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Class Information
Number: 257/E21.502
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/56.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.503 Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (epo) 1,653
257/E21.504 Moulds (epo) 1,093


Patents under this class:

Patent Number Title Of Patent Date Issued
8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Apr. 29, 2014
8710668 Integrated circuit packaging system with laser hole and method of manufacture thereof Apr. 29, 2014
8710609 Semiconductor arrangement with a solder resist layer Apr. 29, 2014
8709831 Integrated circuits with magnetic core inductors and methods of fabrications thereof Apr. 29, 2014
8703546 Activation treatments in plating processes Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Apr. 8, 2014
8691625 Method for making a chip package Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8685790 Semiconductor device package having backside contact and method for manufacturing Apr. 1, 2014
8674462 Sensor package Mar. 18, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8669655 Chip package and a method for manufacturing a chip package Mar. 11, 2014
8669137 Copper post solder bumps on substrate Mar. 11, 2014
8664762 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package Mar. 4, 2014
8664043 Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Mar. 4, 2014
8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Feb. 25, 2014
8659127 Wiring substrate, semiconductor device and manufacturing method thereof Feb. 25, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8658468 Method for fabricating a semiconductor and semiconductor package Feb. 25, 2014
8653674 Electronic component package fabrication method and structure Feb. 18, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8653661 Package having MEMS element and fabrication method thereof Feb. 18, 2014
8652880 Semiconductor device and method of manufacturing same Feb. 18, 2014
8648470 Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Feb. 11, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8642394 Method of manufacturing electronic device on leadframe Feb. 4, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8633057 Semiconductor package and method of fabricating the same Jan. 21, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8629545 Stub minimization for assemblies without wirebonds to package substrate Jan. 14, 2014
8629003 Epoxy encapsulating and lamination adhesive and method of making same Jan. 14, 2014
8629002 Manufacturing method of semiconductor device Jan. 14, 2014
8623701 Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus Jan. 7, 2014
8623678 Method for manufacturing LED Jan. 7, 2014
8618645 Package process and package structure Dec. 31, 2013
8617935 Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages Dec. 31, 2013
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Dec. 31, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8609469 Method of manufacturing semiconductor device Dec. 17, 2013
8604627 Semiconductor device Dec. 10, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8604568 Multi-chip package Dec. 10, 2013
8603863 Method of manufacturing card Dec. 10, 2013
8603859 Integrated circuit packaging system with dual side mold and method of manufacture thereof Dec. 10, 2013











 
 
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