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Class Information
Number: 257/E21.496
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than electromagnetic radiation (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition of noninsulating, e.g., conductive -, resistive -, layer on insulating layer (epo) > Post treatment of layer (epo)
Description: This subclass is indented under subclass E21.495. This subclass is substantially the same in scope as ECLA classification H01L21/4763B.










Patents under this class:

Patent Number Title Of Patent Date Issued
8569760 Thin film transistor having oxide semiconductor layer as ohmic contact layer and method of fabricating the same Oct. 29, 2013
8324090 Method to improve dielectric quality in high-k metal gate technology Dec. 4, 2012
8084361 Semiconductor fabrication method suitable for MEMS Dec. 27, 2011
8058143 Substrate bonding with metal germanium silicon material Nov. 15, 2011
7968461 Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method Jun. 28, 2011
7932175 Method to form a via Apr. 26, 2011
7919412 Over-passivation process of forming polymer layer over IC chip Apr. 5, 2011
7842596 Method for formation of high quality back contact with screen-printed local back surface field Nov. 30, 2010
7781889 Shielded via Aug. 24, 2010
7737029 Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby Jun. 15, 2010
7485575 Method of manufacturing semiconductor device Feb. 3, 2009
7456076 Techniques for forming passive devices during semiconductor back-end processing Nov. 25, 2008
7375023 Method and apparatus for chemical mechanical polishing of semiconductor substrates May. 20, 2008
7348653 Resistive memory cell, method for forming the same and resistive memory array using the same Mar. 25, 2008
5976962 Method of fabricating semiconductor device Nov. 2, 1999
5955384 Method of fabricating semiconductor device Sep. 21, 1999
5750437 Method of fabricating semiconductor device May. 12, 1998
5681779 Method of doping metal layers for electromigration resistance Oct. 28, 1997











 
 
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