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Class Information
Number: 257/E21.501
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Providing fillings in container, e.g., gas fillings (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/54.

Patents under this class:

Patent Number Title Of Patent Date Issued
8664047 Integrated circuit tampering protection and reverse engineering prevention coatings and methods Mar. 4, 2014
8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Sep. 3, 2013
8525217 Method and device for resin coating Sep. 3, 2013
8450216 Contact etch stop layers of a field effect transistor May. 28, 2013
8314486 Integrated circuit packaging system with shield and method of manufacture thereof Nov. 20, 2012
8120155 Reduced stiction and mechanical memory in MEMS devices Feb. 21, 2012
8071987 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component Dec. 6, 2011
8026595 Semiconductor device having hermitically sealed active area and electrodes Sep. 27, 2011
7985606 Method of manufacturing light emitting device Jul. 26, 2011
7985630 Method for manufacturing semiconductor module Jul. 26, 2011
7964448 Electronic device and method of manufacturing same Jun. 21, 2011
7910404 Method of manufacturing a stacked die module Mar. 22, 2011
7871860 Method of semiconductor packaging Jan. 18, 2011
7790484 Method for manufacturing laser devices Sep. 7, 2010
7781263 Systems, devices, and methods for semiconductor device temperature management Aug. 24, 2010
7741162 Method for manufacturing high-frequency module device Jun. 22, 2010
7652369 Integrated circuit package and apparatus and method of producing an integrated circuit package Jan. 26, 2010
7629201 Method for fabricating a wafer level package with device wafer and passive component integration Dec. 8, 2009
7563635 Electronic device and method of manufacturing the same Jul. 21, 2009
7436056 Electronic component package Oct. 14, 2008
7387902 Methods for packaging image sensitive electronic devices Jun. 17, 2008
7173331 Hermetic sealing cap and method of manufacturing the same Feb. 6, 2007
6953706 Method of providing a semiconductor package having an internal heat-activated hydrogen source Oct. 11, 2005
6888232 Semiconductor package having a heat-activated source of releasable hydrogen May. 3, 2005
6882041 Thermally enhanced metal capped BGA package Apr. 19, 2005
6826829 Method for attaching a die with a low melting metal Dec. 7, 2004
6570261 Method and apparatus for injection molded flip chip encapsulation May. 27, 2003
6457228 Method for sealing liquid coolant into module Oct. 1, 2002
6445062 Semiconductor device having a flip chip cavity with lower stress and method for forming same Sep. 3, 2002
6369449 Method and apparatus for injection molded flip chip encapsulation Apr. 9, 2002
6016006 Thermal grease insertion and retention Jan. 18, 2000
5981312 Method for injection molded flip chip encapsulation Nov. 9, 1999
5976916 Method of producing semiconductor device and encapsulating pellet employed therein Nov. 2, 1999
5834835 Semiconductor device having an improved structure for storing a semiconductor chip Nov. 10, 1998
5477611 Method of forming interface between die and chip carrier Dec. 26, 1995
5477084 Microelectronic device packaging containing a liquid and method Dec. 19, 1995
5413965 Method of making microelectronic device package containing a liquid May. 9, 1995
5318926 Method for packaging an integrated circuit using a reconstructed plastic package Jun. 7, 1994
5173766 Semiconductor device package and method of making such a package Dec. 22, 1992
5067008 IC package and IC card incorporating the same thereinto Nov. 19, 1991
4250347 Method of encapsulating microelectronic elements Feb. 10, 1981

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