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Browse by Category: Main > Physics
Class Information
Number: 257/E21.5
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Mounting semiconductor bodies in container (epo)
Description: This subclass is indented under subclass E21.499. This subclass is substantially the same in scope as ECLA classification H01L21/52.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8709913 Simultaneous wafer bonding and interconnect joining Apr. 29, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8679900 Integrated circuit packaging system with heat conduction and method of manufacture thereof Mar. 25, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8618619 Top port with interposer MEMS microphone package and method Dec. 31, 2013
8597984 Modular low stress package technology Dec. 3, 2013
8592821 Semiconductor element, organic transistor, light-emitting device, and electronic device Nov. 26, 2013
8546895 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Oct. 1, 2013
8502252 Optoelectronic component, and method for the production of an optoelectronic component Aug. 6, 2013
8497216 Micromechanical component Jul. 30, 2013
8497515 LED device with thermoelectric module Jul. 30, 2013
8486744 Multiple bonding in wafer level packaging Jul. 16, 2013
8487443 Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device Jul. 16, 2013
8450216 Contact etch stop layers of a field effect transistor May. 28, 2013
8426253 Potted integrated circuit device with aluminum case Apr. 23, 2013
8394679 Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture Mar. 12, 2013
8367469 Chip-scale semiconductor die packaging method Feb. 5, 2013
8334172 Manufacturing method of semiconductor device Dec. 18, 2012
8324023 Stacked-die electronics package with planar and three-dimensional inductor elements Dec. 4, 2012
8314484 Semiconductor device and method of manufacturing the same Nov. 20, 2012
8314486 Integrated circuit packaging system with shield and method of manufacture thereof Nov. 20, 2012
8309403 Method for encapsulating electronic components on a wafer Nov. 13, 2012
8298862 Method of manufacturing layered chip package Oct. 30, 2012
8299589 Packaging device of image sensor Oct. 30, 2012
8247247 Method of manufacturing LED module Aug. 21, 2012
8222066 Eliminate release etch attack by interface modification in sacrificial layers Jul. 17, 2012
8217514 Integrated circuit packaging system with warpage control system and method of manufacture thereof Jul. 10, 2012
8198108 Semiconductor device and method for manufacturing the same Jun. 12, 2012
8178371 Solid-state lasers May. 15, 2012
8153474 Modular low stress package technology Apr. 10, 2012
8110434 Semiconductor device and memory card using the same Feb. 7, 2012
8093086 Packaged device and method of manufacturing the same Jan. 10, 2012
8088647 Bumping free flip chip process Jan. 3, 2012
8080445 Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers Dec. 20, 2011
8076184 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Dec. 13, 2011
8071987 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component Dec. 6, 2011
8043881 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Oct. 25, 2011
8026595 Semiconductor device having hermitically sealed active area and electrodes Sep. 27, 2011
8021927 Die down ball grid array packages and method for making same Sep. 20, 2011
8003446 Flexible diode package and method of manufacturing Aug. 23, 2011
7985630 Method for manufacturing semiconductor module Jul. 26, 2011
7986034 Power semiconductor module and method for producing the same Jul. 26, 2011
7981722 Semiconductor device and fabrication method thereof Jul. 19, 2011
7956382 Method and system for magnetically assisted statistical assembly of wafers Jun. 7, 2011
7901991 Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system Mar. 8, 2011
7901986 Wiring substrate, manufacturing method thereof, and semiconductor device Mar. 8, 2011
7892887 Semiconductor device and fabrication method thereof Feb. 22, 2011
7884461 System-in-package and manufacturing method of the same Feb. 8, 2011
7875942 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Jan. 25, 2011
7851263 Semiconductor device and method of manufacturing the same Dec. 14, 2010

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