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Class Information
Number: 257/E21.477
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo) > Deposition of conductive or insulating materials for electrode (epo)
Description: This subclass is indented under subclass E21.476. This subclass is substantially the same in scope as ECLA classification H01L21/441.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.478 From gas or vapor, e.g., condensation (epo) 56
257/E21.479 From liquid, e.g., electrolytic deposition (epo) 47


Patents under this class:
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Patent Number Title Of Patent Date Issued
8624620 Test system and write wafer Jan. 7, 2014
8618537 Semiconductor device and method for manufacturing the same Dec. 31, 2013
8592312 Method for depositing a conductive capping layer on metal lines Nov. 26, 2013
8513674 Semiconductor device and method of manufacturing the same Aug. 20, 2013
8513804 Nanotube-based electrodes Aug. 20, 2013
8507379 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8501613 UBM etching methods for eliminating undercut Aug. 6, 2013
8440556 Forming conformal metallic platinum zinc films for semiconductor devices May. 14, 2013
8431997 Memory element and semiconductor device and method for manufacturing the same Apr. 30, 2013
8431484 Stable electroless fine pitch interconnect plating Apr. 30, 2013
8431463 Capacitor contact formed concurrently with bond pad metallization Apr. 30, 2013
8362613 Flip chip device having simplified routing Jan. 29, 2013
8329583 Metal precursors for semiconductor applications Dec. 11, 2012
8283724 Memory element and semiconductor device, and method for manufacturing the same Oct. 9, 2012
8258053 Performance enhancement in transistors comprising high-K metal gate stack by reducing a width of offset spacers Sep. 4, 2012
8247320 Process for producing electrodes for solar cells Aug. 21, 2012
8236598 Layered contact structure for solar cells Aug. 7, 2012
8088678 Semiconductor manufacturing apparatus and method Jan. 3, 2012
8017527 Method and apparatus to reduce defects in liquid based PECVD films Sep. 13, 2011
8012798 Method of fabricating stacked semiconductor chips Sep. 6, 2011
7951711 Metal precursors for semiconductor applications May. 31, 2011
7892975 Method for selectively forming electric conductor and method for manufacturing semiconductor device Feb. 22, 2011
7893442 Schottky diode having low breakdown voltage and method for fabricating the same Feb. 22, 2011
7884032 Thin film deposition Feb. 8, 2011
7879715 Methods of forming electronic structures including conductive shunt layers and related structures Feb. 1, 2011
7842596 Method for formation of high quality back contact with screen-printed local back surface field Nov. 30, 2010
7781352 Method for forming inorganic silazane-based dielectric film Aug. 24, 2010
7776742 Film-forming method Aug. 17, 2010
7754596 Semiconductor device preventing electrical short and method of manufacturing the same Jul. 13, 2010
7749901 Method for forming a tapered via of a semiconductor device Jul. 6, 2010
7713867 Method for forming a metal line in a semiconductor device May. 11, 2010
7713886 Film forming apparatus, film forming method, program and storage medium May. 11, 2010
7714354 Electroformed metal structure May. 11, 2010
7687390 Manufacturing method of a transparent conductive film, a manufacturing method of a transparent electrode of an organic electroluminescence device, an organic electroluminescence device and the Mar. 30, 2010
7656020 Packaging conductive structure for a semiconductor substrate having a metallic layer Feb. 2, 2010
7651943 Forming diffusion barriers by annealing copper alloy layers Jan. 26, 2010
7622384 Method of making multi-chip electronic package with reduced line skew Nov. 24, 2009
7592273 Semiconductor device with hydrogen barrier and method therefor Sep. 22, 2009
7589020 Method for depositing titanium nitride films for semiconductor manufacturing Sep. 15, 2009
7585736 Method of manufacturing semiconductor device with regard to film thickness of gate oxide film Sep. 8, 2009
7579276 Substrate processing apparatus and method of manufacturing semiconductor device Aug. 25, 2009
7576011 Method of forming contact plug in semiconductor Aug. 18, 2009
7541275 Method for manufacturing an interconnect Jun. 2, 2009
7494941 Manufacturing method of semiconductor device, and substrate processing apparatus Feb. 24, 2009
7473634 Method for integrated substrate processing in copper metallization Jan. 6, 2009
7465676 Method for forming dielectric film to improve adhesion of low-k film Dec. 16, 2008
7442637 Method for processing IC designs for different metal BEOL processes Oct. 28, 2008
7413971 Method of producing a layered arrangement and layered arrangement Aug. 19, 2008
7381646 Method for using a Cu BEOL process to fabricate an integrated circuit (IC) originally having an al design Jun. 3, 2008
7306962 Electroformed metallization Dec. 11, 2007

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