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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.

Patents under this class:

Patent Number Title Of Patent Date Issued
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8685766 Solid element device and method for manufacturing the same Apr. 1, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8652866 Sensor device and method Feb. 18, 2014
8648470 Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Feb. 11, 2014
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof Dec. 17, 2013
8609472 Process for fabricating electronic components using liquid injection molding Dec. 17, 2013
8609470 Semiconducting sheet Dec. 17, 2013
8581382 Integrated circuit packaging system with leadframe and method of manufacture thereof Nov. 12, 2013
8563998 Optoelectronic semiconductor component and method of producing an optoelectronic semiconductor component Oct. 22, 2013
8546959 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device Oct. 1, 2013
8541889 Probe card including frame and cover plate for testing a semiconductor device Sep. 24, 2013
8536717 Integrated circuit package and method of assembling an integrated circuit package Sep. 17, 2013
8530250 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Sep. 10, 2013
8501517 Method of assembling pressure sensor device Aug. 6, 2013
8436457 Stub minimization for multi-die wirebond assemblies with parallel windows May. 7, 2013
8431441 Semiconductor package and method of manufacturing same Apr. 30, 2013
8420523 Chip packaging method and structure thereof Apr. 16, 2013
8399966 Inserts for directing molding compound flow and semiconductor die assemblies Mar. 19, 2013
8338922 Molded leadframe substrate semiconductor package Dec. 25, 2012
8338236 Vented substrate for semiconductor device Dec. 25, 2012
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8318513 Method of encapsulating light-emitting diode devices using bent frames Nov. 27, 2012
8309385 Inertial sensor, inertial sensor device and manufacturing method of the same Nov. 13, 2012
8298869 Resin package and production method thereof Oct. 30, 2012
8293575 Manufacturing method of semiconductor device Oct. 23, 2012
8293548 LED light module for street lamp and method of manufacturing same Oct. 23, 2012
8253235 Semiconductor packaging substrate improving capability of electrostatic dissipation Aug. 28, 2012
8236621 Mold resin sealing device and molding method Aug. 7, 2012
8232145 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Jul. 31, 2012
8217504 Article and panel comprising semiconductor chips, casting mold and methods of producing the same Jul. 10, 2012
8207022 Exposed die overmolded flip chip package method Jun. 26, 2012
8198718 Semiconductor device with stacked semiconductor chips Jun. 12, 2012
8193037 Integrated circuit packaging system with pad connection and method of manufacture thereof Jun. 5, 2012
8183675 Integrated circuit package-on-package system with anti-mold flash feature May. 22, 2012
8183092 Method of fabricating stacked semiconductor structure May. 22, 2012
8143730 Semiconductor device and method of manufacturing the same Mar. 27, 2012
8129849 Method of making semiconductor package with adhering portion Mar. 6, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8105883 Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method Jan. 31, 2012
8093694 Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures Jan. 10, 2012
8084301 Resin sheet, circuit device and method of manufacturing the same Dec. 27, 2011
8026618 Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape Sep. 27, 2011
8022519 System-in-a-package based flash memory card Sep. 20, 2011
8018075 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Sep. 13, 2011
8017449 Process for fabricating electronic components using liquid injection molding Sep. 13, 2011
8017445 Warpage-compensating die paddle design for high thermal-mismatched package construction Sep. 13, 2011
7998794 Resin molded semiconductor device and manufacturing method thereof Aug. 16, 2011
7968377 Integrated circuit protruding pad package system Jun. 28, 2011

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