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Class Information
Number: 257/E21.476
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo)
Description: This subclass is indented under subclass E21.459. This subclass is substantially the same in scope as ECLA classification H01L21/44.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.477 Deposition of conductive or insulating materials for electrode (epo) 71
257/E21.481 Including application of mechanical vibration, e.g., ultrasonic vibration (epo) 6
257/E21.48 Involving application of pressure, e.g., thermo compression bonding (epo) 32


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7964499 Methods of forming semiconductor solar cells having front surface electrodes Jun. 21, 2011
7964973 Chip structure Jun. 21, 2011
7960036 Semiconductor structure and method of manufacturing same Jun. 14, 2011
7960272 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging Jun. 14, 2011
7955967 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias Jun. 7, 2011
7947593 Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure May. 24, 2011
7943516 Manufacturing method for semiconductor device May. 17, 2011
7935629 Semiconductor scheme for reduced circuit area in a simplified process May. 3, 2011
7928569 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture Apr. 19, 2011
7927996 Tungsten-doped indium oxide structures and methods Apr. 19, 2011
7927995 Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application Apr. 19, 2011
7919868 Carrier substrate and integrated circuit Apr. 5, 2011
7915127 Manufacturing method of semiconductor device Mar. 29, 2011
7902062 Electrodepositing a metal in integrated circuit applications Mar. 8, 2011
7888271 Method of manufacturing silicon nano-structure Feb. 15, 2011
7879715 Methods of forming electronic structures including conductive shunt layers and related structures Feb. 1, 2011
7875554 Method for electroless depositing a material on a surface of a wafer Jan. 25, 2011
7867888 Flip-chip package substrate and a method for fabricating the same Jan. 11, 2011
7868441 Package on-package secure module having BGA mesh cap Jan. 11, 2011
7863744 Semiconductor device and method for manufacturing same Jan. 4, 2011
7858519 Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer Dec. 28, 2010
7859109 Gallium nitride-based III-V group compound semiconductor device and method of manufacturing the same Dec. 28, 2010
7855156 Method of and apparatus for inline deposition of materials on a non-planar surface Dec. 21, 2010
7851235 Test element group for monitoring leakage current in semiconductor device and method of manufacturing the same Dec. 14, 2010
7851360 Organometallic precursors for seed/barrier processes and methods thereof Dec. 14, 2010
7851779 Medium for use in data storage, thermal energy storage and other applications, with functional layer made of different materials Dec. 14, 2010
7846838 Method for producing an electronic component Dec. 7, 2010
7838880 Flat panel display device Nov. 23, 2010
7838423 Method of forming capping structures on one or more material layer surfaces Nov. 23, 2010
7838418 Spray dispensing method for applying liquid metal Nov. 23, 2010
7833847 Method of forming semiconductor device having stacked transistors Nov. 16, 2010
7834453 Contact structure having a compliant bump and a test pad Nov. 16, 2010
7829451 Conductive ball mounting method and apparatus having a movable solder ball container Nov. 9, 2010
7829473 Method for manufacturing memory element Nov. 9, 2010
7821130 Module including a rough solder joint Oct. 26, 2010
7799683 Copper interconnect wiring and method and apparatus for forming thereof Sep. 21, 2010
7795054 Vertical structure LED device and method of manufacturing the same Sep. 14, 2010
7790596 Apparatus and method for semiconductor wafer bumping via injection molded solder Sep. 7, 2010
7790597 Solder cap application process on copper bump using solder powder film Sep. 7, 2010
7790611 Method for FEOL and BEOL wiring Sep. 7, 2010
7790624 Methods for removing a metal-comprising material from a semiconductor substrate Sep. 7, 2010
7786001 Electrical interconnect structure and method Aug. 31, 2010
7772699 Semiconductor device and method of manufacturing the same Aug. 10, 2010
7759776 Space transformer having multi-layer pad structures Jul. 20, 2010
7759157 Gate oxide film structure for a solid state image pick-up device Jul. 20, 2010
7759240 Use of palladium in IC manufacturing with conductive polymer bump Jul. 20, 2010
7745345 ZnO based semiconductor device manufacture method Jun. 29, 2010
7741204 Mixed-scale electronic interfaces Jun. 22, 2010
7741219 Method for manufacturing a semiconductor device using the self aligned contact (SAC) process flow for semiconductor devices with aluminum metal gates Jun. 22, 2010
7732329 Method and apparatus for workpiece surface modification for selective material deposition Jun. 8, 2010

1 2 3 4 5










 
 
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