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Class Information
Number: 257/E21.502
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Encapsulation, e.g., encapsulation layer, coating (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/56.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432133 |
Plastic packaged device with die interface layer |
Oct. 7, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same |
Sep. 2, 2008 |
| 7407894 |
Compound semiconductor particles and production process therefor |
Aug. 5, 2008 |
| 7402459 |
Quad flat no-lead (QFN) chip package assembly apparatus and method |
Jul. 22, 2008 |
| 7393711 |
Method of producing a digital fingerprint sensor and the corresponding sensor |
Jul. 1, 2008 |
| 7393712 |
Fluidic MEMS device |
Jul. 1, 2008 |
| 7393716 |
Encapsulated organic semiconductor device and method |
Jul. 1, 2008 |
| 7387914 |
Semiconductor device and process for fabrication thereof |
Jun. 17, 2008 |
| 7384822 |
Package for semiconductor components and method for producing the same |
Jun. 10, 2008 |
| 7371610 |
Process for fabricating an integrated circuit package with reduced mold warping |
May. 13, 2008 |
| 7352071 |
Method of fabricating anti-warp package |
Apr. 1, 2008 |
| 7348220 |
Resin-encapsulated type semiconductor packages, and production method and apparatus therefor |
Mar. 25, 2008 |
| 7332375 |
Method of making an integrated circuit package |
Feb. 19, 2008 |
| 7329563 |
Method for fabrication of wafer level package incorporating dual compliant layers |
Feb. 12, 2008 |
| 7314778 |
Wafer-level processing of chip-packaging compositions including bis-maleimides |
Jan. 1, 2008 |
| 7300823 |
Apparatus for housing a micromechanical structure and method for producing the same |
Nov. 27, 2007 |
| 7297624 |
Semiconductor device and method for fabricating the same |
Nov. 20, 2007 |
| 7288441 |
Method for two-stage transfer molding device to encapsulate MMC module |
Oct. 30, 2007 |
| 7285444 |
Method of manufacturing semiconductor device |
Oct. 23, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7271039 |
Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method |
Sep. 18, 2007 |
| 7271037 |
Leadframe alteration to direct compound flow into package |
Sep. 18, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7259449 |
Method and system for sealing a substrate |
Aug. 21, 2007 |
| 7253026 |
Ultra-thin semiconductor package device and method for manufacturing the same |
Aug. 7, 2007 |
| 7247521 |
Semiconductor assembly encapsulation mold and method for forming same |
Jul. 24, 2007 |
| 7226812 |
Wafer support and release in wafer processing |
Jun. 5, 2007 |
| 7214562 |
Method for encapsulating lead frame packages |
May. 8, 2007 |
| 7208345 |
Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
Apr. 24, 2007 |
| 7205170 |
Method for the production of LED bodies |
Apr. 17, 2007 |
| 7202107 |
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method |
Apr. 10, 2007 |
| 7193331 |
Semiconductor device and manufacturing process thereof |
Mar. 20, 2007 |
| 7179688 |
Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method |
Feb. 20, 2007 |
| 7179689 |
Package stress management |
Feb. 20, 2007 |
| 7172927 |
Warpage control of array packaging |
Feb. 6, 2007 |
| 7163846 |
Method for manufacturing circuit devices |
Jan. 16, 2007 |
| 7160756 |
Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices |
Jan. 9, 2007 |
| 7157310 |
Methods for packaging microfeature devices and microfeature devices formed by such methods |
Jan. 2, 2007 |
| 7122407 |
Method for fabricating window ball grid array semiconductor package |
Oct. 17, 2006 |
| 7074651 |
Packaging method for integrated circuits |
Jul. 11, 2006 |
| 7071028 |
Semiconductor device and its manufacturing method |
Jul. 4, 2006 |
| 7064010 |
Methods of coating and singulating wafers |
Jun. 20, 2006 |
| 7064047 |
Semiconductor device having a ball grid array and a fabrication process thereof |
Jun. 20, 2006 |
| 7061120 |
Stackable semiconductor package having semiconductor chip within central through hole of substrate |
Jun. 13, 2006 |
| 7041531 |
Method of fabricating flip chip ball grid array package |
May. 9, 2006 |
| 7037761 |
Method of producing an electronic component |
May. 2, 2006 |
| 7034383 |
Electronic component and panel and method for producing the same |
Apr. 25, 2006 |
| 7029948 |
Electrical or electronic component and method of producing same |
Apr. 18, 2006 |
| 7022552 |
Semiconductor device and method for fabricating semiconductor device |
Apr. 4, 2006 |
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