Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E21.499
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo)
Description: This subclass is indented under subclass E21.04. This subclass is substantially the same in scope as ECLA classification H01L21/50.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.506 Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) 325
257/E21.502 Encapsulation, e.g., encapsulation layer, coating (epo) 1,149
257/E21.505 Insulative mounting semiconductor device on support (epo) 815
257/E21.5 Mounting semiconductor bodies in container (epo) 119
257/E21.501 Providing fillings in container, e.g., gas fillings (epo) 41


Patents under this class:

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710649 Wafer level package and fabrication method Apr. 29, 2014
8709957 Spalling utilizing stressor layer portions Apr. 29, 2014
8709913 Simultaneous wafer bonding and interconnect joining Apr. 29, 2014
8709875 Power device and method of packaging same Apr. 29, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8703533 Semiconductor package and method for manufacturing the same Apr. 22, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8693811 High data-rate SOI optical modulator including a modified structure for reducing the capacitive effect between doped areas and a substrate Apr. 8, 2014
8692371 Semiconductor apparatus and manufacturing method thereof Apr. 8, 2014
8691632 Wafer level package and fabrication method Apr. 8, 2014
8691628 Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus Apr. 8, 2014
8691627 Wafer level packaged GaN power device and manufacturing method thereof Apr. 8, 2014
8691624 Die fixing method and apparatus Apr. 8, 2014
8686570 Multi-dimensional integrated circuit structures and methods of forming the same Apr. 1, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8685791 Ribbon bonding in an electronic package Apr. 1, 2014
8685789 Ribbon bonding in an electronic package Apr. 1, 2014
8680684 Stackable microelectronic package structures Mar. 25, 2014
8680662 Wafer level edge stacking Mar. 25, 2014
8679898 Semiconductor device and production method therefor Mar. 25, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8674516 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Mar. 18, 2014
8674513 Interconnect structures for substrate Mar. 18, 2014
8674446 Electronic device including electrically conductive body for ESD protection and related methods Mar. 18, 2014
8674349 Resin film forming sheet for chip, and method for manufacturing semiconductor chip Mar. 18, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8669187 Porous lift-off layer for selective removal of deposited films Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664748 Package-level integrated circuit connection without top metal pads or bonding wire Mar. 4, 2014
8664699 Methods and devices for fabricating and assembling printable semiconductor elements Mar. 4, 2014
8664043 Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Mar. 4, 2014
8664039 Methods and apparatus for alignment in flip chip bonding Mar. 4, 2014
8664029 Process for fabricating a capacitance type tri-axial accelerometer Mar. 4, 2014
8659171 Patch on interposer assembly and structures formed thereby Feb. 25, 2014
8659160 Die structure, manufacturing method and substrate thereof Feb. 25, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8658472 Semiconductor device Feb. 25, 2014
8658466 Semiconductor package structure and method for making the same Feb. 25, 2014
8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Feb. 11, 2014
8648459 Nitride based semiconductor package and method of manufacturing the same and bonding substrate Feb. 11, 2014
8648448 Semiconductor device and method of shielding semiconductor die from inter-device interference Feb. 11, 2014
8647924 Semiconductor package and method of packaging semiconductor devices Feb. 11, 2014
8647899 Organic light emitting device and manufacturing method thereof Feb. 11, 2014











 
 
  Recently Added Patents
Seat post having a non-uniform cross-section
AC/DC converter
Method of measuring specific absorption rate of electromagnetic waves
Carrier for developing electrostatic charge image, developer for developing electrostatic charge image, image forming apparatus, and image forming method
Scalable header extension
Fuel cell module
Method and system for physical verification using network segment current
  Randomly Featured Patents
Electrophotographic photoconductor
Stirred tank biological activated carbon adsorption-desorption process
Method for performing inter-system handovers in a mobile communication system
Rose plant named `POULcs008`
Device for holding a mirror element for rearview mirror
Radio communicating apparatus
Garden bean cultivar H37112
Paper currency receiving and dispensing machine
Electric power steering system
Telecommunication switching system having distributed dialing plan hierarchy