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Class Information
Number: 257/E21.504
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Moulds (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56M.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608486 |
Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
Oct. 27, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
May. 26, 2009 |
| 7521799 |
Semiconductor device and method of manufacturing the same |
Apr. 21, 2009 |
| 7514300 |
Mold compound cap in a flip chip multi-matrix array package and process of making same |
Apr. 7, 2009 |
| 7507637 |
Method of manufacturing wafer level stack package |
Mar. 24, 2009 |
| 7504736 |
Semiconductor packaging mold and method of manufacturing semiconductor package using the same |
Mar. 17, 2009 |
| 7498193 |
Package with barrier wall and method for manufacturing the same |
Mar. 3, 2009 |
| 7489027 |
Accessible electronic storage apparatus |
Feb. 10, 2009 |
| 7488622 |
Method for producing a surface-mountable semiconductor component |
Feb. 10, 2009 |
| 7488620 |
Method of fabricating leadframe based flash memory cards including singulation by straight line cuts |
Feb. 10, 2009 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7411219 |
Uniform contact |
Aug. 12, 2008 |
| 7407832 |
Method for manufacturing semiconductor package |
Aug. 5, 2008 |
| 7335995 |
Microelectronic assembly having array including passive elements and interconnects |
Feb. 26, 2008 |
| 7319042 |
Method and apparatus for manufacture and inspection of semiconductor device |
Jan. 15, 2008 |
| 7312106 |
Method for encapsulating a chip having a sensitive surface |
Dec. 25, 2007 |
| 7294853 |
Substrate for mounting a semiconductor |
Nov. 13, 2007 |
| 7294533 |
Mold compound cap in a flip chip multi-matrix array package and process of making same |
Nov. 13, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7250687 |
Systems for degating packaged semiconductor devices with tape substrates |
Jul. 31, 2007 |
| 7241637 |
Method of producing LED bodies with the aid of a cross-sectional constriction |
Jul. 10, 2007 |
| 7202110 |
Embedded flat film molding |
Apr. 10, 2007 |
| 7193331 |
Semiconductor device and manufacturing process thereof |
Mar. 20, 2007 |
| 7129568 |
Chip package and electrical connection structure between chip and substrate |
Oct. 31, 2006 |
| 7091583 |
Method and structure for prevention leakage of substrate strip |
Aug. 15, 2006 |
| 7075172 |
Lead-frame for semiconductor devices |
Jul. 11, 2006 |
| 7067357 |
Semiconductor package and method of fabricating same |
Jun. 27, 2006 |
| 7060216 |
Tire pressure sensors and methods of making the same |
Jun. 13, 2006 |
| 7061080 |
Power module package having improved heat dissipating capability |
Jun. 13, 2006 |
| 7061082 |
Semiconductor die with attached heat sink and transfer mold |
Jun. 13, 2006 |
| 7061097 |
Semiconductor device and manufacturing method for the same |
Jun. 13, 2006 |
| 7061103 |
Chip package structure |
Jun. 13, 2006 |
| 7061120 |
Stackable semiconductor package having semiconductor chip within central through hole of substrate |
Jun. 13, 2006 |
| 7056770 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
Jun. 6, 2006 |
| 7057277 |
Chip package structure |
Jun. 6, 2006 |
| 7057297 |
Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods |
Jun. 6, 2006 |
| 7053467 |
Leadframe alteration to direct compound flow into package |
May. 30, 2006 |
| 7053483 |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
May. 30, 2006 |
| 7049166 |
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
May. 23, 2006 |
| 7049214 |
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors |
May. 23, 2006 |
| 7049684 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
May. 23, 2006 |
| 7049685 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
May. 23, 2006 |
| 7045395 |
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
May. 16, 2006 |
| 7042071 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
May. 9, 2006 |
| 7037760 |
Fabrication method of semiconductor integrated circuit device |
May. 2, 2006 |
| 7033857 |
Method of manufacturing a semiconductor device |
Apr. 25, 2006 |
| 7029256 |
Leadframe and method for removing cleaning compound flash from mold vents |
Apr. 18, 2006 |
| 7030504 |
Sectional molding system |
Apr. 18, 2006 |
| 7030505 |
Resin-sealed-type semiconductor device, and production process for producing such semiconductor device |
Apr. 18, 2006 |
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