 26, 2000
6166328 Package stack via bottom leaded plastic (BLP) packaging Dec. 26, 2000
6159770 Method and apparatus for fabricating semiconductor device Dec. 12, 2000
6157086 Chip package with transfer mold underfill Dec. 5, 2000
6153923 Semiconductor device Nov. 28, 2000
6146919 Package stack via bottom leaded plastic (BLP) packaging Nov. 14, 2000
6146921 Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink Nov. 14, 2000
6146924 Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process Nov. 14, 2000

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