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Class Information
Number: 257/E21.476
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo)
Description: This subclass is indented under subclass E21.459. This subclass is substantially the same in scope as ECLA classification H01L21/44.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.477 Deposition of conductive or insulating materials for electrode (epo) 71
257/E21.481 Including application of mechanical vibration, e.g., ultrasonic vibration (epo) 6
257/E21.48 Involving application of pressure, e.g., thermo compression bonding (epo) 32


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7727884 Methods of forming a semiconductor device including a phase change material layer Jun. 1, 2010
7704869 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias Apr. 27, 2010
7705457 Wafer level semiconductor package and method for manufacturing the same Apr. 27, 2010
7696019 Semiconductor devices and methods of manufacturing thereof Apr. 13, 2010
7696080 Method for manufacturing SIP semiconductor device Apr. 13, 2010
7691720 Vertical nanotube semiconductor device structures and methods of forming the same Apr. 6, 2010
7687390 Manufacturing method of a transparent conductive film, a manufacturing method of a transparent electrode of an organic electroluminescence device, an organic electroluminescence device and the Mar. 30, 2010
7678705 Plasma semiconductor processing system and method Mar. 16, 2010
7667316 Semiconductor integrated circuit and method for manufacturing the same Feb. 23, 2010
7663239 Semiconductor device and method for fabricating the same Feb. 16, 2010
7659620 Integrated circuit package employing a flexible substrate Feb. 9, 2010
7648894 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor de Jan. 19, 2010
7633165 Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV Dec. 15, 2009
7618891 Method for forming self-aligned metal silicide contacts Nov. 17, 2009
7595269 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Sep. 29, 2009
7589010 Semiconductor devices with permanent polymer stencil and method for manufacturing the same Sep. 15, 2009
7585783 Drop discharge apparatus, method for forming pattern and method for manufacturing semiconductor device Sep. 8, 2009
7579225 Method of forming semiconductor device having stacked transistors Aug. 25, 2009
7575956 Fabrication method for semiconductor package heat spreaders Aug. 18, 2009
7573130 Crack trapping and arrest in thin film structures Aug. 11, 2009
7566648 Method of making solder pad Jul. 28, 2009
7563704 Method of forming an interconnect including a dielectric cap having a tensile stress Jul. 21, 2009
7563725 Method of depositing materials on a non-planar surface Jul. 21, 2009
7541250 Method for forming a self-aligned twin well region with simplified processing Jun. 2, 2009
7517783 Molybdenum-doped indium oxide structures and methods Apr. 14, 2009
7517798 Methods for forming through-wafer interconnects and structures resulting therefrom Apr. 14, 2009
7518142 Encapsulation for organic device Apr. 14, 2009
7511998 Non-volatile memory device and method of fabricating the same Mar. 31, 2009
7501345 Selective silicide formation by electrodeposit displacement reaction Mar. 10, 2009
7491578 Method of forming crack trapping and arrest in thin film structures Feb. 17, 2009
7465654 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures Dec. 16, 2008
7459380 Dislocation-specific dielectric mask deposition and lateral epitaxial overgrowth to reduce dislocation density of nitride films Dec. 2, 2008
7439198 Method for fabricating a buried metallic layer in a semiconductor body and semiconductor component having a buried metallic layer Oct. 21, 2008
7439170 Design structure for final via designs for chip stress reduction Oct. 21, 2008
7416976 Method of forming contacts using auxiliary structures Aug. 26, 2008
7413971 Method of producing a layered arrangement and layered arrangement Aug. 19, 2008
7407888 Semiconductor device and a fabrication process thereof Aug. 5, 2008
7405154 Structure and method of forming electrodeposited contacts Jul. 29, 2008
7405156 Method of forming wiring pattern Jul. 29, 2008
7381634 Integrated circuit system for bonding Jun. 3, 2008
7358175 Serial thermal processor arrangement Apr. 15, 2008
7348272 Method of fabricating interconnect Mar. 25, 2008
7338889 Method of improving copper interconnects of semiconductor devices for bonding Mar. 4, 2008
7335596 Method for fabricating copper-based interconnections for semiconductor device Feb. 26, 2008
7291558 Copper interconnect wiring and method of forming thereof Nov. 6, 2007
7265046 Method of making a solder ball Sep. 4, 2007
7232773 Liquid drop jetting apparatus using charged beam and method for manufacturing a pattern using the apparatus Jun. 19, 2007
7138335 Method of forming electrode for flat display panel Nov. 21, 2006
6265731 Ohmic contacts for p-type wide bandgap II-VI semiconductor materials Jul. 24, 2001
5783459 Method for fabricating a semiconductor device Jul. 21, 1998

1 2 3 4 5










 
 
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