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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6498055 Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system Dec. 24, 2002
6498394 IC packages with diamond substrate thermal conductor Dec. 24, 2002
6495083 Method of underfilling an integrated circuit chip Dec. 17, 2002
6495908 Multi-chip semiconductor package Dec. 17, 2002
6492739 Semiconductor device having bumper portions integral with a heat sink Dec. 10, 2002
6489178 Method of fabricating a molded package for micromechanical devices Dec. 3, 2002
6486536 U-shape tape for BOC FBGA package to improve moldability Nov. 26, 2002
6486543 Packaged semiconductor device having bent leads Nov. 26, 2002
6486564 Heat dissipation module for a BGA IC Nov. 26, 2002
6482675 Substrate strip for use in packaging semiconductor chips and method for making the substrate strip Nov. 19, 2002
6483039 Substrate of semiconductor package Nov. 19, 2002
6483177 Leaded semiconductor packages and method of trimming and singulating such packages Nov. 19, 2002
6479322 Semiconductor device with two stacked chips in one resin body and method of producing Nov. 12, 2002
6479888 Semiconductor device and a method of manufacturing the same Nov. 12, 2002
6476466 Ball grid array type semiconductor package having a flexible substrate Nov. 5, 2002
6476469 Quad flat non-leaded package structure for housing CMOS sensor Nov. 5, 2002
6476479 Semiconductor device and method of fabricating the same Nov. 5, 2002
6476507 Resin sealing method and resin sealing apparatus Nov. 5, 2002
6472252 Methods for ball grid array (BGA) encapsulation mold Oct. 29, 2002
6473310 Insulated power multichip package Oct. 29, 2002
6473311 Gate area relief strip for a molded I/C package Oct. 29, 2002
6468832 Method to encapsulate bumped integrated circuit to create chip scale package Oct. 22, 2002
6469369 Leadframe having a mold inflow groove and method for making Oct. 22, 2002
6465277 Molding apparatus and molding method for flexible substrate based package Oct. 15, 2002
6460245 Method of fabricating semiconductor chip assemblies Oct. 8, 2002
6458627 Semiconductor chip package and method of fabricating same Oct. 1, 2002
6458628 Methods of encapsulating a semiconductor chip using a settable encapsulant Oct. 1, 2002
6458629 High-frequency module, method of manufacturing thereof and method of molding resin Oct. 1, 2002
6458681 Method for providing void free layer for semiconductor assemblies Oct. 1, 2002
6451629 Leadframe alteration to direct compound flow into package Sep. 17, 2002
6452268 Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body Sep. 17, 2002
6446933 Film on a surface of a mold used during semiconductor device fabrication Sep. 10, 2002
6448111 Method of manufacturing a semiconductor device Sep. 10, 2002
6448665 Semiconductor package and manufacturing method thereof Sep. 10, 2002
6444497 Method and apparatus for reducing BGA warpage caused by encapsulation Sep. 3, 2002
6444501 Two stage transfer molding method to encapsulate MMC module Sep. 3, 2002
6438826 Electronic component, method of sealing electronic component with resin, and apparatus therefor Aug. 27, 2002
6440772 Bow resistant plastic semiconductor package and method of fabrication Aug. 27, 2002
6440774 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same Aug. 27, 2002
6441400 Semiconductor device and method of fabricating the same Aug. 27, 2002
6441501 Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep Aug. 27, 2002
6441503 Bond wire pressure sensor die package Aug. 27, 2002
6437428 Ball grid array type semiconductor package having a flexible substrate Aug. 20, 2002
6432751 Resin mold electric part and producing method therefor Aug. 13, 2002
6433285 Printed wiring board, IC card module using the same, and method for producing IC card module Aug. 13, 2002
6433418 Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism Aug. 13, 2002
6433420 Semiconductor package with heat sink having air vent Aug. 13, 2002
6429515 Long wire IC package Aug. 6, 2002
6428300 Ultra mold for encapsulating very thin packages Aug. 6, 2002
6428731 Mould part, mould and method for encapsulating electronic components mounted on a carrier Aug. 6, 2002

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