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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:
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Patent Number Title Of Patent Date Issued
6428732 Insert-molding method for obtaining a resin-molded product Aug. 6, 2002
6420201 Method for forming a bond wire pressure sensor die package Jul. 16, 2002
6420651 Integrated circuit package with bond wires at the corners of an integrated circuit Jul. 16, 2002
6417018 Asymmetrical molding method for multiple part matrixes Jul. 9, 2002
6413801 Method of molding semiconductor device and molding die for use therein Jul. 2, 2002
6414379 Structure of disturbing plate having down set Jul. 2, 2002
6410355 Semiconductor package using terminals formed on a conductive layer of a circuit board Jun. 25, 2002
6410987 Semiconductor device and a method of manufacturing the same and an electronic device Jun. 25, 2002
6407461 Injection molded integrated circuit chip assembly Jun. 18, 2002
6403009 Circuit encapsulation Jun. 11, 2002
6403387 Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink Jun. 11, 2002
6404067 Plastic ball grid array package with improved moisture resistance Jun. 11, 2002
6404069 Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device Jun. 11, 2002
6399423 Semiconductor device an a method of manufacturing the same Jun. 4, 2002
6400005 Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process Jun. 4, 2002
6400574 Molded ball grid array Jun. 4, 2002
6395578 Semiconductor package and method for fabricating the same May. 28, 2002
6395579 Controlling packaging encapsulant leakage May. 28, 2002
6396135 Substrate for use in semiconductor packaging May. 28, 2002
6396139 Semiconductor package structure with exposed die pad May. 28, 2002
6396708 Circuit board frame and method of use thereof for manufacturing semiconductor device May. 28, 2002
6392295 Semiconductor device May. 21, 2002
6387731 Method and apparatus for reducing BGA warpage caused by encapsulation May. 14, 2002
6388338 Plastic package for an integrated electronic semiconductor device May. 14, 2002
6384487 Bow resistant plastic semiconductor package and method of fabrication May. 7, 2002
6383846 Method and apparatus for molding a flip chip semiconductor device May. 7, 2002
6379988 Pre-release plastic packaging of MEMS and IMEMS devices Apr. 30, 2002
6379997 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same Apr. 30, 2002
6376921 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame Apr. 23, 2002
6372546 Method of producing semiconductor device and configuration thereof, and lead frame used in said method Apr. 16, 2002
6373126 Method for reducing IC package delamination by use of internal baffles Apr. 16, 2002
6373132 Semiconductor die with attached heat sink and transfer mold Apr. 16, 2002
6365434 Method and apparatus for reduced flash encapsulation of microelectronic devices Apr. 2, 2002
6365976 Integrated circuit device with depressions for receiving solder balls and method of fabrication Apr. 2, 2002
6365979 Semiconductor device and manufacturing method thereof Apr. 2, 2002
6365980 Thermally enhanced semiconductor ball grid array device and method of fabrication Apr. 2, 2002
6358773 Method of making substrate for use in forming image sensor package Mar. 19, 2002
6359335 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures Mar. 19, 2002
6355199 Method of molding flexible circuit with molded stiffener Mar. 12, 2002
6355499 Method of making ball grid array package Mar. 12, 2002
6355507 Method of forming overmolded chip scale package and resulting product Mar. 12, 2002
6355985 Integrated circuit device and synchronous-link dynamic random access memory device Mar. 12, 2002
6350631 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same Feb. 26, 2002
6346433 Method of coating semiconductor wafer with resin and mold used therefor Feb. 12, 2002
6340837 Semiconductor device and method of fabricating the same Jan. 22, 2002
6338813 Molding method for BGA semiconductor chip package Jan. 15, 2002
6338984 Resin-molded semiconductor device, method for manufacturing the same, and leadframe Jan. 15, 2002
6338985 Making chip size semiconductor packages Jan. 15, 2002
6335221 Ball grid array (BGA) encapsulation mold Jan. 1, 2002
6335223 Method for producing a resin-sealed semiconductor device Jan. 1, 2002

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