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Class Information
Number: 257/E21.502
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/56.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615410 |
Chip-sized flip-chip semiconductor package and method for making the same |
Nov. 10, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7615414 |
Dental intraoral radiological image sensor with a fiber-optic plate |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608487 |
B-stageable underfill encapsulant and method for its application |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7598126 |
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips |
Oct. 6, 2009 |
| 7595225 |
Leadless plastic chip carrier with contact standoff |
Sep. 29, 2009 |
| 7579674 |
Semiconductor package configuration with improved lead portion arrangement |
Aug. 25, 2009 |
| 7576403 |
Method of manufacturing infrared rays receiver and structure thereof |
Aug. 18, 2009 |
| 7572679 |
Heat extraction from packaged semiconductor chips, scalable with chip area |
Aug. 11, 2009 |
| 7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same |
Aug. 11, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
Jul. 21, 2009 |
| 7556984 |
Package structure of chip and the package method thereof |
Jul. 7, 2009 |
| 7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
Jun. 16, 2009 |
| 7547975 |
Module with embedded semiconductor IC and method of fabricating the module |
Jun. 16, 2009 |
| 7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
Jun. 9, 2009 |
| 7534663 |
Method for manufacturing a surface mount device |
May. 19, 2009 |
| 7528077 |
Semiconductor device and method for manufacturing the same |
May. 5, 2009 |
| 7527991 |
Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
May. 5, 2009 |
| 7524775 |
Method for producing a dielectric layer for an electronic component |
Apr. 28, 2009 |
| 7517728 |
Semiconductor light emitting devices including a luminescent conversion element |
Apr. 14, 2009 |
| 7517790 |
Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
Apr. 14, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7508083 |
Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same |
Mar. 24, 2009 |
| 7504285 |
Carrierless chip package for integrated circuit devices, and methods of making same |
Mar. 17, 2009 |
| 7501696 |
Semiconductor chip-embedded substrate and method of manufacturing same |
Mar. 10, 2009 |
| 7498193 |
Package with barrier wall and method for manufacturing the same |
Mar. 3, 2009 |
| 7498201 |
Method of forming a multi-die semiconductor package |
Mar. 3, 2009 |
| 7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
Feb. 24, 2009 |
| 7488622 |
Method for producing a surface-mountable semiconductor component |
Feb. 10, 2009 |
| 7482251 |
Etch before grind for semiconductor die singulation |
Jan. 27, 2009 |
| 7479412 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
Jan. 20, 2009 |
| 7479690 |
Semiconductor device |
Jan. 20, 2009 |
| 7476563 |
Method of packaging a device using a dielectric layer |
Jan. 13, 2009 |
| 7473584 |
Method for fabricating a fan-in leadframe semiconductor package |
Jan. 6, 2009 |
| 7473586 |
Method of forming flip-chip bump carrier type package |
Jan. 6, 2009 |
| 7465607 |
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package |
Dec. 16, 2008 |
| 7459349 |
Method of forming a stack of semiconductor packages |
Dec. 2, 2008 |
| 7449369 |
Integrated circuit package system with multiple molding |
Nov. 11, 2008 |
| 7445958 |
Semiconductor device having a leading wiring layer |
Nov. 4, 2008 |
| 7432133 |
Plastic packaged device with die interface layer |
Oct. 7, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same |
Sep. 2, 2008 |
| 7407894 |
Compound semiconductor particles and production process therefor |
Aug. 5, 2008 |
| 7402459 |
Quad flat no-lead (QFN) chip package assembly apparatus and method |
Jul. 22, 2008 |
| 7393716 |
Encapsulated organic semiconductor device and method |
Jul. 1, 2008 |
| 7393712 |
Fluidic MEMS device |
Jul. 1, 2008 |
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