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Class Information
Number: 257/E21.48
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo) > Involving application of pressure, e.g., thermo compression bonding (epo)
Description: This subclass is indented under subclass E21.476. This subclass is substantially the same in scope as ECLA classification H01L21/447.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8686554 |
Vertically mountable semiconductor device package |
Apr. 1, 2014 |
| 8674382 |
Semiconductor light emitting device comprising heterojunction |
Mar. 18, 2014 |
| 8617915 |
Annealing thin films |
Dec. 31, 2013 |
| 8575005 |
Method of manufacturing an electronic device having a plastic substrate and corresponding carrier |
Nov. 5, 2013 |
| 8530336 |
Method for manufacturing semiconductor substrate |
Sep. 10, 2013 |
| 8485416 |
Bonding process and bonded structures |
Jul. 16, 2013 |
| 8357974 |
Semiconductor on glass substrate with stiffening layer and process of making the same |
Jan. 22, 2013 |
| 8241932 |
Methods of fabricating light emitting diode packages |
Aug. 14, 2012 |
| 8236666 |
Semiconductor device and process for producing same |
Aug. 7, 2012 |
| 8158493 |
Laser-based material processing methods and systems |
Apr. 17, 2012 |
| 8017446 |
Method for manufacturing a rigid power module suited for high-voltage applications |
Sep. 13, 2011 |
| 8008164 |
Wafer bonding method and wafer structure |
Aug. 30, 2011 |
| 7947602 |
Conductive pattern formation method |
May. 24, 2011 |
| 7923841 |
Method for bonding semiconductor structure with substrate and high efficiency photonic device manufactured by using the same method |
Apr. 12, 2011 |
| 7897481 |
High throughput die-to-wafer bonding using pre-alignment |
Mar. 1, 2011 |
| 7879690 |
Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns |
Feb. 1, 2011 |
| 7809461 |
Working apparatus and working method for circuit board |
Oct. 5, 2010 |
| 7790565 |
Semiconductor on glass insulator made using improved thinning process |
Sep. 7, 2010 |
| 7759220 |
Method and structure for fabricating solar cells using a layer transfer process |
Jul. 20, 2010 |
| 7759221 |
Methods for packaging microelectronic devices and microelectronic devices formed using such methods |
Jul. 20, 2010 |
| 7741208 |
Method for making a wedge wedge wire loop |
Jun. 22, 2010 |
| 7691672 |
Substrate treating method and method of manufacturing semiconductor apparatus |
Apr. 6, 2010 |
| 7642135 |
Thermal mechanical flip chip die bonding |
Jan. 5, 2010 |
| 7605053 |
Glass-based SOI structures |
Oct. 20, 2009 |
| 7605050 |
Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same |
Oct. 20, 2009 |
| 7476619 |
Semiconductor device |
Jan. 13, 2009 |
| 7462943 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Dec. 9, 2008 |
| 7442622 |
Silicon direct bonding method |
Oct. 28, 2008 |
| 7399681 |
Glass-based SOI structures |
Jul. 15, 2008 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7244636 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Jul. 17, 2007 |
| 7192844 |
Glass-based SOI structures |
Mar. 20, 2007 |
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