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Class Information
Number: 257/E21.48
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo) > Involving application of pressure, e.g., thermo compression bonding (epo)
Description: This subclass is indented under subclass E21.476. This subclass is substantially the same in scope as ECLA classification H01L21/447.










Patents under this class:

Patent Number Title Of Patent Date Issued
8686554 Vertically mountable semiconductor device package Apr. 1, 2014
8674382 Semiconductor light emitting device comprising heterojunction Mar. 18, 2014
8617915 Annealing thin films Dec. 31, 2013
8575005 Method of manufacturing an electronic device having a plastic substrate and corresponding carrier Nov. 5, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8485416 Bonding process and bonded structures Jul. 16, 2013
8357974 Semiconductor on glass substrate with stiffening layer and process of making the same Jan. 22, 2013
8241932 Methods of fabricating light emitting diode packages Aug. 14, 2012
8236666 Semiconductor device and process for producing same Aug. 7, 2012
8158493 Laser-based material processing methods and systems Apr. 17, 2012
8017446 Method for manufacturing a rigid power module suited for high-voltage applications Sep. 13, 2011
8008164 Wafer bonding method and wafer structure Aug. 30, 2011
7947602 Conductive pattern formation method May. 24, 2011
7923841 Method for bonding semiconductor structure with substrate and high efficiency photonic device manufactured by using the same method Apr. 12, 2011
7897481 High throughput die-to-wafer bonding using pre-alignment Mar. 1, 2011
7879690 Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns Feb. 1, 2011
7809461 Working apparatus and working method for circuit board Oct. 5, 2010
7790565 Semiconductor on glass insulator made using improved thinning process Sep. 7, 2010
7759220 Method and structure for fabricating solar cells using a layer transfer process Jul. 20, 2010
7759221 Methods for packaging microelectronic devices and microelectronic devices formed using such methods Jul. 20, 2010
7741208 Method for making a wedge wedge wire loop Jun. 22, 2010
7691672 Substrate treating method and method of manufacturing semiconductor apparatus Apr. 6, 2010
7642135 Thermal mechanical flip chip die bonding Jan. 5, 2010
7605053 Glass-based SOI structures Oct. 20, 2009
7605050 Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same Oct. 20, 2009
7476619 Semiconductor device Jan. 13, 2009
7462943 Semiconductor assembly for improved device warpage and solder ball coplanarity Dec. 9, 2008
7442622 Silicon direct bonding method Oct. 28, 2008
7399681 Glass-based SOI structures Jul. 15, 2008
7307005 Wafer bonding with highly compliant plate having filler material enclosed hollow core Dec. 11, 2007
7244636 Semiconductor assembly for improved device warpage and solder ball coplanarity Jul. 17, 2007
7192844 Glass-based SOI structures Mar. 20, 2007











 
 
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