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Class Information
Number: 257/E21.503
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo) > Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (epo)
Description: This subclass is indented under subclass E21.502. This subclass is substantially the same in scope as ECLA classification H01L21/56F.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710657 Semiconductor assembly and semiconductor package including a solder channel Apr. 29, 2014
8710651 Semiconductor device and method for manufacturing the same Apr. 29, 2014
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8674519 Microelectronic package and method of manufacturing same Mar. 18, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8669665 Flip-chip mounting substrate and flip-chip mounting method Mar. 11, 2014
8664771 Apparatuses and methods to enhance passivation and ILD reliability Mar. 4, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8647923 Method of manufacturing semiconductor device Feb. 11, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8629568 Semiconductor device cover mark Jan. 14, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8618648 Methods for flip chip stacking Dec. 31, 2013
8617923 Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device Dec. 31, 2013
8617922 Method of manufacturing semiconductor device Dec. 31, 2013
RE44629 Process for assembling an integrated circuit package having a substrate vent hole Dec. 10, 2013
8603859 Integrated circuit packaging system with dual side mold and method of manufacture thereof Dec. 10, 2013
8598698 Package substrate with an embedded stiffener Dec. 3, 2013
8597978 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Dec. 3, 2013
8586467 Method of mounting electronic component and mounting substrate Nov. 19, 2013
8581421 Semiconductor package manufacturing method and semiconductor package Nov. 12, 2013
8581403 Electronic component mounting structure, electronic component mounting method, and electronic component mounting board Nov. 12, 2013
8580673 Underfill flow guide structures and method of using same Nov. 12, 2013
8580614 Embedded wafer-level bonding approaches Nov. 12, 2013
8574966 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 5, 2013
8564012 Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses Oct. 22, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8552553 Semiconductor device Oct. 8, 2013
8541259 Semiconductor device and manufacturing method thereof Sep. 24, 2013
8531019 Heat dissipation methods and structures for semiconductor device Sep. 10, 2013
8530280 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof Sep. 10, 2013
8530277 Integrated circuit packaging system with package on package support and method of manufacture thereof Sep. 10, 2013
8525353 Microspring structures adapted for target device cooling Sep. 3, 2013
8525217 Method and device for resin coating Sep. 3, 2013
8524595 Semiconductor package structures Sep. 3, 2013
8518722 Method for detecting the under-fill void in flip chip BGA Aug. 27, 2013
8513063 Method for encapsulating microelectronic devices Aug. 20, 2013
8513057 Integrated circuit packaging system with routable underlayer and method of manufacture thereof Aug. 20, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8497165 Systems and methods for lead frame locking design features Jul. 30, 2013
8492204 Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof Jul. 23, 2013
8492171 Techniques and structures for testing integrated circuits in flip-chip assemblies Jul. 23, 2013
8476135 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Jul. 2, 2013
8471373 Resin-sealed semiconductor device and method for fabricating the same Jun. 25, 2013
8470621 Method for fabricating a flip-chip semiconductor optoelectronic device Jun. 25, 2013
8466552 Semiconductor device and method of manufacturing the same Jun. 18, 2013
8461698 PCB external ground plane via conductive coating Jun. 11, 2013











 
 
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