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Class Information
Number: 257/E21.482
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than electromagnetic radiation (epo)
Description: This subclass is indented under subclass E21.459. This subclass is substantially the same in scope as ECLA classification H01L21/46.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.498 Application of electric current or fields, e.g., for electroforming (epo) 20
257/E21.497 Thermal treatment for modifying property of semiconductor body, e.g., annealing, sintering (epo) 84
257/E21.483 To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) 67


Patents under this class:

Patent Number Title Of Patent Date Issued
8551880 Ammonia-based plasma treatment for metal fill in narrow features Oct. 8, 2013
8528499 Substrate processing apparatus and method Sep. 10, 2013
8507307 Group IIB/VA semiconductors suitable for use in photovoltaic devices Aug. 13, 2013
8445352 Manufacturing method of semiconductor device May. 21, 2013
8431495 Stencil mask profile Apr. 30, 2013
8318585 Bonding method and bonding apparatus Nov. 27, 2012
8298915 Method of transferring a circuit onto a ground plane Oct. 30, 2012
8216945 Wafer planarity control between pattern levels Jul. 10, 2012
8084368 Method of forming barrier film Dec. 27, 2011
8058159 Method of making low work function component Nov. 15, 2011
8053335 Forming method of gallium nitride system compound semiconductor layer, transfer method of the same, and substrate structure with the same bonded thereto Nov. 8, 2011
8048774 Methods and systems for laser machining a substrate Nov. 1, 2011
8030192 Process for manufacturing a large-scale integration MOS device and corresponding MOS device Oct. 4, 2011
7998835 Strain-direct-on-insulator (SDOI) substrate and method of forming Aug. 16, 2011
7972963 Polished semiconductor wafer and process for producing it Jul. 5, 2011
7943488 Transfer method of functional region, LED array, LED printer head, and LED printer May. 17, 2011
7932163 Methods of forming stacked semiconductor devices with single-crystal semiconductor regions Apr. 26, 2011
7923378 Film formation method and apparatus for forming silicon-containing insulating film Apr. 12, 2011
7678688 Method for forming metal interconnection in image sensor Mar. 16, 2010
7557050 Method of manufacturing polysilicon thin film and method of manufacturing thin film transistor having the same Jul. 7, 2009
7517817 Method for forming a silicon oxide layer using spin-on glass Apr. 14, 2009
7470600 Method and device for controlled cleaving process Dec. 30, 2008
7459375 Transfer method for forming a silicon-on-plastic wafer Dec. 2, 2008
7348258 Method and device for controlled cleaving process Mar. 25, 2008
7344958 Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications Mar. 18, 2008
7291542 Semiconductor wafer and manufacturing method thereof Nov. 6, 2007
6143630 Method of impurity gettering Nov. 7, 2000
6043113 Method of forming self-aligned thin film transistor Mar. 28, 2000
5368880 Eutectic bond and method of gold/titanium eutectic bonding of cadmium telluride to sapphire Nov. 29, 1994











 
 
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