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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6332766 Apparatus for encasing array packages Dec. 25, 2001
6333211 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps Dec. 25, 2001
6331737 Method of encapsulating thin semiconductor chip-scale packages Dec. 18, 2001
6331453 Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities Dec. 18, 2001
6329220 Packages for semiconductor die Dec. 11, 2001
6329224 Encapsulation of microelectronic assemblies Dec. 11, 2001
6329606 Grid array assembly of circuit boards with singulation grooves Dec. 11, 2001
6329711 Semiconductor device and mounting structure Dec. 11, 2001
6330162 IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof Dec. 11, 2001
6323064 Method for fabricating a memory card Nov. 27, 2001
6324069 Chip package with molded underfill Nov. 27, 2001
6320270 Semiconductor device and method of producing the same Nov. 20, 2001
6315540 Molding die for concurrently molding semiconductor chips without voids and wire weep Nov. 13, 2001
6315936 Encapsulation method using non-homogeneous molding compound pellets Nov. 13, 2001
6316290 Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate Nov. 13, 2001
6316821 High density lead frames and methods for plastic injection molding Nov. 13, 2001
6312976 Method for manufacturing leadless semiconductor chip package Nov. 6, 2001
6309911 Method of fabricating semiconductor device Oct. 30, 2001
6309914 Method for making a semiconductor package Oct. 30, 2001
6309916 Method of molding plastic semiconductor packages Oct. 30, 2001
6305921 Saw tooth mold Oct. 23, 2001
6306331 Ultra mold for encapsulating very thin packages Oct. 23, 2001
6303983 Apparatus for manufacturing resin-encapsulated semiconductor devices Oct. 16, 2001
6300155 Method for producing semiconductor device by coating Oct. 9, 2001
6300166 Method for packaging a BGA and the structure of a substrate for use with the method Oct. 9, 2001
6300169 Method for manufacturing a pressure sensor Oct. 9, 2001
6297078 Integrated circuit package with bond wires at the corners of an integrated circuit Oct. 2, 2001
6294411 Method for molding a semiconductor device utilizing a satin finish Sep. 25, 2001
6294825 Asymmetrical mold of multiple-part matrixes Sep. 25, 2001
6290481 Flash-free mold structure for integrated circuit package Sep. 18, 2001
6291263 Method of fabricating an integrated circuit package having a core-hollowed encapsulation body Sep. 18, 2001
6291270 Revealing localized cutting line patterns in a semiconductor device Sep. 18, 2001
6291273 Plastic molded type semiconductor device and fabrication process thereof Sep. 18, 2001
6291274 Resin molded semiconductor device and method for manufacturing the same Sep. 18, 2001
6291882 Packaging process and structure of electronic device Sep. 18, 2001
6291899 Method and apparatus for reducing BGA warpage caused by encapsulation Sep. 18, 2001
6287503 Method for encasing array packages Sep. 11, 2001
6284173 Method for vacuum encapsulation of semiconductor chip packages Sep. 4, 2001
6281045 Semiconductor apparatus, manufacturing method thereof and electronic apparatus Aug. 28, 2001
6281566 Plastic package for electronic devices Aug. 28, 2001
6276913 Mold for resin sealing Aug. 21, 2001
6278175 Leadframe alteration to direct compound flow into package Aug. 21, 2001
6278182 Lead frame type semiconductor package Aug. 21, 2001
6274408 Method for producing a plastic molded semiconductor package Aug. 14, 2001
6274926 Plate-shaped external storage device and method of producing the same Aug. 14, 2001
6271584 Arrangement of electronic components on a bearer strip Aug. 7, 2001
6270712 Molding die and marking method for semiconductor devices Aug. 7, 2001
6268644 Semiconductor device Jul. 31, 2001
6265660 Package stack via bottom leaded plastic (BLP) packaging Jul. 24, 2001
6261870 Backside failure analysis capable integrated circuit packaging Jul. 17, 2001

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